Demonstration of a-Si metalenses on a 12-inch glass wafer by CMOS-compatible technology
Authors:
Ting Hu,
Qize Zhong,
Nanxi Li,
Yuan Dong,
Yuan Hsing Fu,
Zhengji Xu,
Dongdong Li,
Vladimir Bliznetsov,
Keng Heng Lai,
Shiyang Zhu,
Qunying Lin,
Yuandong Gu,
Navab Singh,
Dim-Lee Kwong
Abstract:
Metalenses built up by artificial sub-wavelength nanostructures have shown the capability of realizing light focusing with miniature lens size. To date, most of the reported metalenses were patterned using electron beam lithography (EBL), which requires long processing time and is not suitable for mass production. Here, we demonstrate an amorphous silicon (a-Si) metalens on a 12-inch glass wafer v…
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Metalenses built up by artificial sub-wavelength nanostructures have shown the capability of realizing light focusing with miniature lens size. To date, most of the reported metalenses were patterned using electron beam lithography (EBL), which requires long processing time and is not suitable for mass production. Here, we demonstrate an amorphous silicon (a-Si) metalens on a 12-inch glass wafer via the 193 nm ArF deep UV immersion lithography, with critical dimension (CD) as small as 100 nm. The layer transfer technology is developed to solve the glass wafer handling issue in complementary metal-oxide-semiconductor (CMOS) fabrication line. The measured numerical aperture (NA) is 0.494 with a beam spot size of 1.26 μm, which agrees well with the simulation results. The focusing efficiency of 29.2% is observed at the designed wavelength of 940 nm. In addition, the metalens is applied in an imaging system, which further verifies its focusing functionality.
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Submitted 11 June, 2019;
originally announced June 2019.
