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Phase-Field Model of Silicon Carbide Growth During Isothermal Condition
Authors:
Elias J. Munoz,
Vahid Attari,
Marco Martinez,
Matthew B. Dickerson,
Miladin Radovic,
Raymundo Arroyave
Abstract:
Silicon carbide (SiC) emerges as a promising ceramic material for high-temperature structural applications, especially within the aerospace sector. The utilization of SiC-based ceramic matrix composites (CMCs) instead of superalloys in components like engine shrouds, combustors, and nozzles offers notable advantages, including a 25% improvement in fuel efficiency, over 10% enhanced thrust, and the…
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Silicon carbide (SiC) emerges as a promising ceramic material for high-temperature structural applications, especially within the aerospace sector. The utilization of SiC-based ceramic matrix composites (CMCs) instead of superalloys in components like engine shrouds, combustors, and nozzles offers notable advantages, including a 25% improvement in fuel efficiency, over 10% enhanced thrust, and the capability to withstand up to 500$^{\circ}$C higher operating temperatures. Employing a CALPHAD-reinforced multi-phase-field model, our study delves into the evolution of the SiC layer under isothermal solidification conditions. By modeling the growth of SiC between liquid Si and solid C at 1450$^{\circ}$C, we compared results with experimental microstructures and quantitatively examined the evolution of SiC thickness over time. Efficient sampling across the entire model space mitigated uncertainty in high-temperature kinetic parameters, allowing us to predict a range of growth rates and morphologies for the SiC layer. The model accounts for parameter uncertainty stemming from limited experimental knowledge and successfully predicts relevant morphologies for the system. Experimental results validated the kinetic parameters of the simulations, offering valuable insights and potential constraints on the reaction kinetics. We further explored the significance of multi-phase-field model parameters on two key outputs, and found that the diffusion coefficient of liquid Si emerges as the most crucial parameter significantly impacting the SiC average layer thickness and grain count over time. This study provides valuable insights into the microstructure evolution of the Si-C binary system, offering pertinent information for the engineering of CMCs in industrial applications.
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Submitted 9 November, 2023;
originally announced November 2023.
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Uncertainty Propagation in a Multiscale CALPHAD-Reinforced Elastochemical Phase-field Model
Authors:
Vahid Attari,
Pejman Honarmandi,
Thien Duong,
Daniel J Sauceda,
Douglas Allaire,
Raymundo Arroyave
Abstract:
ICME approaches provide decision support for materials design by establishing quantitative process-structure-property relations. Confidence in the decision support, however, must be achieved by establishing uncertainty bounds in ICME model chains. The quantification and propagation of uncertainty in computational materials science, however, remains a rather unexplored aspect of computational mater…
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ICME approaches provide decision support for materials design by establishing quantitative process-structure-property relations. Confidence in the decision support, however, must be achieved by establishing uncertainty bounds in ICME model chains. The quantification and propagation of uncertainty in computational materials science, however, remains a rather unexplored aspect of computational materials science approaches. Moreover, traditional uncertainty propagation frameworks tend to be limited in cases with computationally expensive simulations. A rather common and important model chain is that of CALPHAD-based thermodynamic models of phase stability coupled to phase field models for microstructure evolution. Propagation of uncertainty in these cases is challenging not only due to the sheer computational cost of the simulations but also because of the high dimensionality of the input space. In this work, we present a framework for the quantification and propagation of uncertainty in a CALPHAD-based elasto-chemical phase field model. We motivate our work by investigating the microstructure evolution in Mg$_2$(Si$_x$Sn$_{1-x}$) thermoelectric materials. We first carry out a Markov Chain Monte Carlo-based inference of the CALPHAD model parameters for this pseudobinary system and then use advanced sampling schemes to propagate uncertainties across a high-dimensional simulation input space. Through high-throughput phase field simulations we generate 200,000 time series of synthetic microstructures and use machine learning approaches to understand the effects of propagated uncertainties on the microstructure landscape of the system under study. The microstructure dataset has been curated in the Open Phase-field Microstructure Database (OPMD), available at \href{http://microstructures.net}{http://microstructures.net}.
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Submitted 1 August, 2019;
originally announced August 2019.
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Finite Interface Dissipation Phase Field Modeling of Ni-Nb under Additive Manufacturing Conditions
Authors:
Kubra Karayagiz,
Luke Johnson,
Raiyan Seede,
Vahid Attari,
Bing Zhang,
Xueqin Huang,
Supriyo Ghosh,
Thien Duong,
Ibrahim Karaman,
Alaa Elwany,
Raymundo Arroyave
Abstract:
During the laser powder bed fusion (L-PBF) process, the built part undergoes multiple rapid heating-cooling cycles, leading to complex microstructures with nonuniform properties. In the present work, a computational framework, which weakly couples a finite element thermal model to a non-equilibrium PF model was developed to investigate the rapid solidification microstructure of a Ni-Nb alloy durin…
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During the laser powder bed fusion (L-PBF) process, the built part undergoes multiple rapid heating-cooling cycles, leading to complex microstructures with nonuniform properties. In the present work, a computational framework, which weakly couples a finite element thermal model to a non-equilibrium PF model was developed to investigate the rapid solidification microstructure of a Ni-Nb alloy during L-PBF. The framework is utilized to predict the spatial variation of the morphology and size of cellular segregation structure as well as the microsegregation in single-track melt pool microstructures obtained under different process conditions. A solidification map demonstrating the variation of microstructural features as a function of the temperature gradient and growth rate is presented. A planar to cellular transition is predicted in the majority of keyhole mode melt pools, while a planar interface is predominant in conduction mode melt pools. The predicted morphology and size of the cellular segregation structure agrees well with experimental measurements.
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Submitted 19 February, 2020; v1 submitted 24 June, 2019;
originally announced June 2019.
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Electromigration Response of Microjoints in 3DIC Packaging Systems
Authors:
Vahid Attari,
Thien Duong,
Raymundo Arroyave
Abstract:
In multilevel 3D integrated packaging, three major microstructures are viable due to the application of low volume of solders in different sizes, and/or processing conditions. Thermodynamics and kinetics of binary compounds in Cu/Sn/Cu low volume interconnection is taken into account. We show that current crowding effects can induce a driving force to cause excess vacancies saturate and ultimately…
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In multilevel 3D integrated packaging, three major microstructures are viable due to the application of low volume of solders in different sizes, and/or processing conditions. Thermodynamics and kinetics of binary compounds in Cu/Sn/Cu low volume interconnection is taken into account. We show that current crowding effects can induce a driving force to cause excess vacancies saturate and ultimately cluster in the form of microvoids. A kinetic analysis is performed for electromigration mediated intermetallic growth using multi-phase-field approach. Faster growth of intermetallic compounds (IMCs) in anode layer in the expense of shrinkage of cathode IMC layer in shown. This work paves the road for computationally study the ductile failure due to formation of microvoids in low volume solder interconnects in 3DICs.
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Submitted 23 May, 2019;
originally announced May 2019.
