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Condensed Matter > Materials Science

arXiv:2402.15342 (cond-mat)
[Submitted on 23 Feb 2024]

Title:Ab-initio insights into the mechanical, phonon, bonding, electronic, optical and thermal properties of hexagonal W2N3 for potential applications

Authors:Istiak Ahmed, F. Parvin, R. S. Islam, S. H. Naqib
View a PDF of the paper titled Ab-initio insights into the mechanical, phonon, bonding, electronic, optical and thermal properties of hexagonal W2N3 for potential applications, by Istiak Ahmed and 3 other authors
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Abstract:We investigated the structural, elastic, electronic, vibrational, optical, thermodynamic and a number of thermophysical properties of W2N3 in this study using DFT based formalisms. The mechanical and dynamical stabilities have been confirmed. The Pugh and Poisson ratios are located quite close to the brittle to ductile borderline. The electronic band structure and energy density of states show metallic behavior. The Fermi surface features are investigated. The analysis of charge density distribution map clearly shows that W atoms have comparatively high electron density around than the N atoms. Presence of covalent bondings are anticipated. High melting temperature and high phonon thermal conductivity at room temperature of W2N3 imply that the compound has potential to be used as a heat sink system. The optical characteristics demonstrate anisotropy for W2N3. The compound can be used in optoelectronic device applications due to its high absorption coefficient and low reflectivity in the visible to ultraviolet spectrum. Furthermore, the quasiharmonic Debye model is used to examine temperature and pressure dependent thermal characteristics for the first time.
Comments: Submitted to Journal of Alloys and Compounds
Subjects: Materials Science (cond-mat.mtrl-sci)
Cite as: arXiv:2402.15342 [cond-mat.mtrl-sci]
  (or arXiv:2402.15342v1 [cond-mat.mtrl-sci] for this version)
  https://doi.org/10.48550/arXiv.2402.15342
arXiv-issued DOI via DataCite

Submission history

From: Saleh Naqib [view email]
[v1] Fri, 23 Feb 2024 14:22:46 UTC (2,045 KB)
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