Cracking in polymer substrates for flexible devices and its mitigation
Authors:
Anush Ranka,
Madhuja Layek,
Sayaka Kochiyama,
Cristina Lopez-Pernia,
Alicia M. Chandler,
Conrad A. Kocoj,
Erica Magliano,
Aldo Di Carlo,
Francesca Brunetti,
Peijun Guo,
Subra Suresh,
David C. Paine,
Haneesh Kesari,
Nitin P. Padture
Abstract:
Mechanical reliability plays an outsized role in determining the durability of flexible electronic devices because of the significant mechanical stresses they can experience during manufacturing and operation. These devices are typically built on sheets comprising stiff thin-film electrodes on compliant polymer substrates, and it is generally assumed that the high-toughness substrates do not crack…
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Mechanical reliability plays an outsized role in determining the durability of flexible electronic devices because of the significant mechanical stresses they can experience during manufacturing and operation. These devices are typically built on sheets comprising stiff thin-film electrodes on compliant polymer substrates, and it is generally assumed that the high-toughness substrates do not crack easily. Contrary to this widespread assumption, here we reveal severe, pervasive, and extensive cracking in the polymer substrates during bending of electrode/substrate sheets, which compromises the overall mechanical integrity of the entire device. The substrate-cracking phenomenon appears to be general, and it is driven by the amplified stress intensity factor caused by the elastic mismatch at the film/substrate interface. To mitigate this substrate cracking, an interlayer-engineering approach is designed and experimentally demonstrated. This approach is generic, and it is potentially applicable to myriad flexible electronic devices that utilize stiff films on compliant substrates, for improving their durability and reliability.
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Submitted 14 April, 2025;
originally announced April 2025.
Photothermally induced, reversible phase transition in methylammonium lead triiodide
Authors:
Shunran Li,
Zhenghong Dai,
Conrad A. Kocoj,
Eric I. Altman,
Nitin P. Padture,
Peijun Guo
Abstract:
Metal halide perovskites (MHPs) are known to undergo several structural phase transitions, from lower to higher symmetry, upon heating. While structural phase transitions have been investigated by a wide range of optical, thermal and electrical methods, most measurements are quasi-static and hence do not provide direct information regarding the fundamental timescale of phase transitions in this em…
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Metal halide perovskites (MHPs) are known to undergo several structural phase transitions, from lower to higher symmetry, upon heating. While structural phase transitions have been investigated by a wide range of optical, thermal and electrical methods, most measurements are quasi-static and hence do not provide direct information regarding the fundamental timescale of phase transitions in this emerging class of semiconductors. Here we investigate the timescale of the orthorhombic-to-tetragonal phase transition in the prototypical metal halide perovskite, methylammonium lead triiodide (CH3NH3PbI3 or MAPbI3) using cryogenic nanosecond transient absorption spectroscopy. By using mid-infrared pump pulses to impulsively heat up the material at slightly below the phase-transition temperature and probing the transient optical response as a function of delay time, we observed a clean signature of a transient, reversible orthorhombic-to-tetragonal phase transition. The forward phase transition is found to proceed at tens of nanoseconds timescale, after which a backward phase transition progresses at a timescale commensurate with heat dissipation from the film to the underlying substrate. A high degree of transient phase transition is observed accounting for one third of the steady-state phase transition. In comparison to fully inorganic phase-change materials such as VO2, the orders of magnitude slower phase transition in MAPbI3 can be attributed to the large energy barrier associated with the strong hydrogen bonding between the organic cation and the inorganic framework. Our approach paves the way for unraveling phase transition dynamics in MHPs and other hybrid semiconducting materials.
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Submitted 4 March, 2022; v1 submitted 3 March, 2022;
originally announced March 2022.
