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Physics > General Physics

arXiv:0801.0894 (physics)
[Submitted on 7 Jan 2008]

Title:Investigation of Micro Porosity Sintered wick in Vapor Chamber for Fan Less Design

Authors:C. S. Yu, W. C. Wei, S. W. Kang
View a PDF of the paper titled Investigation of Micro Porosity Sintered wick in Vapor Chamber for Fan Less Design, by C. S. Yu and 2 other authors
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Abstract: Micro Porosity Sintered wick is made from metal injection molding processes, which provides a wick density with micro scale. It can keep more than 53 % working fluid inside the wick structure, and presents good pumping ability on working fluid transmission by fine infiltrated effect. Capillary pumping ability is the important factor in heat pipe design, and those general applications on wick structure are manufactured with groove type or screen type. Gravity affects capillary of these two types more than a sintered wick structure does, and mass heat transfer through vaporized working fluid determines the thermal performance of a vapor chamber. First of all, high density of porous wick supports high transmission ability of working fluid. The wick porosity is sintered in micro scale, which limits the bubble size while working fluid vaporizing on vapor section. Maximum heat transfer capacity increases dramatically as thermal resistance of wick decreases. This study on permeability design of wick structure is 0.5 - 0.7, especially permeability (R) = 0.5 can have the best performance, and its heat conductivity is 20 times to a heat pipe with diameter (Phi) = 10mm. Test data of this vapor chamber shows thermal performance increases over 33 %.
Comments: Submitted on behalf of TIMA Editions (this http URL)
Subjects: General Physics (physics.gen-ph)
Cite as: arXiv:0801.0894 [physics.gen-ph]
  (or arXiv:0801.0894v1 [physics.gen-ph] for this version)
  https://doi.org/10.48550/arXiv.0801.0894
arXiv-issued DOI via DataCite
Journal reference: Dans 13th International Worshop on THERMal INvestigations of ICs and Systems - THERMINIC 2007, Budapest : Hongrie (2007)

Submission history

From: EDA Publishing Association [view email] [via CCSD proxy]
[v1] Mon, 7 Jan 2008 16:41:09 UTC (251 KB)
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