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Electrical Engineering and Systems Science > Systems and Control

arXiv:2310.03577 (eess)
[Submitted on 5 Oct 2023]

Title:Liquid Cooling System for a High Power, Medium Frequency, and Medium Voltage Isolated Power Converter

Authors:Hooman Taghavi, Ahmad El Shafei, Adel Nasiri
View a PDF of the paper titled Liquid Cooling System for a High Power, Medium Frequency, and Medium Voltage Isolated Power Converter, by Hooman Taghavi and 2 other authors
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Abstract:Power electronics systems, widely used in various applications such as industrial automation, electric cars, and renewable energy, have the primary function of converting and controlling electrical power to the desired type of load. Despite their reliability and efficiency, power losses in these systems generate significant heat that must be dissipated to maintain performance and prevent damage. Cooling systems play a crucial role in ensuring safe operating temperatures for system components. Air and liquid cooling are the leading technologies used in the power electronics world. Air cooling is simple and cost-effective but is limited by ambient temperature and component thermal resistance. While more efficient, liquid cooling requires more maintenance and has higher upfront costs. Water-cooling systems have become famous for regulating thermal loads as they can effectively remove heat from localized high-temperature areas, such as the challenging hotspots in power electronics systems. In addition to designing a cooling system for a power electronic system, this study investigated the impact of three major parameters; cold plate material, channel shape/size, and coolant inlet velocity. The research examined and analyzed these factors and their trade-off analysis to obtain cooling system design and optimization insights. This study might improve power electronics system performance, reliability, and durability by improving heat dissipation and thermal management.
Subjects: Systems and Control (eess.SY)
Cite as: arXiv:2310.03577 [eess.SY]
  (or arXiv:2310.03577v1 [eess.SY] for this version)
  https://doi.org/10.48550/arXiv.2310.03577
arXiv-issued DOI via DataCite

Submission history

From: Hooman Taghavi [view email]
[v1] Thu, 5 Oct 2023 14:58:49 UTC (664 KB)
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