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Showing 1–2 of 2 results for author: De Gendt, S

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  1. arXiv:2406.05148  [pdf

    physics.chem-ph cond-mat.mtrl-sci

    Photoemission Spectroscopy on photoresist materials: A protocol for analysis of radiation sensitive materials

    Authors: Faegheh S. Sajjadian, Laura Galleni, Kevin M. Dorney, Dhirendra P. Singh, Fabian Holzmeier, Michiel J. van Setten, Stefan De Gendt, Thierry Conard

    Abstract: Device architectures and dimensions are now at an unimaginable level not thought possible even 10 years ago. The continued downscaling, following the so-called Moore's law, has motivated the development and use of extreme ultraviolet (EUV) lithography scanners with specialized photoresists. Since the quality and precision of the transferred circuit pattern is determined by the EUV induced chemical… ▽ More

    Submitted 30 May, 2024; originally announced June 2024.

    Journal ref: J. Vac. Sci. Technol. A 41, 053206 (2023)

  2. arXiv:2304.10853  [pdf

    physics.app-ph cond-mat.mtrl-sci

    Microwave Properties of Ba-Substituted Pb(Zr$_{0.52}$Ti$_{0.48}$)O$_3$ after Chemical-Mechanical Polishing

    Authors: Federica Luciano, Lieve Teugels, Sean McMitchell, Giacomo Talmelli, Anaïs Guerenneur, Renzo Stheins, Rudy Caluwaerts, Thierry Conard, Inge Vaesen, Stefanie Sergeant, Pol Van Dorpe, Stefan De Gendt, Matthijn Dekkers, Johan Swerts, Florin Ciubotaru, Christoph Adelmann

    Abstract: We have studied the effect of chemical-mechanical polishing (CMP) on the ferroelectric, piezoelectric, and microwave dielectric properties of Ba-substituted PZT (BPZT), deposited by pulsed laser deposition. CMP allowed for the reduction of the root mean square surface roughness of 600 nm thick BPZT films from 12.1nm to 0.79 nm. Ammonium peroxide (SC-1) cleaning was effective to remove Si CMP resid… ▽ More

    Submitted 21 April, 2023; originally announced April 2023.

    Comments: 13 pages of text, 4 tables and 7 figures. This project has received funding from the European Union's Horizon 2020 research and innovation program under grant agreement No. 801055 "Spin Wave Computing for Ultimately-Scaled Hybrid Low-Power Electronics" - CHIRON