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Computer Science > Hardware Architecture

arXiv:1402.2425 (cs)
[Submitted on 11 Feb 2014]

Title:Triple Patterning Lithography (TPL) Layout Decomposition using End-Cutting

Authors:Bei Yu, Jhih-Rong Gao, David Z. Pan
View a PDF of the paper titled Triple Patterning Lithography (TPL) Layout Decomposition using End-Cutting, by Bei Yu and Jhih-Rong Gao and David Z. Pan
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Abstract:Triple patterning lithography (TPL) is one of the most promising techniques in the 14nm logic node and beyond. However, traditional LELELE type TPL technology suffers from native conflict and overlapping problems. Recently LELEEC process was proposed to overcome the limitations, where the third mask is used to generate the end-cuts. In this paper we propose the first study for LELEEC layout decomposition. Conflict graphs and end-cut graphs are constructed to extract all the geometrical relationships of input layout and end-cut candidates. Based on these graphs, integer linear programming (ILP) is formulated to minimize the conflict number and the stitch number.
Subjects: Hardware Architecture (cs.AR)
Cite as: arXiv:1402.2425 [cs.AR]
  (or arXiv:1402.2425v1 [cs.AR] for this version)
  https://doi.org/10.48550/arXiv.1402.2425
arXiv-issued DOI via DataCite
Related DOI: https://doi.org/10.1117/12.2011355
DOI(s) linking to related resources

Submission history

From: Bei Yu [view email]
[v1] Tue, 11 Feb 2014 10:26:20 UTC (463 KB)
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