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Performance studies of the CE-65v2 MAPS prototype structure
Authors:
A. Ilg,
A. Lorenzetti,
H. Baba,
J. Baudot,
A. Besson,
S. Bugiel,
T. Chujo,
C. Colledani,
A. Dorokhov,
Z. El Bitar,
M. Goffe,
T. Gunji,
C. Hu-Guo,
K. Jaaskelainen,
T. Katsuno,
A. Kluge,
A. Kostina,
A. Kumar,
A. Macchiolo,
M. Mager,
J. Park,
E. Ploerer,
S. Sakai,
S. Senyukov,
H. Shamas
, et al. (8 additional authors not shown)
Abstract:
With the next upgrade of the ALICE inner tracking system (ITS3) as its primary focus, a set of small MAPS test structures have been developed in the 65 nm TPSCo CMOS process. The CE-65 focuses on the characterisation of the analogue charge collection properties of this technology. The latest iteration, the CE-65v2, was produced in different processes (standard, with a low-dose n-type blanket, and…
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With the next upgrade of the ALICE inner tracking system (ITS3) as its primary focus, a set of small MAPS test structures have been developed in the 65 nm TPSCo CMOS process. The CE-65 focuses on the characterisation of the analogue charge collection properties of this technology. The latest iteration, the CE-65v2, was produced in different processes (standard, with a low-dose n-type blanket, and blanket with gap between pixels), pixel pitches (15, 18, 22.5 $μ$m), and pixel arrangements (square or staggered). The comparatively large pixel array size of $48\times24$ pixels in CE-65v2 allows the uniformity of the pixel response to be studied, among other benefits.
The CE-65v2 chip was characterised in a test beam at the CERN SPS. A first analysis showed that hit efficiencies of $\geq 99\%$ and spatial resolution better than 5 $μ$m can be achieved for all pitches and process variants. For the standard process, thanks to larger charge sharing, even spatial resolutions below 3 $μ$m are reached, in line with vertex detector requirements for the FCC-ee.
This contribution further investigates the data collected at the SPS test beam. Thanks to the large sensor size and efficient data collection, a large amount of statistics was collected, which allows for detailed in-pixel studies to see the efficiency and spatial resolution as a function of the hit position within the pixels. Again, different pitches and process variants are compared.
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Submitted 24 February, 2025; v1 submitted 6 February, 2025;
originally announced February 2025.
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Characterisation of analogue MAPS produced in the 65 nm TPSCo process
Authors:
Eduardo Ploerer,
Hitoshi Baba,
Jerome Baudot,
Auguste Besson,
Szymon Bugiel,
Tatsuya Chujo,
Claude Colledani,
Andrei Dorokhov,
Ziad El Bitar,
Mathieu Goffe,
Taku Gunji,
Christine Hu-Guo,
Armin Ilg,
Kimmo Jaaskelainen,
Towa Katsuno,
Alexander Kluge,
Anhelina Kostina,
Ajit Kumar,
Alessandra Lorenzetti,
Anna Macchiolo,
Magnus Mager,
Jonghan Park,
Shingo Sakai,
Serhiy Senyukov,
Hasan Shamas
, et al. (9 additional authors not shown)
Abstract:
Within the context of the ALICE ITS3 collaboration, a set of MAPS small-scale test structures were developed using the 65 nm TPSCo CMOS imaging process with the upgrade of the ALICE inner tracking system as its primary focus. One such sensor, the Circuit Exploratoire 65 nm (CE-65), and its evolution the CE-65v2, were developed to explore charge collection properties for varying configurations incl…
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Within the context of the ALICE ITS3 collaboration, a set of MAPS small-scale test structures were developed using the 65 nm TPSCo CMOS imaging process with the upgrade of the ALICE inner tracking system as its primary focus. One such sensor, the Circuit Exploratoire 65 nm (CE-65), and its evolution the CE-65v2, were developed to explore charge collection properties for varying configurations including collection layer process (standard, blanket, modified with gap), pixel pitch (15, 18, \SI{22.5}{\micro\meter}), and pixel geometry (square vs hexagonal/staggered). In this work the characterisation of the CE-65v2 chip, based on $^{55}$Fe lab measurements and test beams at CERN SPS, is presented. Matrix gain uniformity up to the $\mathcal{O}$(5\%) level was demonstrated for all considered chip configurations. The CE-65v2 chip achieves a spatial resolution of under \SI{2}{\micro\meter} during beam tests. Process modifications allowing for faster charge collection and less charge sharing result in decreased spatial resolution, but a considerably wider range of operation, with both the \SI{15}{\micro\meter} and \SI{22.5}{\micro\meter} chips achieving over 99\% efficiency up to a $\sim$180 e$^{-}$ seed threshold. The results serve to validate the 65 nm TPSCo CMOS process, as well as to motivate design choices in future particle detection experiments.
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Submitted 13 November, 2024;
originally announced November 2024.
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Science Requirements and Detector Concepts for the Electron-Ion Collider: EIC Yellow Report
Authors:
R. Abdul Khalek,
A. Accardi,
J. Adam,
D. Adamiak,
W. Akers,
M. Albaladejo,
A. Al-bataineh,
M. G. Alexeev,
F. Ameli,
P. Antonioli,
N. Armesto,
W. R. Armstrong,
M. Arratia,
J. Arrington,
A. Asaturyan,
M. Asai,
E. C. Aschenauer,
S. Aune,
H. Avagyan,
C. Ayerbe Gayoso,
B. Azmoun,
A. Bacchetta,
M. D. Baker,
F. Barbosa,
L. Barion
, et al. (390 additional authors not shown)
Abstract:
This report describes the physics case, the resulting detector requirements, and the evolving detector concepts for the experimental program at the Electron-Ion Collider (EIC). The EIC will be a powerful new high-luminosity facility in the United States with the capability to collide high-energy electron beams with high-energy proton and ion beams, providing access to those regions in the nucleon…
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This report describes the physics case, the resulting detector requirements, and the evolving detector concepts for the experimental program at the Electron-Ion Collider (EIC). The EIC will be a powerful new high-luminosity facility in the United States with the capability to collide high-energy electron beams with high-energy proton and ion beams, providing access to those regions in the nucleon and nuclei where their structure is dominated by gluons. Moreover, polarized beams in the EIC will give unprecedented access to the spatial and spin structure of the proton, neutron, and light ions. The studies leading to this document were commissioned and organized by the EIC User Group with the objective of advancing the state and detail of the physics program and developing detector concepts that meet the emerging requirements in preparation for the realization of the EIC. The effort aims to provide the basis for further development of concepts for experimental equipment best suited for the science needs, including the importance of two complementary detectors and interaction regions.
This report consists of three volumes. Volume I is an executive summary of our findings and developed concepts. In Volume II we describe studies of a wide range of physics measurements and the emerging requirements on detector acceptance and performance. Volume III discusses general-purpose detector concepts and the underlying technologies to meet the physics requirements. These considerations will form the basis for a world-class experimental program that aims to increase our understanding of the fundamental structure of all visible matter
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Submitted 26 October, 2021; v1 submitted 8 March, 2021;
originally announced March 2021.
