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Fabrication of superconducting through-silicon vias
Authors:
Justin L. Mallek,
Donna-Ruth W. Yost,
Danna Rosenberg,
Jonilyn L. Yoder,
Gregory Calusine,
Matt Cook,
Rabindra Das,
Alexandra Day,
Evan Golden,
David K. Kim,
Jeffery Knecht,
Bethany M. Niedzielski,
Mollie Schwartz,
Arjan Sevi,
Corey Stull,
Wayne Woods,
Andrew J. Kerman,
William D. Oliver
Abstract:
Increasing circuit complexity within quantum systems based on superconducting qubits necessitates high connectivity while retaining qubit coherence. Classical micro-electronic systems have addressed interconnect density challenges by using 3D integration with interposers containing through-silicon vias (TSVs), but extending these integration techniques to superconducting quantum systems is challen…
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Increasing circuit complexity within quantum systems based on superconducting qubits necessitates high connectivity while retaining qubit coherence. Classical micro-electronic systems have addressed interconnect density challenges by using 3D integration with interposers containing through-silicon vias (TSVs), but extending these integration techniques to superconducting quantum systems is challenging. Here, we discuss our approach for realizing high-aspect-ratio superconducting TSVs\textemdash 10 $μ$m wide by 20 $μ$m long by 200 $μ$m deep\textemdash with densities of 100 electrically isolated TSVs per square millimeter. We characterize the DC and microwave performance of superconducting TSVs at cryogenic temperatures and demonstrate superconducting critical currents greater than 20 mA. These high-aspect-ratio, high critical current superconducting TSVs will enable high-density vertical signal routing within superconducting quantum processors.
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Submitted 15 March, 2021;
originally announced March 2021.
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Comparison of Dielectric Loss in Titanium Nitride and Aluminum Superconducting Resonators
Authors:
Alexander Melville,
Greg Calusine,
Wayne Woods,
Kyle Serniak,
Evan Golden,
Bethany M. Niedzielski,
David K. Kim,
Arjan Sevi,
Jonilyn L. Yoder,
Eric A. Dauler,
William D. Oliver
Abstract:
Lossy dielectrics are a significant source of decoherence in superconducting quantum circuits. In this report, we model and compare the dielectric loss in bulk and interfacial dielectrics in titanium nitride (TiN) and aluminum (Al) superconducting coplanar waveguide (CPW) resonators. We fabricate isotropically trenched resonators to produce a series of device geometries that accentuate a specific…
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Lossy dielectrics are a significant source of decoherence in superconducting quantum circuits. In this report, we model and compare the dielectric loss in bulk and interfacial dielectrics in titanium nitride (TiN) and aluminum (Al) superconducting coplanar waveguide (CPW) resonators. We fabricate isotropically trenched resonators to produce a series of device geometries that accentuate a specific dielectric region's contribution to resonator quality factor. While each dielectric region contributes significantly to loss in TiN devices, the metal-air interface dominates the loss in the Al devices. Furthermore, we evaluate the quality factor of each TiN resonator geometry with and without a post-process hydrofluoric (HF) etch, and find that it reduced losses from the substrate-air interface, thereby improving the quality factor.
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Submitted 14 July, 2020;
originally announced July 2020.
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Solid-state qubits integrated with superconducting through-silicon vias
Authors:
Donna-Ruth W. Yost,
Mollie E. Schwartz,
Justin Mallek,
Danna Rosenberg,
Corey Stull,
Jonilyn L. Yoder,
Greg Calusine,
Matt Cook,
Rabindra Das,
Alexandra L. Day,
Evan B. Golden,
David K. Kim,
Alexander Melville,
Bethany M. Niedzielski,
Wayne Woods,
Andrew J. Kerman,
Willam D. Oliver
Abstract:
As superconducting qubit circuits become more complex, addressing a large array of qubits becomes a challenging engineering problem. Dense arrays of qubits benefit from, and may require, access via the third dimension to alleviate interconnect crowding. Through-silicon vias (TSVs) represent a promising approach to three-dimensional (3D) integration in superconducting qubit arrays -- provided they…
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As superconducting qubit circuits become more complex, addressing a large array of qubits becomes a challenging engineering problem. Dense arrays of qubits benefit from, and may require, access via the third dimension to alleviate interconnect crowding. Through-silicon vias (TSVs) represent a promising approach to three-dimensional (3D) integration in superconducting qubit arrays -- provided they are compact enough to support densely-packed qubit systems without compromising qubit performance or low-loss signal and control routing. In this work, we demonstrate the integration of superconducting, high-aspect ratio TSVs -- 10 $μ$m wide by 20 $μ$m long by 200 $μ$m deep -- with superconducting qubits. We utilize TSVs for baseband control and high-fidelity microwave readout of qubits using a two-chip, bump-bonded architecture. We also validate the fabrication of qubits directly upon the surface of a TSV-integrated chip. These key 3D integration milestones pave the way for the control and readout of high-density superconducting qubit arrays using superconducting TSVs.
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Submitted 29 September, 2020; v1 submitted 23 December, 2019;
originally announced December 2019.
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Dynamical dispersion in turbulent plumes
Authors:
Matthew M. Scase,
Andrew W. Woods
Abstract:
Experimental observations of turbulent buoyant plumes, produced by a constant source of buoyancy, have been described with great success using a horizontally averaged model for the conservation of mass, momentum and buoyancy flux. However, experimental observations of plumes with time-dependent buoyancy fluxes has proved more challenging for quantitative models. At each level in the plume, the hor…
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Experimental observations of turbulent buoyant plumes, produced by a constant source of buoyancy, have been described with great success using a horizontally averaged model for the conservation of mass, momentum and buoyancy flux. However, experimental observations of plumes with time-dependent buoyancy fluxes has proved more challenging for quantitative models. At each level in the plume, the horizontal variation in velocity leads to an along-axis shear and hence dispersive transport relative to the mean. With a time-dependent source, axial dispersion of the dynamic properties of the plume has a key role in the evolution of the flow. Using ideas of mixing length theory, we introduce a model for this axial dispersion, and test the model by comparison with experimental observations of plumes in which the buoyancy flux is suddenly decreased or suddenly increased. In both cases, we show the transition from one buoyancy flux to another is self-similar, and using the data, we find the axial dispersion may be expressed as βUb where β lies in the range 0.70-0.88 and U and b are respectively the horizontally averaged vertical velocity and radius of the plume at height z and time t. Our model also reduces to that of a classical plume when the buoyancy flux is steady.
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Submitted 14 December, 2018;
originally announced December 2018.
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Analysis and mitigation of interface losses in trenched superconducting coplanar waveguide resonators
Authors:
Greg Calusine,
Alexander Melville,
Wayne Woods,
Rabindra Das,
Corey Stull,
Vlad Bolkhovsky,
Danielle Braje,
David Hover,
David K. Kim,
Xhovalin Miloshi,
Danna Rosenberg,
Arjan Sevi,
Jonilyn L. Yoder,
Eric A. Dauler,
William D. Oliver
Abstract:
Improving the performance of superconducting qubits and resonators generally results from a combination of materials and fabrication process improvements and design modifications that reduce device sensitivity to residual losses. One instance of this approach is to use trenching into the device substrate in combination with superconductors and dielectrics with low intrinsic losses to improve quali…
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Improving the performance of superconducting qubits and resonators generally results from a combination of materials and fabrication process improvements and design modifications that reduce device sensitivity to residual losses. One instance of this approach is to use trenching into the device substrate in combination with superconductors and dielectrics with low intrinsic losses to improve quality factors and coherence times. Here we demonstrate titanium nitride coplanar waveguide resonators with mean quality factors exceeding two million and controlled trenching reaching 2.2 $μ$m into the silicon substrate. Additionally, we measure sets of resonators with a range of sizes and trench depths and compare these results with finite-element simulations to demonstrate quantitative agreement with a model of interface dielectric loss. We then apply this analysis to determine the extent to which trenching can improve resonator performance.
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Submitted 28 September, 2017;
originally announced September 2017.
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CO$_2$ dissolution in a background hydrological flow
Authors:
H. Juliette T. Unwin,
Garth N. Wells,
Andrew W. Woods
Abstract:
We investigate the long time steady-state dissolution of CO$_{2}$ in a deep saline aqquifer in the presence of a background hydrological flow. In steady-state, the distribution of CO$_2$ in the groundwater upstream of the aquifer involves a balance between three competing effects: (i) the buoyancy-driven flow of CO$_2$ saturated water; (ii) the diffusion of CO$_2$ from saturated to under-saturated…
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We investigate the long time steady-state dissolution of CO$_{2}$ in a deep saline aqquifer in the presence of a background hydrological flow. In steady-state, the distribution of CO$_2$ in the groundwater upstream of the aquifer involves a balance between three competing effects: (i) the buoyancy-driven flow of CO$_2$ saturated water; (ii) the diffusion of CO$_2$ from saturated to under-saturated water; and (iii) the advection associated with the oncoming background flow. This leads to three limiting regimes. In the limit of very slow diffusion, a nearly static intrusion of dense fluid may extend a finite distance upstream, balanced by the pressure gradient associated with the oncoming background flow. In the limit of fast diffusion relative to the flow, a gradient zone may become established in which the along aquifer diffusive flux balances the advection associated with the background flow. However, if the buoyancy-driven flow speed exceeds the background hydrological flow speed, then a third, intermediate regime may become established. In this regime, a convective recirculation develops upstream of the anticline involving the vertical diffusion of CO$_2$ from an upstream propagating flow of dense CO$_2$ saturated water into the downstream propagating flow of CO$_2$ unsaturated water. For each limiting case, we find analytical solutions for the distribution of CO$_2$ upstream of the anticline, and test our analysis with full numerical simulations. A key result is that, although there may be very different controls on the distribution and extent of CO$_2$ bearing water upstream of the anticline, in each case the dissolution rate is given by the product of the background volume flux and the difference in concentration between the CO$_2$ saturated water and the original aquifer water upstream.
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Submitted 16 October, 2015; v1 submitted 14 June, 2015;
originally announced June 2015.
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Femtosecond Diffractive Imaging with a Soft-X-ray Free-Electron Laser
Authors:
Henry N. Chapman,
Anton Barty,
Michael J. Bogan,
Sebastien Boutet,
Matthias Frank,
Stefan P. Hau-Riege,
Stefano Marchesini,
Bruce W. Woods,
Sasa Bajt,
W. Henry Benner,
Richard A. London,
Elke Plonjes,
Marion Kuhlmann,
Rolf Treusch,
Stefan Dusterer,
Thomas Tschentscher,
Jochen R. Schneider,
Eberhard Spiller,
Thomas Moller,
Christoph Bostedt,
Matthias Hoener,
David A. Shapiro,
Keith O. Hodgson,
David van der Spoel,
Florian Burmeister
, et al. (9 additional authors not shown)
Abstract:
Theory predicts that with an ultrashort and extremely bright coherent X-ray pulse, a single diffraction pattern may be recorded from a large macromolecule, a virus, or a cell before the sample explodes and turns into a plasma. Here we report the first experimental demonstration of this principle using the FLASH soft X-ray free-electron laser. An intense 25 fs, 4 10^13 W/cm^2 pulse, containing 10…
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Theory predicts that with an ultrashort and extremely bright coherent X-ray pulse, a single diffraction pattern may be recorded from a large macromolecule, a virus, or a cell before the sample explodes and turns into a plasma. Here we report the first experimental demonstration of this principle using the FLASH soft X-ray free-electron laser. An intense 25 fs, 4 10^13 W/cm^2 pulse, containing 10^12 photons at 32 nm wavelength, produced a coherent diffraction pattern from a nano-structured non-periodic object, before destroying it at 60,000 K. A novel X-ray camera assured single photon detection sensitivity by filtering out parasitic scattering and plasma radiation. The reconstructed image, obtained directly from the coherent pattern by phase retrieval through oversampling, shows no measurable damage, and extends to diffraction-limited resolution. A three-dimensional data set may be assembled from such images when copies of a reproducible sample are exposed to the beam one by one.
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Submitted 10 October, 2006; v1 submitted 7 October, 2006;
originally announced October 2006.