Rydberg Entangling Gates in Silicon
Authors:
Eleanor Crane,
Alexander Schuckert,
Nguyen H. Le,
Andrew J. Fisher
Abstract:
In this paper, we propose a new Rydberg entangling gate scheme which we demonstrate theoretically to have an order of magnitude improvement in fidelities and speed over existing protocols. We find that applying this gate to donors in silicon would help overcome the strenuous requirements on atomic precision donor placement and substantial gate tuning, which so far has hampered scaling. We calculat…
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In this paper, we propose a new Rydberg entangling gate scheme which we demonstrate theoretically to have an order of magnitude improvement in fidelities and speed over existing protocols. We find that applying this gate to donors in silicon would help overcome the strenuous requirements on atomic precision donor placement and substantial gate tuning, which so far has hampered scaling. We calculate multivalley Rydberg interactions for several donor species using the Finite Element Method, and show that induced electric dipole and Van der Waals interactions, calculated here for the first time, are important even for low-lying excited states. We show that Rydberg gate operation is possible within the lifetime of donor excited states with 99.9% fidelity for the creation of a Bell state in the presence of decoherence.
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Submitted 24 November, 2020; v1 submitted 26 August, 2020;
originally announced August 2020.
Atomic-Scale Patterning of Arsenic in Silicon by Scanning Tunneling Microscopy
Authors:
Taylor J. Z. Stock,
Oliver Warschkow,
Procopios C. Constantinou,
Juerong Li,
Sarah Fearn,
Eleanor Crane,
Emily V. S. Hofmann,
Alexander Kölker,
David R. McKenzie,
Steven R. Schofield,
Neil J. Curson
Abstract:
Over the last two decades, prototype devices for future classical and quantum computing technologies have been fabricated, by using scanning tunneling microscopy and hydrogen resist lithography to position phosphorus atoms in silicon with atomic-scale precision. Despite these successes, phosphine remains the only donor precursor molecule to have been demonstrated as compatible with the hydrogen re…
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Over the last two decades, prototype devices for future classical and quantum computing technologies have been fabricated, by using scanning tunneling microscopy and hydrogen resist lithography to position phosphorus atoms in silicon with atomic-scale precision. Despite these successes, phosphine remains the only donor precursor molecule to have been demonstrated as compatible with the hydrogen resist lithography technique. The potential benefits of atomic-scale placement of alternative dopant species have, until now, remained unexplored. In this work, we demonstrate successful fabrication of atomic-scale structures of arsenic-in-silicon. Using a scanning tunneling microscope tip, we pattern a monolayer hydrogen mask to selectively place arsenic atoms on the Si(001) surface using arsine as the precursor molecule. We fully elucidate the surface chemistry and reaction pathways of arsine on Si(001), revealing significant differences to phosphine. We explain how these differences result in enhanced surface immobilization and in-plane confinement of arsenic compared to phosphorus, and a dose-rate independent arsenic saturation density of $0.24{\pm}0.04$ ML. We demonstrate the successful encapsulation of arsenic delta-layers using silicon molecular beam epitaxy, and find electrical characteristics that are competitive with equivalent structures fabricated with phosphorus. Arsenic delta-layers are also found to offer improvement in out-of-plane confinement compared to similarly prepared phosphorus layers, while still retaining >80% carrier activation and sheet resistances of $<2 kΩ/{\square}$. These excellent characteristics of arsenic represent opportunities to enhance existing capabilities of atomic-scale fabrication of dopant structures in silicon, and are particularly important for three-dimensional devices, where vertical control of the position of device components is critical.
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Submitted 15 October, 2019;
originally announced October 2019.