Detectorless 3D terahertz imaging: achieving subwavelength resolution with reflectance confocal interferometric microscopy
Authors:
Jorge Silva,
Martin Plöschner,
Karl Bertling,
Mukund Ghantala,
Tim Gillespie,
Jari Torniainen,
Jeremy Herbert,
Yah Leng Lim,
Thomas Taimre,
Xiaoqiong Qi,
Bogdan C. Donose,
Tao Zhou,
Hoi-Shun Lui,
Dragan Indjin,
Yingjun Han,
Lianhe Li,
Alexander Valavanis,
Edmund H. Linfield,
A. Giles Davies,
Paul Dean,
Aleksandar D. Rakić
Abstract:
Terahertz imaging holds great potential for non-destructive material inspection, but practical implementation has been limited by resolution constraints. In this study, we present a single-pixel THz imaging system based on a confocal microscope architecture, utilising a quantum cascade laser as both transmitter and phase-sensitive receiver. Our approach integrates laser feedback interferometry det…
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Terahertz imaging holds great potential for non-destructive material inspection, but practical implementation has been limited by resolution constraints. In this study, we present a single-pixel THz imaging system based on a confocal microscope architecture, utilising a quantum cascade laser as both transmitter and phase-sensitive receiver. Our approach integrates laser feedback interferometry detection to achieve a two-fold improvement in lateral resolution and a two-order-of-magnitude enhancement in axial resolution over conventional imaging through precise interferometric phase measurements. This translates to a lateral resolution near $λ/2$ and a depth of focus better than $λ/5$, significantly outperforming traditional confocal systems. The system can produce a 0.5 Mpixel image in under two minutes, surpassing both raster-scanning single-pixel and multipixel focal-plane array-based imagers. Coherent operation enables simultaneous amplitude and phase image acquisition, and a custom visualisation method links amplitude to image saturation and phase to hue, enhancing material characterisation. A 3D tomographic analysis of a silicon chip reveals subwavelength features, demonstrating the system's potential for high-resolution THz imaging and material analysis. This work sets a new benchmark for THz imaging, overcoming key challenges and opening up transformative possibilities for non-destructive material inspection and characterisation.
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Submitted 19 March, 2025; v1 submitted 24 December, 2024;
originally announced December 2024.
