Graphene/fluorinated graphene systems for a wide spectrum of electronics application
Authors:
I. V. Antonova,
I. A. Kotin,
I. I. Kurkina,
A. I. Ivanov,
E. A. Yakimchuk,
N. A. Nebogatikova,
V. I. Vdovin,
A. K. Gutakovskii,
R. A. Soots
Abstract:
Heterostructures prepared from graphene and fluorographene (FG) using the technology of 2D printing on solid and flexible substrates were fabricated and studied. Excellent stability of printed graphene layers and, to a lesser degree, composite graphene: PEDOT: PSS layers were shown. Extraordinary properties of FG as an insulating layer for graphene-based heterostructures at fluorination degree abo…
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Heterostructures prepared from graphene and fluorographene (FG) using the technology of 2D printing on solid and flexible substrates were fabricated and studied. Excellent stability of printed graphene layers and, to a lesser degree, composite graphene: PEDOT: PSS layers were shown. Extraordinary properties of FG as an insulating layer for graphene-based heterostructures at fluorination degree above 30% were demonstrated. It is shown that the leakage current in thin (20-40 nm) films is normally smaller than 10^-8 A/cm2, the breakdown field being greater than 108 V/cm. In hybrid structures with printed FG layers in which graphene was transferred onto, or capsulated with, an FG layer, an increase in charge-carrier mobility and material conductivity amounting to 5-6 times was observed. The spectrum of future applications of FG layers can be further extended due to the possibility of obtaining, from weakly fluorinated graphene (< 20%), functional layers exhibiting a negative differential resistance behavior and, at fluorination degrees of 20-23%, field-effect-transistor channels with current modulation reaching several orders. Composite or bilayer films based on fluorographene and V2O5 or polyvinyl alcohol exhibit a stable resistive switching behavior. On the whole, graphene/FG heterostructures enjoy huge potential for their use in a wide spectrum of application, including flexible electronics.
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Submitted 4 May, 2022;
originally announced May 2022.
