Title:Cooling Codes: Thermal-Management Coding for~High-Performance Interconnects

Abstract:High temperatures have dramatic negative effects~on interconnect performance and, hence, numerous techniques have been proposed to reduce the power consumption of on-chip buses. However, existing methods fall short of fully addressing the thermal challenges posed by high-performance interconnects. In this paper, we introduce new efficient coding schemes that make it possible to directly control the peak temperature of a bus by effectively cooling its hottest wires. This is achieved by avoiding state transitions on the hottest wires for as long as necessary until their temperature drops off. At the same time, we reduce the average power consumption by making sure that the total number of state transitions on all the wires is below a prescribed threshold. These two features are obtained separately or simultaneously. In addition, error-correction for the transmitted information can also be provided with each one of the two features and when they both obtained simultaneously.
Our solutions call for some redundancy: we use $n > k$ wires to encode a given $k$-bit bus. Therefore, it is important to determine theoretically the minimum possible number of wires $n$ needed to encode $k$ bits while satisfying the desired properties. We provide full theoretical analysis in each case, and show that the number of additional wires required to cool the $t$ hottest wires becomes negligible when $k$ is large. Moreover, although the proposed thermal-management techniques make use of sophisticated tools from combinatorics, discrete geometry, linear algebra, and coding theory, the resulting encoders and decoders are fully practical. They do not require significant computational overhead and can be implemented without sacrificing a large circuit area.