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Further Characterisation of Digital Pixel Test Structures Implemented in a 65 nm CMOS Process
Authors:
Gianluca Aglieri Rinella,
Nicole Apadula,
Anton Andronic,
Matias Antonelli,
Mauro Aresti,
Roberto Baccomi,
Pascal Becht,
Stefania Beole,
Marcello Borri,
Justus Braach,
Matthew Daniel Buckland,
Eric Buschmann,
Paolo Camerini,
Francesca Carnesecchi,
Leonardo Cecconi,
Edoardo Charbon,
Giacomo Contin,
Dominik Dannheim,
Joao de Melo,
Wenjing Deng,
Antonello di Mauro,
Jan Hasenbichler,
Hartmut Hillemanns,
Geun Hee Hong,
Artem Isakov
, et al. (33 additional authors not shown)
Abstract:
The next generation of MAPS for future tracking detectors will have to meet stringent requirements placed on them. One such detector is the ALICE ITS3 that aims to be very light at 0.07% X/X$_{0}$ per layer and have a low power consumption of 40 mW/cm$^{2}$ by implementing wafer-scale MAPS bent into cylindrical half layers. To address these challenging requirements, the ALICE ITS3 project, in conj…
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The next generation of MAPS for future tracking detectors will have to meet stringent requirements placed on them. One such detector is the ALICE ITS3 that aims to be very light at 0.07% X/X$_{0}$ per layer and have a low power consumption of 40 mW/cm$^{2}$ by implementing wafer-scale MAPS bent into cylindrical half layers. To address these challenging requirements, the ALICE ITS3 project, in conjunction with the CERN EP R&D on monolithic pixel sensors, proposed the Tower Partners Semiconductor Co. 65 nm CMOS process as the starting point for the sensor. After the initial results confirmed the detection efficiency and radiation hardness, the choice of the technology was solidified by demonstrating the feasibility of operating MAPS in low-power consumption regimes, < 50 mW/cm$^{2}$, while maintaining high-quality performance. This was shown through a detailed characterisation of the Digital Pixel Test Structure (DPTS) prototype exposed to X-rays and ionising beams, and the results are presented in this article. Additionally, the sensor was further investigated through studies of the fake-hit rate, the linearity of the front-end in the range 1.7-28 keV, the performance after ionising irradiation, and the detection efficiency of inclined tracks in the range 0-45$^\circ$.
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Submitted 9 May, 2025;
originally announced May 2025.
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A Packaging Method for ALPIDE Integration Enabling Flexible and Low-Material-Budget Designs
Authors:
D. Novel,
A. Lega,
T. Facchinelli,
R. Iuppa,
S. Beolé,
P. Bellutti
Abstract:
This work presents a novel solution for the packaging of ALPIDE chips that facilitates non-planar assembly with a minimal material budget. This solution represents a technological advancement based on methodologies developed for the ALICE ITS1 and the STAR tracker two decades ago. The core of this approach involves the use of flexible cables composed of aluminum and polyimide, with thicknesses on…
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This work presents a novel solution for the packaging of ALPIDE chips that facilitates non-planar assembly with a minimal material budget. This solution represents a technological advancement based on methodologies developed for the ALICE ITS1 and the STAR tracker two decades ago. The core of this approach involves the use of flexible cables composed of aluminum and polyimide, with thicknesses on the order of tens of micrometers. These cables are connected to the sensors using single-point Tape Automated Bonding (spTAB), which replaces the traditional wire bonding technique that is suboptimal for curved integrations. The spTAB bonding is achieved by creating openings in the polyimide layer, allowing aluminum wires to remain free-standing, which are then connected to the sensor using pressure and ultrasonic energy. Extending this concept, we have applied this approach to entire printed circuit boards (PCBs), resulting in a fully flexible packaging solution maintaining an ultra-low material budget. This work introduces a prototype utilizing this method to bond an ALPIDE chip, proposing it as a viable option for future designs necessitating flexible packaging for both the chip and associated electronics. The overall workflow, comprising microfabrication and assembly, is carried out at the Fondazione Bruno Kessler and INFN TIFPA laboratories and will be detailed to elucidate our procedures and demonstrate the applicability of our solution in future experimental setups. The proposed packaging features a flexible PCB constructed from three stacked layers, each containing 20 $μ$m thick aluminum features and a 25 $μ$m thick polyimide substrate. These layers include a ground layer, a signal layer (encompassing both digital and analog signals), and a local bonding layer (which substitutes wire bonding).
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Submitted 14 March, 2025;
originally announced March 2025.
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Time performance of Analog Pixel Test Structures with in-chip operational amplifier implemented in 65 nm CMOS imaging process
Authors:
Gianluca Aglieri Rinella,
Luca Aglietta,
Matias Antonelli,
Francesco Barile,
Franco Benotto,
Stefania Maria Beolè,
Elena Botta,
Giuseppe Eugenio Bruno,
Francesca Carnesecchi,
Domenico Colella,
Angelo Colelli,
Giacomo Contin,
Giuseppe De Robertis,
Florina Dumitrache,
Domenico Elia,
Chiara Ferrero,
Martin Fransen,
Alex Kluge,
Shyam Kumar,
Corentin Lemoine,
Francesco Licciulli,
Bong-Hwi Lim,
Flavio Loddo,
Magnus Mager,
Davide Marras
, et al. (21 additional authors not shown)
Abstract:
In the context of the CERN EP R&D on monolithic sensors and the ALICE ITS3 upgrade, the Tower Partners Semiconductor Co (TPSCo) 65 nm process has been qualified for use in high energy physics, and adopted for the ALICE ITS3 upgrade. An Analog Pixel Test Structure (APTS) featuring fast per pixel operational-amplifier-based buffering for a small matrix of four by four pixels, with a sensor with a sm…
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In the context of the CERN EP R&D on monolithic sensors and the ALICE ITS3 upgrade, the Tower Partners Semiconductor Co (TPSCo) 65 nm process has been qualified for use in high energy physics, and adopted for the ALICE ITS3 upgrade. An Analog Pixel Test Structure (APTS) featuring fast per pixel operational-amplifier-based buffering for a small matrix of four by four pixels, with a sensor with a small collection electrode and a very non-uniform electric field, was designed to allow detailed characterization of the pixel performance in this technology. Several variants of this chip with different pixel designs have been characterized with a (120 GeV/$c$) positive hadron beam. This result indicates that the APTS-OA prototype variants with the best performance achieve a time resolution of 63 ps with a detection efficiency exceeding 99% and a spatial resolution of 2 $μ$m, highlighting the potential of TPSCo 65nm CMOS imaging technology for high-energy physics and other fields requiring precise time measurement, high detection efficiency, and excellent spatial resolution.
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Submitted 30 October, 2024; v1 submitted 26 July, 2024;
originally announced July 2024.
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Characterisation of analogue Monolithic Active Pixel Sensor test structures implemented in a 65 nm CMOS imaging process
Authors:
Gianluca Aglieri Rinella,
Giacomo Alocco,
Matias Antonelli,
Roberto Baccomi,
Stefania Maria Beole,
Mihail Bogdan Blidaru,
Bent Benedikt Buttwill,
Eric Buschmann,
Paolo Camerini,
Francesca Carnesecchi,
Marielle Chartier,
Yongjun Choi,
Manuel Colocci,
Giacomo Contin,
Dominik Dannheim,
Daniele De Gruttola,
Manuel Del Rio Viera,
Andrea Dubla,
Antonello di Mauro,
Maurice Calvin Donner,
Gregor Hieronymus Eberwein,
Jan Egger,
Laura Fabbietti,
Finn Feindt,
Kunal Gautam
, et al. (69 additional authors not shown)
Abstract:
Analogue test structures were fabricated using the Tower Partners Semiconductor Co. CMOS 65 nm ISC process. The purpose was to characterise and qualify this process and to optimise the sensor for the next generation of Monolithic Active Pixels Sensors for high-energy physics. The technology was explored in several variants which differed by: doping levels, pixel geometries and pixel pitches (10-25…
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Analogue test structures were fabricated using the Tower Partners Semiconductor Co. CMOS 65 nm ISC process. The purpose was to characterise and qualify this process and to optimise the sensor for the next generation of Monolithic Active Pixels Sensors for high-energy physics. The technology was explored in several variants which differed by: doping levels, pixel geometries and pixel pitches (10-25 $μ$m). These variants have been tested following exposure to varying levels of irradiation up to 3 MGy and $10^{16}$ 1 MeV n$_\text{eq}$ cm$^{-2}$. Here the results from prototypes that feature direct analogue output of a 4$\times$4 pixel matrix are reported, allowing the systematic and detailed study of charge collection properties. Measurements were taken both using $^{55}$Fe X-ray sources and in beam tests using minimum ionizing particles. The results not only demonstrate the feasibility of using this technology for particle detection but also serve as a reference for future applications and optimisations.
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Submitted 13 March, 2024;
originally announced March 2024.
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Letter of Intent: the NA60+ experiment
Authors:
C. Ahdida,
G. Alocco,
F. Antinori,
M. Arba,
M. Aresti,
R. Arnaldi,
A. Baratto Roldan,
S. Beole,
A. Beraudo,
J. Bernhard,
L. Bianchi,
M. Borysova,
S. Bressler,
S. Bufalino,
E. Casula,
C. Cicalo,
S. Coli,
P. Cortese,
A. Dainese,
H. Danielsson,
A. De Falco,
K. Dehmelt,
A. Drees,
A. Ferretti,
F. Fionda
, et al. (37 additional authors not shown)
Abstract:
We propose a new fixed-target experiment for the study of electromagnetic and hard probes of the Quark-Gluon Plasma (QGP) in heavy-ion collisions at the CERN SPS. The experiment aims at performing measurements of the dimuon spectrum from threshold up to the charmonium region, and of hadronic decays of charm and strange hadrons. It is based on a muon spectrometer, which includes a toroidal magnet a…
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We propose a new fixed-target experiment for the study of electromagnetic and hard probes of the Quark-Gluon Plasma (QGP) in heavy-ion collisions at the CERN SPS. The experiment aims at performing measurements of the dimuon spectrum from threshold up to the charmonium region, and of hadronic decays of charm and strange hadrons. It is based on a muon spectrometer, which includes a toroidal magnet and six planes of tracking detectors, coupled to a vertex spectrometer, equipped with Si MAPS immersed in a dipole field. High luminosity is an essential requirement for the experiment, with the goal of taking data with 10$^6$ incident ions/s, at collision energies ranging from $\sqrt{s_{\rm NN}} = 6.3$ GeV ($E_{\rm lab}= 20$ A GeV) to top SPS energy ($\sqrt{s_{\rm NN}} = 17.3$ GeV, $E_{\rm lab}= 158$ A GeV). This document presents the physics motivation, the foreseen experimental set-up including integration and radioprotection studies, the current detector choices together with the status of the corresponding R&D, and the outcome of physics performance studies. A preliminary cost evaluation is also carried out.
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Submitted 29 December, 2022;
originally announced December 2022.
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Digital Pixel Test Structures implemented in a 65 nm CMOS process
Authors:
Gianluca Aglieri Rinella,
Anton Andronic,
Matias Antonelli,
Mauro Aresti,
Roberto Baccomi,
Pascal Becht,
Stefania Beole,
Justus Braach,
Matthew Daniel Buckland,
Eric Buschmann,
Paolo Camerini,
Francesca Carnesecchi,
Leonardo Cecconi,
Edoardo Charbon,
Giacomo Contin,
Dominik Dannheim,
Joao de Melo,
Wenjing Deng,
Antonello di Mauro,
Jan Hasenbichler,
Hartmut Hillemanns,
Geun Hee Hong,
Artem Isakov,
Antoine Junique,
Alex Kluge
, et al. (27 additional authors not shown)
Abstract:
The ALICE ITS3 (Inner Tracking System 3) upgrade project and the CERN EP R&D on monolithic pixel sensors are investigating the feasibility of the Tower Partners Semiconductor Co. 65 nm process for use in the next generation of vertex detectors. The ITS3 aims to employ wafer-scale Monolithic Active Pixel Sensors thinned down to 20 to 40 um and bent to form truly cylindrical half barrels. Among the…
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The ALICE ITS3 (Inner Tracking System 3) upgrade project and the CERN EP R&D on monolithic pixel sensors are investigating the feasibility of the Tower Partners Semiconductor Co. 65 nm process for use in the next generation of vertex detectors. The ITS3 aims to employ wafer-scale Monolithic Active Pixel Sensors thinned down to 20 to 40 um and bent to form truly cylindrical half barrels. Among the first critical steps towards the realisation of this detector is to validate the sensor technology through extensive characterisation both in the laboratory and with in-beam measurements. The Digital Pixel Test Structure (DPTS) is one of the prototypes produced in the first sensor submission in this technology and has undergone a systematic measurement campaign whose details are presented in this article.
The results confirm the goals of detection efficiency and non-ionising and ionising radiation hardness up to the expected levels for ALICE ITS3 and also demonstrate operation at +20 C and a detection efficiency of 99% for a DPTS irradiated with a dose of $10^{15}$ 1 MeV n$_{\mathrm{eq}}/$cm$^2$. Furthermore, spatial, timing and energy resolutions were measured at various settings and irradiation levels.
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Submitted 10 July, 2023; v1 submitted 16 December, 2022;
originally announced December 2022.
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The MAPS foil
Authors:
S. Beolé,
F. Carnesecchi,
G. Contin,
R. de Oliveira,
A. di Mauro,
S. Ferry,
H. Hillemanns,
A. Junique,
A. Kluge,
L. Lautner,
M. Mager,
B. Mehl,
K. Rebane,
F. Reidt,
I. Sanna,
M. Šuljić,
A. Yüncü
Abstract:
We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised "MAPS foil", is a flexible, light, protected, and fully integrated detector module. By using widely available printed circuit board manufacturing techniques, the production of these dev…
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We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised "MAPS foil", is a flexible, light, protected, and fully integrated detector module. By using widely available printed circuit board manufacturing techniques, the production of these devices can be scaled easily in size and volume, making it a compelling candidate for future large-scale applications.
A first series of prototypes that embed the ALPIDE chip has been produced, functionally tested, and shown to be working.
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Submitted 19 October, 2022; v1 submitted 25 May, 2022;
originally announced May 2022.
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First demonstration of in-beam performance of bent Monolithic Active Pixel Sensors
Authors:
ALICE ITS project,
:,
G. Aglieri Rinella,
M. Agnello,
B. Alessandro,
F. Agnese,
R. S. Akram,
J. Alme,
E. Anderssen,
D. Andreou,
F. Antinori,
N. Apadula,
P. Atkinson,
R. Baccomi,
A. Badalà,
A. Balbino,
C. Bartels,
R. Barthel,
F. Baruffaldi,
I. Belikov,
S. Beole,
P. Becht,
A. Bhatti,
M. Bhopal,
N. Bianchi
, et al. (230 additional authors not shown)
Abstract:
A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20-40$μ$m. To solidify this concept, the feasibility of operating bent MAPS was demonstrated using 1.5$\times$3cm ALPIDE chips. Already with their thickness of 50$μ$m, they can be successfully bent to ra…
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A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20-40$μ$m. To solidify this concept, the feasibility of operating bent MAPS was demonstrated using 1.5$\times$3cm ALPIDE chips. Already with their thickness of 50$μ$m, they can be successfully bent to radii of about 2cm without any signs of mechanical or electrical damage. During a subsequent characterisation using a 5.4GeV electron beam, it was further confirmed that they preserve their full electrical functionality as well as particle detection performance.
In this article, the bending procedure and the setup used for characterisation are detailed. Furthermore, the analysis of the beam test, including the measurement of the detection efficiency as a function of beam position and local inclination angle, is discussed. The results show that the sensors maintain their excellent performance after bending to radii of 2cm, with detection efficiencies above 99.9% at typical operating conditions, paving the way towards a new class of detectors with unprecedented low material budget and ideal geometrical properties.
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Submitted 17 August, 2021; v1 submitted 27 May, 2021;
originally announced May 2021.
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A next-generation LHC heavy-ion experiment
Authors:
D. Adamová,
G. Aglieri Rinella,
M. Agnello,
Z. Ahammed,
D. Aleksandrov,
A. Alici,
A. Alkin,
T. Alt,
I. Altsybeev,
D. Andreou,
A. Andronic,
F. Antinori,
P. Antonioli,
H. Appelshäuser,
R. Arnaldi,
I. C. Arsene,
M. Arslandok,
R. Averbeck,
M. D. Azmi,
X. Bai,
R. Bailhache,
R. Bala,
L. Barioglio,
G. G. Barnaföldi,
L. S. Barnby
, et al. (374 additional authors not shown)
Abstract:
The present document discusses plans for a compact, next-generation multi-purpose detector at the LHC as a follow-up to the present ALICE experiment. The aim is to build a nearly massless barrel detector consisting of truly cylindrical layers based on curved wafer-scale ultra-thin silicon sensors with MAPS technology, featuring an unprecedented low material budget of 0.05% X$_0$ per layer, with th…
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The present document discusses plans for a compact, next-generation multi-purpose detector at the LHC as a follow-up to the present ALICE experiment. The aim is to build a nearly massless barrel detector consisting of truly cylindrical layers based on curved wafer-scale ultra-thin silicon sensors with MAPS technology, featuring an unprecedented low material budget of 0.05% X$_0$ per layer, with the innermost layers possibly positioned inside the beam pipe. In addition to superior tracking and vertexing capabilities over a wide momentum range down to a few tens of MeV/$c$, the detector will provide particle identification via time-of-flight determination with about 20~ps resolution. In addition, electron and photon identification will be performed in a separate shower detector. The proposed detector is conceived for studies of pp, pA and AA collisions at luminosities a factor of 20 to 50 times higher than possible with the upgraded ALICE detector, enabling a rich physics program ranging from measurements with electromagnetic probes at ultra-low transverse momenta to precision physics in the charm and beauty sector.
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Submitted 2 May, 2019; v1 submitted 31 January, 2019;
originally announced February 2019.
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Comparison of Fast Amplifiers for Diamond Detectors
Authors:
M. Osipenko,
S. Minutoli,
P. Musico,
M. Ripani,
B. Caiffi,
A. Balbi,
G. Ottonello,
S. Argirò,
S. Beolè,
N. Amapane,
M. Masera,
G. Mila
Abstract:
The development of Chemical Vapour Deposition (CVD) diamond detectors requests for novel signal amplifiers, capable to match the superb signal-to-noise ratio and timing response of these detectors. Existing amplifiers are still far away from this goal and are the dominant contributors to the overall system noise and the main source of degradation of the energy and timing resolution. We tested a nu…
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The development of Chemical Vapour Deposition (CVD) diamond detectors requests for novel signal amplifiers, capable to match the superb signal-to-noise ratio and timing response of these detectors. Existing amplifiers are still far away from this goal and are the dominant contributors to the overall system noise and the main source of degradation of the energy and timing resolution. We tested a number of commercial amplifiers designed for diamond detector readout to identify the best solution for a particular application. This application required a deposited energy threshold below 100 keV and timing resolution of the order of 200 ps at 200 keV. None of tested amplifiers satisfies these requirements. The best solution to such application found to be the Cividec C6 amplifier, which allows 100 keV minimal threshold, but its coincidence timing resolution at 200 keV is as large as 1.2 ns.
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Submitted 3 October, 2013;
originally announced October 2013.
