Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data Centers and Other Computing Applications
Authors:
John Knickerbocker,
Jean Benoit Heroux,
Griselda Bonilla,
Hsiang Hsu,
Neng Liu,
Adrian Paz Ramos,
Francois Arguin,
Yan Tribodeau,
Badr Terjani,
Mark Schultz,
Raghu Kiran Ganti,
Linsong Chu,
Chinami Marushima,
Yoichi Taira,
Sayuri Kohara,
Akihiro Horibe,
Hiroyuki Mori,
Hidetoshi Numata
Abstract:
We report on the successful design and fabrication of optical modules using a 50 micron pitch polymer waveguide interface, integrated for low loss, high density optical data transfer with very low space requirements on a Si photonics die. This prototype module meets JEDEC reliability standards and promises to increase the number of optical fibers that can be connected at the edge of a chip, a meas…
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We report on the successful design and fabrication of optical modules using a 50 micron pitch polymer waveguide interface, integrated for low loss, high density optical data transfer with very low space requirements on a Si photonics die. This prototype module meets JEDEC reliability standards and promises to increase the number of optical fibers that can be connected at the edge of a chip, a measure known as beachfront density, by six times compared to state of the art technology. Scalability of the polymer waveguide to less than 20 micron pitch stands to improve the bandwidth density upwards of 10 Tbps/mm.
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Submitted 9 December, 2024;
originally announced December 2024.
