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Condensed Matter > Mesoscale and Nanoscale Physics

arXiv:1910.09448 (cond-mat)
[Submitted on 21 Oct 2019 (v1), last revised 10 Aug 2020 (this version, v4)]

Title:Dynamic thermal relaxation in metallic films at sub-kelvin temperatures

Authors:L. B. Wang, D. S. Golubev, Y. M. Galperin, J. P. Pekola
View a PDF of the paper titled Dynamic thermal relaxation in metallic films at sub-kelvin temperatures, by L. B. Wang and 3 other authors
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Abstract:The performance of low temperature detectors utilizing thermal effects is determined by their energy relaxation properties. Usually, heat transport experiments in mesoscopic structures are carried out in the steady-state, where temperature gradients do not change in time. Here, we present an experimental study of dynamic thermal relaxation in a mesoscopic system -- thin metallic film. We find that the thermal relaxation of hot electrons in copper and silver films is characterized by several time constants, and that the annealing of the films changes them. In most cases, two time constants are observed, and we can model the system by introducing an additional thermal reservoir coupled to the film electrons. We determine the specific heat of this reservoir and its coupling to the electrons. The experiments point at the importance of grain structure on the thermal relaxation of electrons in metallic films.
Comments: 9 pages, 10 figures
Subjects: Mesoscale and Nanoscale Physics (cond-mat.mes-hall)
Cite as: arXiv:1910.09448 [cond-mat.mes-hall]
  (or arXiv:1910.09448v4 [cond-mat.mes-hall] for this version)
  https://doi.org/10.48550/arXiv.1910.09448
arXiv-issued DOI via DataCite

Submission history

From: Libin Wang [view email]
[v1] Mon, 21 Oct 2019 15:26:09 UTC (5,571 KB)
[v2] Fri, 28 Feb 2020 10:23:46 UTC (4,410 KB)
[v3] Wed, 13 May 2020 09:00:52 UTC (4,411 KB)
[v4] Mon, 10 Aug 2020 10:28:56 UTC (7,883 KB)
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