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Elastic Strain Fields In Lateral Double Ge/Si Quantum Dots
Authors:
Yu. N. Morokov,
M. P. Fedoruk
Abstract:
Simulations of the elastic strain fields for double Ge/Si quantum dots located on the same wetting layer are carried out. The cluster approximation is used for the atomistic model based on the Keating potential. The spatial distributions of the strain energy density and electron potential energy are calculated using clusters containing atoms of 150 coordination spheres. It is shown that the used c…
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Simulations of the elastic strain fields for double Ge/Si quantum dots located on the same wetting layer are carried out. The cluster approximation is used for the atomistic model based on the Keating potential. The spatial distributions of the strain energy density and electron potential energy are calculated using clusters containing atoms of 150 coordination spheres. It is shown that the used cluster boundary conditions are close to the periodic boundary conditions.
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Submitted 23 January, 2017;
originally announced January 2017.
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Calculation of Elastic Strain Fields for Single Ge/Si Quantum Dots
Authors:
Yu. N. Morokov,
M. P. Fedoruk
Abstract:
An atomistic model based on the Keating potential and the conjugate gradient method are used for simulation of the strain fields for single Ge/Si quantum dots. Calculations are performed in the cluster approximation using clusters containing about three million atoms belonging to 150 coordination spheres. The spatial distributions of the strain energy density and electron potential energy are calc…
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An atomistic model based on the Keating potential and the conjugate gradient method are used for simulation of the strain fields for single Ge/Si quantum dots. Calculations are performed in the cluster approximation using clusters containing about three million atoms belonging to 150 coordination spheres. The spatial distributions of the strain energy density and electron potential energy are calculated for different valleys forming the bottom of the silicon conduction band. It is shown that the strain field in silicon decreases sufficiently rapidly with distance from the center of the quantum dot, so the influence of the cluster boundary is observed only for very large quantum dots.
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Submitted 18 January, 2016;
originally announced January 2016.
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Structures with Vertically Stacked Ge/Si Quantum Dots for Logical Operations
Authors:
Yu. N. Morokov,
M. P. Fedoruk,
A. V. Dvurechenskii,
A. F. Zinov'eva,
A. V. Nenashev
Abstract:
Ge/Si structures with vertically stacked quantum dots are simulated to implement the basic elements of a quantum computer for operation with electron spin states. Elastic-strain fields are simulated using the conjugate gradient method and an atomistic model based on the Keating potential. Calculations are performed in the cluster approximation using clusters containing about three million atoms be…
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Ge/Si structures with vertically stacked quantum dots are simulated to implement the basic elements of a quantum computer for operation with electron spin states. Elastic-strain fields are simulated using the conjugate gradient method and an atomistic model based on the Keating potential. Calculations are performed in the cluster approximation using clusters containing about three million atoms belonging to 150 coordination spheres. The spatial distributions of the strain energy density and electron potential energy are calculated for different valleys forming the bottom of the silicon conduction band. It is shown that the development of multilayer structures with vertically stacked quantum dots makes it possible to fabricate deep potential wells for electrons with vertical tunnel coupling.
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Submitted 4 January, 2016;
originally announced January 2016.
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Memory Effect in Silicon Nitride in Silicon Devices
Authors:
V. A. Gritsenko,
Yu. N. Morokov,
Yu. N. Novikov,
J. B. Xu
Abstract:
The dominant dielectric used currently in silicon devices is silicon oxide. Its application for future devices will be impeded by several fundamental limitations which lead to low reliability of semiconductor devices and to the necessity of alternative dielectrics. Amorphous silicon nitride and oxynitride are considered now as alternative to silicon oxide in future devices. One of the unique pro…
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The dominant dielectric used currently in silicon devices is silicon oxide. Its application for future devices will be impeded by several fundamental limitations which lead to low reliability of semiconductor devices and to the necessity of alternative dielectrics. Amorphous silicon nitride and oxynitride are considered now as alternative to silicon oxide in future devices. One of the unique property of amorphous silicon nitride is the electron and hole capture by the deep traps with extremely long life time (10 years) in the captured state (the memory effect). This property is employed in memory devices and microprocessors in computers. Despite numerous efforts the nature of traps responsible for the memory effect in this material is so far unclear. In this paper we discuss the nature of such traps using the quantum-chemical simulation. The calculations show that the defects responsible for the electron and hole capture in amorphous silicon nitride can be the Si-Si defects created by excess silicon atoms.
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Submitted 25 November, 2000;
originally announced November 2000.
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Nature of traps responsible for failure of MOS devices
Authors:
V. A. Gritsenko,
P. M. Lenahan,
Yu. N. Morokov,
Yu. N. Novikov
Abstract:
A failure of chips in a huge amount of modern electronic devices is connected as a rule with the undesirable capturing of charge (electrons and holes) by traps in a thin insulating film of silicon oxide in transistors. It leads to a breakdown of transistors or to a destructive change of their characteristics. It is suggested that silicon oxide will be replaced in the next generation of nanoscale…
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A failure of chips in a huge amount of modern electronic devices is connected as a rule with the undesirable capturing of charge (electrons and holes) by traps in a thin insulating film of silicon oxide in transistors. It leads to a breakdown of transistors or to a destructive change of their characteristics. It is suggested that silicon oxide will be replaced in the next generation of nanoscale devices by silicon oxynitride. Therefore, it is very important to understand the nature of traps in this material. We discuss this nature using the quantum-chemical simulation.
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Submitted 14 November, 2000;
originally announced November 2000.
