Showing 1–1 of 1 results for author: Raja, S N

Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices

Authors: Valentin Dubois, Shyamprasad N. Raja, Pascal Gehring, Sabina Caneva, Herre S. J. van der Zant, Frank Niklaus, Göran Stemme

Abstract: Break junctions provide tip-shaped contact electrodes that are fundamental components of nano and molecular electronics. However, the fabrication of break junctions remains notoriously time-consuming and difficult to parallelize. Here we demonstrate true parallel fabrication of gold break junctions featuring sub-3 nm gaps on the wafer-scale, by relying on a novel self-breaking mechanism based on c… ▽ More Break junctions provide tip-shaped contact electrodes that are fundamental components of nano and molecular electronics. However, the fabrication of break junctions remains notoriously time-consuming and difficult to parallelize. Here we demonstrate true parallel fabrication of gold break junctions featuring sub-3 nm gaps on the wafer-scale, by relying on a novel self-breaking mechanism based on controlled crack formation in notched bridge structures. We achieve fabrication densities as high as 7 million junctions per cm$^{2}$, with fabrication yields of around 7% for obtaining crack-defined break junctions with sub-3 nm gaps of fixed gap width that exhibit electron tunneling. We also form molecular junctions using dithiol-terminated oligo(phenylene ethynylene) (OPE3) to demonstrate the feasibility of our approach for electrical probing of molecules down to liquid helium temperatures. Our technology opens a whole new range of experimental opportunities for nano and molecular electronics applications, by enabling very large-scale fabrication of solid-state break junctions. △ Less

Submitted 3 September, 2018; v1 submitted 22 May, 2018; originally announced May 2018.

Comments: includes supporting information, 7 Figures in main text, 7 Figures in supporting information, compilation of images in supporting information

Journal ref: Nature Communications, volume 9, Article number 3433 (2018)