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Condensed Matter > Mesoscale and Nanoscale Physics

arXiv:2311.10460 (cond-mat)
[Submitted on 17 Nov 2023]

Title:Enhancement of spin to charge conversion efficiency at the topological surface state by inserting normal metal spacer layer in the topological insulator based heterostructure

Authors:Sayani Pal, Anuvab Nandi, Shambhu G. Nath, Pratap Kumar Pal, Kanav Sharma, Subhadip Manna, Anjan Barman, Chiranjib Mitra
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Abstract:We report efficient spin to charge conversion (SCC) in the topological insulator (TI) based heterostructure ($BiSbTe_{1.5}Se_{1.5}/Cu/Ni_{80}Fe_{20}$) by using spin-pumping technique where $BiSbTe_{1.5}Se_{1.5}$ is the TI and $Ni_{80}Fe_{20}$ is the ferromagnetic layer. The SCC, characterized by inverse Edelstein effect length ($\lambda_{IEE}$) in the TI material gets altered with an intervening Copper (Cu) layer and it depends on the interlayer thickness. The introduction of Cu layer at the interface of TI and ferromagnetic metal (FM) provides a new degree of freedom for tuning the SCC efficiency of the topological surface states. The significant enhancement of the measured spin-pumping voltage and the linewidth of ferromagnetic resonance (FMR) absorption spectra due to the insertion of Cu layer at the interface indicates a reduction in spin memory loss at the interface that resulted from the presence of exchange coupling between the surface states of TI and the local moments of ferromagnetic metal. The temperature dependence (from 8K to 300K) of the evaluated $\lambda_{IEE}$ data for all the trilayer systems, TI/Cu/FM with different Cu thickness confirms the effect of exchange coupling between the TI and FM layer on the spin to charge conversion efficiency of the topological surface state.
Subjects: Mesoscale and Nanoscale Physics (cond-mat.mes-hall)
Cite as: arXiv:2311.10460 [cond-mat.mes-hall]
  (or arXiv:2311.10460v1 [cond-mat.mes-hall] for this version)
  https://doi.org/10.48550/arXiv.2311.10460

Submission history

From: Chiranjib Mitra Dr [view email]
[v1] Fri, 17 Nov 2023 11:30:00 UTC (1,457 KB)
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