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Fabrication of superconducting through-silicon vias
Authors:
Justin L. Mallek,
Donna-Ruth W. Yost,
Danna Rosenberg,
Jonilyn L. Yoder,
Gregory Calusine,
Matt Cook,
Rabindra Das,
Alexandra Day,
Evan Golden,
David K. Kim,
Jeffery Knecht,
Bethany M. Niedzielski,
Mollie Schwartz,
Arjan Sevi,
Corey Stull,
Wayne Woods,
Andrew J. Kerman,
William D. Oliver
Abstract:
Increasing circuit complexity within quantum systems based on superconducting qubits necessitates high connectivity while retaining qubit coherence. Classical micro-electronic systems have addressed interconnect density challenges by using 3D integration with interposers containing through-silicon vias (TSVs), but extending these integration techniques to superconducting quantum systems is challen…
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Increasing circuit complexity within quantum systems based on superconducting qubits necessitates high connectivity while retaining qubit coherence. Classical micro-electronic systems have addressed interconnect density challenges by using 3D integration with interposers containing through-silicon vias (TSVs), but extending these integration techniques to superconducting quantum systems is challenging. Here, we discuss our approach for realizing high-aspect-ratio superconducting TSVs\textemdash 10 $μ$m wide by 20 $μ$m long by 200 $μ$m deep\textemdash with densities of 100 electrically isolated TSVs per square millimeter. We characterize the DC and microwave performance of superconducting TSVs at cryogenic temperatures and demonstrate superconducting critical currents greater than 20 mA. These high-aspect-ratio, high critical current superconducting TSVs will enable high-density vertical signal routing within superconducting quantum processors.
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Submitted 15 March, 2021;
originally announced March 2021.
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Comparison of Dielectric Loss in Titanium Nitride and Aluminum Superconducting Resonators
Authors:
Alexander Melville,
Greg Calusine,
Wayne Woods,
Kyle Serniak,
Evan Golden,
Bethany M. Niedzielski,
David K. Kim,
Arjan Sevi,
Jonilyn L. Yoder,
Eric A. Dauler,
William D. Oliver
Abstract:
Lossy dielectrics are a significant source of decoherence in superconducting quantum circuits. In this report, we model and compare the dielectric loss in bulk and interfacial dielectrics in titanium nitride (TiN) and aluminum (Al) superconducting coplanar waveguide (CPW) resonators. We fabricate isotropically trenched resonators to produce a series of device geometries that accentuate a specific…
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Lossy dielectrics are a significant source of decoherence in superconducting quantum circuits. In this report, we model and compare the dielectric loss in bulk and interfacial dielectrics in titanium nitride (TiN) and aluminum (Al) superconducting coplanar waveguide (CPW) resonators. We fabricate isotropically trenched resonators to produce a series of device geometries that accentuate a specific dielectric region's contribution to resonator quality factor. While each dielectric region contributes significantly to loss in TiN devices, the metal-air interface dominates the loss in the Al devices. Furthermore, we evaluate the quality factor of each TiN resonator geometry with and without a post-process hydrofluoric (HF) etch, and find that it reduced losses from the substrate-air interface, thereby improving the quality factor.
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Submitted 14 July, 2020;
originally announced July 2020.
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Analysis and mitigation of interface losses in trenched superconducting coplanar waveguide resonators
Authors:
Greg Calusine,
Alexander Melville,
Wayne Woods,
Rabindra Das,
Corey Stull,
Vlad Bolkhovsky,
Danielle Braje,
David Hover,
David K. Kim,
Xhovalin Miloshi,
Danna Rosenberg,
Arjan Sevi,
Jonilyn L. Yoder,
Eric A. Dauler,
William D. Oliver
Abstract:
Improving the performance of superconducting qubits and resonators generally results from a combination of materials and fabrication process improvements and design modifications that reduce device sensitivity to residual losses. One instance of this approach is to use trenching into the device substrate in combination with superconductors and dielectrics with low intrinsic losses to improve quali…
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Improving the performance of superconducting qubits and resonators generally results from a combination of materials and fabrication process improvements and design modifications that reduce device sensitivity to residual losses. One instance of this approach is to use trenching into the device substrate in combination with superconductors and dielectrics with low intrinsic losses to improve quality factors and coherence times. Here we demonstrate titanium nitride coplanar waveguide resonators with mean quality factors exceeding two million and controlled trenching reaching 2.2 $μ$m into the silicon substrate. Additionally, we measure sets of resonators with a range of sizes and trench depths and compare these results with finite-element simulations to demonstrate quantitative agreement with a model of interface dielectric loss. We then apply this analysis to determine the extent to which trenching can improve resonator performance.
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Submitted 28 September, 2017;
originally announced September 2017.
