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Development of a Test System for Data Links of the ATLAS Inner Tracker (ITk) Upgrade Silicon Pixel Detector
Authors:
F. Ustuner,
A. C. Mullins,
S. Eisenhardt,
M. Kocian,
D. Su,
M. Wittgen,
A. Young
Abstract:
This contribution introduces a novel test system developed to evaluate the signal transmission quality in high-speed data links for the 2026 Inner Tracker (ITk) upgrade of the ATLAS experiment. Using an FPGA-based data acquisition (DAQ) framework, the setup can run simultaneous Bit Error Rate (BER) tests for up to 64 channels and generate virtual eye diagrams, for qualifying the $\sim$26k electric…
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This contribution introduces a novel test system developed to evaluate the signal transmission quality in high-speed data links for the 2026 Inner Tracker (ITk) upgrade of the ATLAS experiment. Using an FPGA-based data acquisition (DAQ) framework, the setup can run simultaneous Bit Error Rate (BER) tests for up to 64 channels and generate virtual eye diagrams, for qualifying the $\sim$26k electrical links at the ATLAS ITk data rate of 1.28Gb/s. The paper includes results from system calibration, yielding its contribution to the measured losses, and preliminary results from tests of prototype and pre-production assemblies of on-detector links of the three ATLAS ITk Pixel subsystems.
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Submitted 14 March, 2025; v1 submitted 12 March, 2025;
originally announced March 2025.
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Measurements of Single Event Upset in ATLAS IBL
Authors:
G. Balbi,
M. Barbero,
R. Beccherle,
M. Bindi,
P. Breugnon,
P. Butti,
D. Cinca,
J. Dickinson,
D. Ferrere,
D. Fougeron,
M. Garcia-Sciveres,
J. Garcia Pascual,
A. Gaudiello,
C. Gemme,
N. Giangiacomi,
T. Hemperek,
L. Jeanty,
O. Kepka,
M. Kocian,
K. Lantzsch,
P. Liu,
C. Martin,
A. Mekkaoui,
M. Menouni,
K. Potamianos
, et al. (3 additional authors not shown)
Abstract:
Effects of Single Event Upsets (SEU) and Single Event Transients (SET) are studied in the FE-I4B chip of the innermost layer of the ATLAS pixel system. SEU/SET affect the FE-I4B Global Registers as well as the settings for the individual pixels, causing, among other things, occupancy losses, drops in the low voltage currents, noisy pixels, and silent pixels. Quantitative data analysis and simulati…
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Effects of Single Event Upsets (SEU) and Single Event Transients (SET) are studied in the FE-I4B chip of the innermost layer of the ATLAS pixel system. SEU/SET affect the FE-I4B Global Registers as well as the settings for the individual pixels, causing, among other things, occupancy losses, drops in the low voltage currents, noisy pixels, and silent pixels. Quantitative data analysis and simulations indicate that SET dominate over SEU on the load line of the memory. Operational issues and mitigation techniques are presented.
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Submitted 29 April, 2020;
originally announced April 2020.
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Production and Integration of the ATLAS Insertable B-Layer
Authors:
B. Abbott,
J. Albert,
F. Alberti,
M. Alex,
G. Alimonti,
S. Alkire,
P. Allport,
S. Altenheiner,
L. Ancu,
E. Anderssen,
A. Andreani,
A. Andreazza,
B. Axen,
J. Arguin,
M. Backhaus,
G. Balbi,
J. Ballansat,
M. Barbero,
G. Barbier,
A. Bassalat,
R. Bates,
P. Baudin,
M. Battaglia,
T. Beau,
R. Beccherle
, et al. (352 additional authors not shown)
Abstract:
During the shutdown of the CERN Large Hadron Collider in 2013-2014, an additional pixel layer was installed between the existing Pixel detector of the ATLAS experiment and a new, smaller radius beam pipe. The motivation for this new pixel layer, the Insertable B-Layer (IBL), was to maintain or improve the robustness and performance of the ATLAS tracking system, given the higher instantaneous and i…
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During the shutdown of the CERN Large Hadron Collider in 2013-2014, an additional pixel layer was installed between the existing Pixel detector of the ATLAS experiment and a new, smaller radius beam pipe. The motivation for this new pixel layer, the Insertable B-Layer (IBL), was to maintain or improve the robustness and performance of the ATLAS tracking system, given the higher instantaneous and integrated luminosities realised following the shutdown. Because of the extreme radiation and collision rate environment, several new radiation-tolerant sensor and electronic technologies were utilised for this layer. This paper reports on the IBL construction and integration prior to its operation in the ATLAS detector.
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Submitted 6 June, 2018; v1 submitted 2 March, 2018;
originally announced March 2018.
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Beam tests of an integrated prototype of the ATLAS Forward Proton detector
Authors:
J. Lange,
L. Adamczyk,
G. Avoni,
E. Banas,
A. Brandt,
M. Bruschi,
P. Buglewicz,
E. Cavallaro,
D. Caforio,
G. Chiodini,
L. Chytka,
K. Ciesla,
P. M. Davis,
M. Dyndal,
S. Grinstein,
K. Janas,
K. Jirakova,
M. Kocian,
K. Korcyl,
I. Lopez Paz,
D. Northacker,
L. Nozka,
M. Rijssenbeek,
L. Seabra,
R. Staszewski
, et al. (2 additional authors not shown)
Abstract:
The ATLAS Forward Proton (AFP) detector is intended to measure protons scattered at small angles from the ATLAS interaction point. To this end, a combination of 3D Silicon pixel tracking modules and Quartz-Cherenkov time-of-flight (ToF) detectors is installed 210m away from the interaction point at both sides of ATLAS. Beam tests with an AFP prototype detector combining tracking and timing sub-det…
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The ATLAS Forward Proton (AFP) detector is intended to measure protons scattered at small angles from the ATLAS interaction point. To this end, a combination of 3D Silicon pixel tracking modules and Quartz-Cherenkov time-of-flight (ToF) detectors is installed 210m away from the interaction point at both sides of ATLAS. Beam tests with an AFP prototype detector combining tracking and timing sub-detectors and a common readout have been performed at the CERN-SPS test-beam facility in November 2014 and September 2015 to complete the system integration and to study the detector performance. The successful tracking-timing integration was demonstrated. Good tracker hit efficiencies above 99.9% at a sensor tilt of 14°, as foreseen for AFP, were observed. Spatial resolutions in the short pixel direction with 50 μm pitch of 5.5 +/- 0.5 μm per pixel plane and of 2.8 +/- 0.5 μm for the full four-plane tracker at 14° were found, largely surpassing the AFP requirement of 10 μm. The timing detector showed also good hit efficiencies above 99%, and a full-system time resolution of 35 +/- 6 ps was found for the ToF prototype detector with two Quartz bars in-line (half the final AFP size) without dedicated optimisation, fulfilling the requirements for initial low-luminosity AFP runs.
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Submitted 2 November, 2016; v1 submitted 4 August, 2016;
originally announced August 2016.
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The FE-I4 Telescope for particle tracking in testbeam experiments
Authors:
M. Benoit,
J. Bilbao De Mendizabal,
F. A. Di Bello,
D. Ferrere,
T. Golling,
S. Gonzalez-Sevilla,
G. Iacobucci,
M. Kocian,
D. Muenstermann,
B. Ristic,
A. Sciuccati
Abstract:
A testbeam telescope, based on ATLAS IBL silicon pixel modules, has been built. It comprises six planes of planar silicon sensors with 250 x 50 um^2 pitch, read out by ATLAS FE-I4 chips. In the CERN SPS H8 beamline (180 GeV pi+) a resolution of better than 8 x 12 um^2 at the position of the device under test was achieved. The telescope reached a trigger rate of 6kHz with two measured devices. It i…
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A testbeam telescope, based on ATLAS IBL silicon pixel modules, has been built. It comprises six planes of planar silicon sensors with 250 x 50 um^2 pitch, read out by ATLAS FE-I4 chips. In the CERN SPS H8 beamline (180 GeV pi+) a resolution of better than 8 x 12 um^2 at the position of the device under test was achieved. The telescope reached a trigger rate of 6kHz with two measured devices. It is mainly designed for studies using FE-I4 based prototypes, but has also been successfully run with independent DAQ systems. Specialised trigger schemes ensure data synchronisation between these external devices and the telescope. A region-of-interest trigger can be formed by setting masks on the first and the last pixel sensor planes. The setup infrastructure provides centrally controlled and monitored high and low voltage power supplies, silicon oil cooling, temperature and humidity sensors and movable stages.
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Submitted 20 June, 2016; v1 submitted 24 March, 2016;
originally announced March 2016.
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Test Beam Results of 3D Silicon Pixel Sensors for the ATLAS upgrade
Authors:
ATLAS 3D Collaboration,
P. Grenier,
G. Alimonti,
M. Barbero,
R. Bates,
E. Bolle,
M. Borri,
M. Boscardin,
C. Buttar,
M. Capua,
M. Cavalli-Sforza,
M. Cobal,
A. Cristofoli,
G-F. Dalla Betta,
G. Darbo,
C. Da Vià,
E. Devetak,
B. DeWilde,
B. Di Girolamo,
D. Dobos,
K. Einsweiler,
D. Esseni,
S. Fazio,
C. Fleta,
J. Freestone
, et al. (68 additional authors not shown)
Abstract:
Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sen…
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Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sensors were bump bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.
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Submitted 21 January, 2011;
originally announced January 2011.
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Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade
Authors:
A. La Rosa,
M. Boscardin,
G. -F. Dalla Betta,
G. Darbo,
C. Gemme,
H. Pernegger,
C. Piemonte,
M. Povoli,
S. Ronchin,
A. Zoboli,
N. Zorzi,
E. Bolle,
M. Borri,
C. Da Via,
S. Dong,
S. Fazio,
P. Grenier,
S. Grinstein,
H. Gjersdal,
P. Hansson,
F. Huegging,
P. Jackson,
M. Kocian,
F. Rivero,
O. Rohne
, et al. (7 additional authors not shown)
Abstract:
3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200um, and different column depths are available, with overlaps between junction c…
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3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200um, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110um to 150um. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am241 gamma-ray sources, charge collection tests with Sr90 beta-source and an overview of preliminary results from the CERN beam test.
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Submitted 20 October, 2009;
originally announced October 2009.
