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Condensed Matter > Materials Science

arXiv:2302.08978 (cond-mat)
[Submitted on 14 Feb 2023]

Title:MICROSTRUCTURE OF Glidcop AL-60

Authors:Yan Xin, Jun Lu, Ke Han
View a PDF of the paper titled MICROSTRUCTURE OF Glidcop AL-60, by Yan Xin and 2 other authors
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Abstract:Glidcop is an oxide-particle-dispersion strengthened copper composite that has a combination of high mechanical strength and high electrical conductivity. It has been used as a conductor for 100 T ultrahigh field pulsed magnets by the National High Magnetic Field Laboratory, USA. In the quest for even higher field pulsed magnets, material development is crucial. Since the mechanical properties of a material are often determined by its micro-structure, full characterization of the microstructure of Glidcop is necessary. In this work, we studied the microstructure of Glidcop AL-60 using both transmission electron microscopy (TEM) and scanning transmission electron microscopy (STEM). We identified both alpha-Al2O3 and cubic eta-Al2O3 nanoparticles in AL-60 and investigated their size and density distribution. The small alumina particles eta-Al2O3 nanoparticles with typical size of 5 to 30 nm are of triangular shape. They have had well defined crystal orientation relation-ship with the Cu matrix. We observed dislocations pinned by the alumina nanoparticles in cold-drawn wires. We believed that dislocation bypassing alumina particles via Orowan looping was the main strengthening mechanism. We observed microcracks near large particles, demonstrating the detrimental effect of large particles in AL-60.
Comments: 4 pages, 5 figures
Subjects: Materials Science (cond-mat.mtrl-sci)
Cite as: arXiv:2302.08978 [cond-mat.mtrl-sci]
  (or arXiv:2302.08978v1 [cond-mat.mtrl-sci] for this version)
  https://doi.org/10.48550/arXiv.2302.08978
arXiv-issued DOI via DataCite
Journal reference: IEEE transactions on Applied Superconductivity, 2022
Related DOI: https://doi.org/10.1109/TASC.2022.3159498
DOI(s) linking to related resources

Submission history

From: Jun Lu [view email]
[v1] Tue, 14 Feb 2023 00:01:00 UTC (2,266 KB)
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