Showing 1–13 of 13 results for author: Bhuiyan, A F M A U

Quasi-Vertical $β$-Ga$_2$O$_3$ Schottky Diodes on Sapphire Using All-LPCVD Growth and Plasma-Free Ga-Assisted Etching

Authors: Saleh Ahmed Khan, Ahmed Ibreljic, A F M Anhar Uddin Bhuiyan

Abstract: This work demonstrates quasi-vertical beta-Ga2O3 Schottky barrier diodes (SBDs) fabricated on c-plane sapphire using an all-LPCVD, plasma-free process integrating epitaxial growth of high-quality beta-Ga2O3 and in-situ Ga-assisted etching. A 6.3 micron-thick (-201)-oriented beta-Ga2O3 layer was grown on c-sapphire with a 6-degree miscut, comprising a 3.15 micron moderately doped (2.1e17 cm^-3) dri… ▽ More This work demonstrates quasi-vertical beta-Ga2O3 Schottky barrier diodes (SBDs) fabricated on c-plane sapphire using an all-LPCVD, plasma-free process integrating epitaxial growth of high-quality beta-Ga2O3 and in-situ Ga-assisted etching. A 6.3 micron-thick (-201)-oriented beta-Ga2O3 layer was grown on c-sapphire with a 6-degree miscut, comprising a 3.15 micron moderately doped (2.1e17 cm^-3) drift layer and a heavily doped (1e19 cm^-3) contact layer on a UID buffer. Mesa isolation used Ga-assisted LPCVD etching with 3.7 micron vertical profiles. SBDs showed excellent forward J-V behavior: 1.22 V turn-on, 1.29 ideality factor, and 0.83 eV barrier height. Minimum differential specific on-resistance was 8.6 mOhm*cm^2 with high current density (252 A/cm^2 at 5 V). C-V profiling revealed uniform doping at 2.1e17 cm^-3. J-V-T from 25 C to 250 C confirmed thermionic emission. Barrier height increased from 0.80 to 1.16 eV, and ideality factor from 1.31 to 1.42. Reverse leakage current remained low, increasing from ~5e-6 A/cm^2 to ~1e-4 A/cm^2; Ion/Ioff decreased from ~1e7 to 5e5. Breakdown voltages with moderately doped (2.1e17 cm^-3) drift layer ranged between 59 and 100 V, with corresponding fields of 1.49 to 1.94 MV/cm. These results highlight the potential of LPCVD-grown and etched beta-Ga2O3 devices for high-performance power electronic applications. △ Less

Submitted 8 July, 2025; originally announced July 2025.

LPCVD based Plasma Damage Free in situ etching of $β$-Ga$_2$O$_3$ using Solid Source Gallium

Authors: Saleh Ahmed Khan, Ahmed Ibreljic, A F M Anhar Uddin Bhuiyan

Abstract: This work demonstrates a novel in situ etching technique for $β$-Ga$_2$O$_3$ using solid-source metallic Ga in a LPCVD system, enabling clean, anisotropic, plasma damage-free etching. Etching behavior was systematically studied on (-201) $β$-Ga$_2$O$_3$ films and patterned (010) $β$-Ga$_2$O$_3$ substrates as a function of temperature, Ar carrier gas flow, and Ga source-to-substrate distance. The p… ▽ More This work demonstrates a novel in situ etching technique for $β$-Ga$_2$O$_3$ using solid-source metallic Ga in a LPCVD system, enabling clean, anisotropic, plasma damage-free etching. Etching behavior was systematically studied on (-201) $β$-Ga$_2$O$_3$ films and patterned (010) $β$-Ga$_2$O$_3$ substrates as a function of temperature, Ar carrier gas flow, and Ga source-to-substrate distance. The process exhibits vapor transport- and surface-reaction-limited behavior, with etch rates reaching a maximum of $\sim$2.25~$μ$m/hr on (010) substrates at 1050~$^\circ$C and 2 cm spacing. Etch rates decrease sharply with increasing source-to-substrate distance due to reduced Ga vapor availability, while elevated temperatures enhance surface reaction kinetics through increased Ga reactivity and suboxide formation, leading to enhanced etch rates. In-plane anisotropy studies using radial trench patterns reveal that the (100) orientation produces the most stable etch front, characterized by smooth, vertical sidewalls and minimal lateral etching, consistent with its lowest surface free energy. In contrast, orientations such as (101), which possess higher surface energy, exhibit pronounced lateral etching and micro-faceting. As the trench orientation progressively deviates from (100), lateral etching increases. Facet evolution is observed between (100) and (-102), where stepped sidewalls composed of alternating (100) and (-102) segments progressively transition into a single inclined facet, which stabilizes along (100) or (-102) depending on the trench orientation. The (100)-aligned fins exhibit minimal bottom curvature, while (201)-aligned structures display increased under-etching and trench rounding. △ Less

Submitted 21 June, 2025; originally announced June 2025.

Electrical and Structural Properties of In-Situ MOCVD Grown Al$_2$O$_3$/$β$-Ga$_2$O$_3$ and Al$_2$O$_3$/$β$-(Al$_x$Ga$_{1-x}$)$_2$O$_3$ MOSCAPs

Authors: A F M Anhar Uddin Bhuiyan, Lingyu Meng, Dong Su Yu, Sushovan Dhara, Hsien-Lien Huang, Vijay Gopal Thirupakuzi Vangipuram, Jinwoo Hwang, Siddharth Rajan, Hongping Zhao

Abstract: This study investigates the electrical and structural properties of MOSCAPs with in-situ MOCVD-grown Al$_2$O$_3$ dielectrics on (010) $β$-Ga$_2$O$_3$ and $β$-(Al$_x$Ga$_{1-x}$)$_2$O$_3$ films. The Al$_2$O$_3$/$β$-Ga$_2$O$_3$ MOSCAPs showed a strong dependence on Al$_2$O$_3$ deposition temperature. At 900$^\circ$C, reduced voltage hysteresis ($\sim$0.3 V) and improved reverse breakdown voltage (74.… ▽ More This study investigates the electrical and structural properties of MOSCAPs with in-situ MOCVD-grown Al$_2$O$_3$ dielectrics on (010) $β$-Ga$_2$O$_3$ and $β$-(Al$_x$Ga$_{1-x}$)$_2$O$_3$ films. The Al$_2$O$_3$/$β$-Ga$_2$O$_3$ MOSCAPs showed a strong dependence on Al$_2$O$_3$ deposition temperature. At 900$^\circ$C, reduced voltage hysteresis ($\sim$0.3 V) and improved reverse breakdown voltage (74.5 V) were observed, with breakdown fields of 5.01 MV/cm in Al$_2$O$_3$ and 4.11 MV/cm in $β$-Ga$_2$O$_3$. At 650$^\circ$C, higher hysteresis ($\sim$3.44 V) and lower reverse breakdown voltage (38.8 V) were observed, with breakdown fields of 3.69 MV/cm in Al$_2$O$_3$ and 2.87 MV/cm in $β$-Ga$_2$O$_3$. However, forward breakdown fields improved from 5.62 MV/cm (900$^\circ$C) to 7.25 MV/cm (650$^\circ$C). STEM revealed improved crystallinity and sharper interfaces at 900$^\circ$C, enhancing reverse breakdown performance. For Al$_2$O$_3$/$β$-(Al$_x$Ga$_{1-x}$)$_2$O$_3$ MOSCAPs, increasing Al composition ($x$ = 5.5\% to 9.2\%) reduced carrier concentration and improved reverse breakdown fields from 2.55 to 2.90 MV/cm in $β$-(Al$_x$Ga$_{1-x}$)$_2$O$_3$ and 2.41 to 3.13 MV/cm in Al$_2$O$_3$. Forward breakdown fields in Al$_2$O$_3$ improved from 5.0 to 5.4 MV/cm as Al composition increased. STEM confirmed compositional homogeneity and excellent stoichiometry of Al$_2$O$_3$ and $β$-(Al$_x$Ga$_{1-x}$)$_2$O$_3$ layers. These findings highlight the robust electrical performance, high breakdown fields, and structural quality of Al$_2$O$_3$/$β$-Ga$_2$O$_3$ and Al$_2$O$_3$/$β$-(Al$_x$Ga$_{1-x}$)$_2$O$_3$ MOSCAPs for high-power applications. △ Less

Submitted 22 May, 2025; v1 submitted 17 January, 2025; originally announced January 2025.

LPCVD Grown Si-Doped $β$-Ga$_2$O$_3$ Films with Promising Electron Mobilities

Authors: Saleh Ahmed Khan, Ahmed Ibreljic, Stephen Margiotta, A F M Anhar Uddin Bhuiyan

Abstract: We systematically investigated the growth of Si-doped $β$-Ga$_2$O$_3$ films using LPCVD system, achieving high electron mobilities of 162 cm$^2$/V.s and 149 cm$^2$/V.s at carrier concentrations of $1.51 \times 10^{17}$ cm$^{-3}$ and $1.15 \times 10^{17}$ cm$^{-3}$, respectively, for homoepitaxial (010) $β$-Ga$_2$O$_3$ films grown on $β$-Ga$_2$O$_3$ substrates and heteroepitaxial (-201) $β$-Ga$_2$O… ▽ More We systematically investigated the growth of Si-doped $β$-Ga$_2$O$_3$ films using LPCVD system, achieving high electron mobilities of 162 cm$^2$/V.s and 149 cm$^2$/V.s at carrier concentrations of $1.51 \times 10^{17}$ cm$^{-3}$ and $1.15 \times 10^{17}$ cm$^{-3}$, respectively, for homoepitaxial (010) $β$-Ga$_2$O$_3$ films grown on $β$-Ga$_2$O$_3$ substrates and heteroepitaxial (-201) $β$-Ga$_2$O$_3$ films grown on off-axis c-sapphire substrates with 6° miscut, representing the highest mobilities reported for LPCVD-grown $β$-Ga$_2$O$_3$ materials. Carrier concentrations were precisely tuned by varying SiCl$_4$ flow rates at a growth temperature of 1000°C, resulting in concentrations ranging from $1.15 \times 10^{17}$ to $1.19 \times 10^{19}$ cm$^{-3}$, as confirmed by both Hall and C-V measurements. The films exhibited high crystalline quality, confirmed by high-resolution XRD and Raman spectroscopy, indicating phase purity and structural integrity. Surface morphologies characterized by FESEM and AFM imaging showed a strong correlation between carrier concentrations and surface smoothness, with lower concentrations resulting in reduced RMS roughness. SIMS analysis revealed uniform Si incorporation, with low carbon, hydrogen, and chlorine impurities below detection limits, indicating high purity of the films. A high low-temperature peak mobility exceeding 843 cm$^2$/V$\cdot$s was achieved for (-201) $β$-Ga$_2$O$_3$ films at 80 K, highlighting the high purity and low compensation of these films. These findings emphasize the potential of LPCVD growth system for producing high-purity $β$-Ga$_2$O$_3$ films with thickness ranging between ~2.3-11.7 $μ$m and faster growth rates (~4.7-17 $μ$m/hr), promising transport properties, controllable doping, and scalability for developing high power vertical devices. △ Less

Submitted 11 January, 2025; v1 submitted 28 November, 2024; originally announced December 2024.

Radiation Resilience of $β$-Ga$_2$O$_3$ Schottky Barrier Diodes Under High Dose Gamma Radiation

Authors: Saleh Ahmed Khan, Sudipto Saha, Uttam Singisetti, A F M Anhar Uddin Bhuiyan

Abstract: A systematic investigation of the electrical characteristics of \b{eta}-Ga2O3 Schottky barrier diodes (SBDs) has been conducted under high-dose 60Co gamma radiation, with total cumulative doses reaching up to 5 Mrad (Si). Initial exposure of the diodes to 1 Mrad resulted in a significant decrease in on-current and an increase in on-resistance compared to the pre-radiation condition, likely due to… ▽ More A systematic investigation of the electrical characteristics of \b{eta}-Ga2O3 Schottky barrier diodes (SBDs) has been conducted under high-dose 60Co gamma radiation, with total cumulative doses reaching up to 5 Mrad (Si). Initial exposure of the diodes to 1 Mrad resulted in a significant decrease in on-current and an increase in on-resistance compared to the pre-radiation condition, likely due to the generation of radiation-induced deep-level acceptor traps. However, upon exposure to higher gamma radiation doses of 3 and 5 Mrad, partial recovery of the device performance occurred, attributed to a radiation annealing effect. The capacitance-voltage (C-V) characterization revealed that the net carrier concentration in the $β$-Ga$_2$O$_3$ drift layer reduced from $\sim$3.19 $\times$ 10$^{16}$ cm$^{-3}$ to $\sim$3.05 $\times$ 10$^{16}$ cm$^{-3}$ after 5 Mrad (Si) irradiation. Temperature-dependent I-V characteristics showed that irradiation leads to a reduction in both forward and reverse current across all investigated temperatures ranging from 25 to 250$^\circ$C, accompanied by slight increases in on-resistance, ideality factors, and Schottky barrier heights. The reverse breakdown characteristics of the $β$-Ga$_2$O$_3$ SBDs showed a slight increase of the breakdown voltage after radiation. Overall, $β$-Ga$_2$O$_3$ Schottky diode exhibits high resilience to gamma irradiation, with performance degradation mitigated by radiation-induced self-recovery, highlighting its potential for radiation-hardened electronic applications in extreme environments. △ Less

Submitted 11 January, 2025; v1 submitted 20 August, 2024; originally announced August 2024.

Sub-100 nm β-Ga2O3 MOSFET with 55 GHz fMAX and >100 V breakdown

Authors: Chinmoy Nath Saha, Abhishek Vaidya, A F M Anhar Uddin Bhuiyan, Lingyu Meng, Hongping Zhao, Uttam Singisetti

Abstract: This letter reports a highly scaled 90 nm gate length beta-Ga2O3 T-gate MOSFET with no current collapse and record power gain cut off frequency (fMAX). The epitaxial stack of 60 nm thin channel MOSFET was grown by Molecular Beam Epitaxy (MBE) and highly doped (n++) contact regrowth was carried out by Metal Organic Chemical Vapour Deposition (MOCVD) in the source/drain region. Maximum on current (I… ▽ More This letter reports a highly scaled 90 nm gate length beta-Ga2O3 T-gate MOSFET with no current collapse and record power gain cut off frequency (fMAX). The epitaxial stack of 60 nm thin channel MOSFET was grown by Molecular Beam Epitaxy (MBE) and highly doped (n++) contact regrowth was carried out by Metal Organic Chemical Vapour Deposition (MOCVD) in the source/drain region. Maximum on current (IDS, MAX) of 160 mA/mm and transconductance (gm) around 36 mS/mm was measured at VDS= 10 V for LSD= 1.5 micrometer channel length. Transconductance is limited by higher channel sheet resistance (Rsheet). We observed no current collapse for both drain and gate lag measurement even at higher VDG,Q quiescent bias points. This is the first report of Ga2O3 FET showing no current collapse without any external passivation. Breakdown voltage around 125 V was reported for LGD= 1.2 micrometer. We extracted 27 GHz current gain cut off frequency (fT) and 55 GHz fMAX for 20 V drain bias. fMAX value mentioned here is the highest for Ga2O3 and the first demonstration of 55 GHz operation. fT. VBR product of 3.375 THz.V has been calculated which is comparable with state-of-art GaN HEMT. This letter suggests that Ga2O3 can be a suitable candidate for X-band application. △ Less

Submitted 14 November, 2023; v1 submitted 8 May, 2023; originally announced May 2023.

Electrical Characteristics of in situ Mg-doped beta-Ga2O3 Current-Blocking Layer for Vertical Devices

Authors: Sudipto Saha, Lingyu Meng, A F M Anhar Uddin Bhuiyan, Ankit Sharma, Chinmoy Nath Saha, Hongping Zhao, Uttam Singisetti

Abstract: The lack of p-type doping has impeded the development of vertical gallium oxide (Ga2O3) devices. Current blocking layers (CBL) using implanted deep acceptors has been used to demonstrate vertical devices. This paper presents the first demonstration of in situ Mg-doped beta-Ga2O3 CBLs grown using metalorganic chemical vapor deposition. Device structures were designed with in-situ Mg doped layers wi… ▽ More The lack of p-type doping has impeded the development of vertical gallium oxide (Ga2O3) devices. Current blocking layers (CBL) using implanted deep acceptors has been used to demonstrate vertical devices. This paper presents the first demonstration of in situ Mg-doped beta-Ga2O3 CBLs grown using metalorganic chemical vapor deposition. Device structures were designed with in-situ Mg doped layers with varied targeted Mg doping concentrations, which were calibrated by quantitative secondary ion mass spectroscopy (SIMS). The effectiveness of the CBL is characterized using temperature dependent current-voltage measurements using n-Mg-doped-n structures, providing crucial insight into the underlying mechanisms. To further validate the experimental results, a TCAD simulation is performed and the electrically active effective doping is found to be dependent on the Mg-doping density, offering a new perspective on the optimization of CBL performance. Breakdown measurements show a 3.4 MV/cm field strength. This study represents a significant step forward in the development of Ga2O3-based devices and paves the way for future advancements in this exciting field. △ Less

Submitted 12 April, 2023; originally announced April 2023.

Beta-Ga2O3 MOSFETs with near 50 GHz fMAX and 5.4 MV/cm average breakdown field

Authors: Chinmoy Nath Saha, Abhishek Vaidya, A F M Anhar Uddin Bhuiyan, Lingyu Meng, Hongping Zhao, Uttam Singisetti

Abstract: This letter reports high-performance $\mathrmβ Ga2O3 thin channel MOSFETs with T-gate and degenerately doped source/drain contacts regrown by MOCVD. Gate length scaling (LG= 160-200 nm) leads to a peak drain current (ID,MAX) of 285 mA/mm and peak trans-conductance (gm) of 52 mS/mm at 10 V drain bias with 23.5 Ohm mm on resistance (Ron). A low metal/n+ contact resistance of 0.078 Ohm mm was extract… ▽ More This letter reports high-performance $\mathrmβ Ga2O3 thin channel MOSFETs with T-gate and degenerately doped source/drain contacts regrown by MOCVD. Gate length scaling (LG= 160-200 nm) leads to a peak drain current (ID,MAX) of 285 mA/mm and peak trans-conductance (gm) of 52 mS/mm at 10 V drain bias with 23.5 Ohm mm on resistance (Ron). A low metal/n+ contact resistance of 0.078 Ohm mm was extracted from TLM measurement. Ron is dominated by interface resistance between channel and regrown layer. A gate-to-drain breakdown voltage of 192 V is measured for LGD = 355 nm resulting in average breakdown field (E_AVG) of 5.4 MV/cm. This E_AVG is the highest reported among all sub-micron gate length lateral FETs. RF measurements on 200 nm Silicon Nitride (Si3N4) passivated device shows a current gain cut off frequency (f_T) of 11 GHz and record power gain cut off frequency (f_MAX) of 48 GHz. The f_T.V_Br product is 2.11 THz.V for 192 V breakdown voltage. The switching figure of merit exceeds that of silicon and is comparable to mature wide-band gap devices. △ Less

Submitted 2 November, 2022; originally announced November 2022.

MOCVD growth and band offsets of \k{appa}-phase Ga2O3 on sapphire, GaN, AlN and YSZ substrates

Authors: A F M Anhar Uddin Bhuiyan, Zixuan Feng, Hsien-Lien Huang, Lingyu Meng, Jinwoo Hwang, Hongping Zhao

Abstract: Epitaxial growth of \k{appa}-phase Ga2O3 thin films are investigated on c-plane sapphire, GaN- and AlNon-sapphire, and (100) oriented yttria stabilized zirconia (YSZ) substrates via metalorganic chemical vapor deposition (MOCVD). The structural and surface morphological properties are investigated by comprehensive material characterization. Phase pure \k{appa}-Ga2O3 films are successfully grown on… ▽ More Epitaxial growth of \k{appa}-phase Ga2O3 thin films are investigated on c-plane sapphire, GaN- and AlNon-sapphire, and (100) oriented yttria stabilized zirconia (YSZ) substrates via metalorganic chemical vapor deposition (MOCVD). The structural and surface morphological properties are investigated by comprehensive material characterization. Phase pure \k{appa}-Ga2O3 films are successfully grown on GaN-, AlN-on sapphire, and YSZ substrates through a systematical tuning of the growth parameters including the precursor molar flow rates, chamber pressure and growth temperature, whereas the growth on c-sapphire substrates leads to a mixture of \b{eta}- and \k{appa}polymorphs of Ga2O3 under the investigated growth conditions. The influence of the crystalline structure, surface morphology and roughness of \k{appa}-Ga2O3 films grown on different substrates are investigated as a function of precursor flow rate. High resolution scanning transmission electron microscopy (HR-STEM) imaging of \k{appa}-Ga2O3 films reveals abrupt interfaces between the epitaxial film and the sapphire, GaN and YSZ substrates. The growth of single crystal orthorhombic \k{appa}Ga2O3 films is confirmed by analyzing the STEM nano-diffraction pattern. The chemical composition, surface stoichiometry, and the bandgap energies of \k{appa}-Ga2O3 thin films grown on different substrates are studied by high resolution x-ray photoelectron spectroscopy (XPS) measurements. The type-II (staggered) band alignments at three interfaces between \k{appa}-Ga2O3 and c-sapphire, AlN, and YSZ substrates are determined by XPS, with the exception of \k{appa}-Ga2O3/GaN interface, which shows type I (straddling) band alignment. △ Less

Submitted 11 January, 2025; v1 submitted 25 July, 2022; originally announced July 2022.

Large-Size Free-Standing Single-crystal b-Ga2O3 Membranes Fabricated by Hydrogen Implantation and Lift-Off

Authors: Yixiong Zheng, Zixuan Feng, A F M Anhar Uddin Bhuiyan, Lingyu Meng, Samyak Dhole, Quanxi Jia, Hongping Zhao, Jung-Hun Seo

Abstract: In this paper, we have demonstrated the large-size free-standing single-crystal b-Ga2O3 NMs fabricated by the hydrogen implantation and lift-off process directly from MOCVD grown b-Ga2O3 epifilms on native substrates. The optimum implantation conditions were simulated with a Monte-Carlo simulation to obtain the high hydrogen concentration with a narrow ion distribution at the desired depth. Two as… ▽ More In this paper, we have demonstrated the large-size free-standing single-crystal b-Ga2O3 NMs fabricated by the hydrogen implantation and lift-off process directly from MOCVD grown b-Ga2O3 epifilms on native substrates. The optimum implantation conditions were simulated with a Monte-Carlo simulation to obtain the high hydrogen concentration with a narrow ion distribution at the desired depth. Two as grown b-Ga2O3 samples with different orientation ([100] and [001]) were used and successfully create 1.2 um thick b-Ga2O3 NMs without any physical damages. These b-Ga2O3 NMs were then transfer-printed onto rigid and flexible substrates such as SiC substrate and polyimide substrate. Various material characterizations were performed to investigate the crystal quality, surface morphology, optical property, mechanical property, and bandgap before and after the lift-off and revealed that good material quality is maintained. This result offers several benefits in that the thickness, doping, and size of b-Ga2O3 NMs can be fully controlled. Moreover, more advanced b-Ga2O3-based NM structures such as (AlxGa1-x)2O3/Ga2O3 heterostructure NMs can be directly created from their bulk epitaxy substrates thus this result provides a viable route for the realization of high performance b-Ga2O3 NM-based electronics and optoelectronics that can be built on various substrates and platforms. △ Less

Submitted 11 February, 2021; originally announced February 2021.

Direct observation of site-specific dopant substitution in Si doped (AlxGa1-x)2O3 via Atom Probe Tomography

Authors: Jith Sarker, A F M Anhar Uddin Bhuiyan, Zixuan Feng, Hongping Zhao, Baishakhi Mazumder

Abstract: In this work, the interaction of n-type dopants in Si doped (AlxGa1-x)2O3 films with varying Al content over the entire composition range (x = 0-100%) was analyzed using atom probe tomography. An almost uniform dopant distribution with dopant density in the range of 1018 cm-3 was obtained in all (AlxGa1-x)2O3 layers containing different Al contents. We have demonstrated that for the single phase \… ▽ More In this work, the interaction of n-type dopants in Si doped (AlxGa1-x)2O3 films with varying Al content over the entire composition range (x = 0-100%) was analyzed using atom probe tomography. An almost uniform dopant distribution with dopant density in the range of 1018 cm-3 was obtained in all (AlxGa1-x)2O3 layers containing different Al contents. We have demonstrated that for the single phase \b{eta}-(AlxGa1-x)2O3 films with Al content of x<0.30, dopants prefer to occupy on Ga sites while Al site is preferred for high Al content (x>0.50) (AlxGa1-x)2O3 layers. It was also observed for Al content, x = 0.30-0.50, no specific cationic site occupancy was observed, Si occupies either Al or Ga sites. This can be attributed to highly inhomogeneous layers within this composition range due to which dopant Si atoms are either in the Al-rich or Al-depleted regions. △ Less

Submitted 2 September, 2020; originally announced September 2020.

Electrostatic Engineering using Extreme Permittivity Materials for Ultra-wide Bandgap Semiconductor Transistors

Authors: Nidhin Kurian Kalarickal, Zixuan Feng, A F M Anhar Uddin Bhuiyan, Zhanbo Xia, Joe F. McGlone, Wyatt Moore, Aaron R. Arehart, Steven A. Ringel, Hongping Zhao, Siddharth Rajan

Abstract: The performance of ultra-wide band gap materials like $β$-Ga$_\mathrm{2}$O$_\mathrm{3}$ is critically dependent on achieving high average electric fields within the active region of the device. In this report, we show that high-k gate dielectrics like BaTiO$_\mathrm{3}$ can provide an efficient field management strategy by improving the uniformity of electric field profile in the gate-drain region… ▽ More The performance of ultra-wide band gap materials like $β$-Ga$_\mathrm{2}$O$_\mathrm{3}$ is critically dependent on achieving high average electric fields within the active region of the device. In this report, we show that high-k gate dielectrics like BaTiO$_\mathrm{3}$ can provide an efficient field management strategy by improving the uniformity of electric field profile in the gate-drain region of lateral field effect transistors. Using this strategy, we were able to achieve high average breakdown fields of 1.5 MV/cm and 4 MV/cm at gate-drain spacing (L$_\mathrm{gd}$) of 6 um and 0.6 um respectively in $β$-Ga$_\mathrm{2}$O$_\mathrm{3}$, at a high channel sheet charge density of 1.8x10$^\mathrm{13}$cm$^\mathrm{-2}$. The high sheet charge density together with high breakdown field enabled a record power figure of merit (V$^\mathrm{2}$$_\mathrm{br}$/R$_\mathrm{on}$) of 376 MW/cm$^\mathrm{2}$ at a gate-drain spacing of 3 um. △ Less

Submitted 3 June, 2020; originally announced June 2020.

Probing charge transport and background doping in MOCVD grown (010) $β$-Ga$_{2}$O$_{3}$

Authors: Zixuan Feng, A F M Anhar Uddin Bhuiyan, Zhanbo Xia, Wyatt Moore, Zhaoying Chen, Joe F. McGlone, David R. Daughton, Aaron R. Arehart, Steven A. Ringel, Siddharth Rajan, Hongping Zhao

Abstract: A new record-high room temperature electron Hall mobility ($μ_{RT} = 194\space cm^{2}/V\space s$ at $n\sim 8\times 10^{15}\space cm^{-3}$) for $β$-Ga2O3 is demonstrated in the unintentionally doped thin film grown on (010) semi-insulating substrate via metalorganic chemical vapor deposition (MOCVD). A peak electron mobility of $\sim 9500\space cm^{2}/V\space s$ is achieved at 45 K. Further investi… ▽ More A new record-high room temperature electron Hall mobility ($μ_{RT} = 194\space cm^{2}/V\space s$ at $n\sim 8\times 10^{15}\space cm^{-3}$) for $β$-Ga2O3 is demonstrated in the unintentionally doped thin film grown on (010) semi-insulating substrate via metalorganic chemical vapor deposition (MOCVD). A peak electron mobility of $\sim 9500\space cm^{2}/V\space s$ is achieved at 45 K. Further investigation on the transport properties indicate the existence of sheet charges near the epi-layer/substrate interface. Si is identified as the primary contributor to the background carrier in both the epi-layer and the interface, originated from both surface contamination as well as growth environment. Pre-growth hydrofluoric acid cleaning of the substrate lead to an obvious decrease of Si impurity both at interface and in epi-layer. In addition, the effect of MOCVD growth condition, particularly the chamber pressure, on the Si impurity incorporation is studied. A positive correlation between the background charge concentration and the MOCVD growth pressure is confirmed. It is noteworthy that in a $β$-Ga2O3 film with very low bulk charge concentration, even a reduced sheet charge density can play an important role in the charge transport properties. △ Less

Submitted 27 April, 2020; originally announced April 2020.

Comments: 19 pages, 5 figures