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TemporalAugmenter: An Ensemble Recurrent Based Deep Learning Approach for Signal Classification
Authors:
Nelly Elsayed,
Constantinos L. Zekios,
Navid Asadizanjani,
Zag ElSayed
Abstract:
Ensemble modeling has been widely used to solve complex problems as it helps to improve overall performance and generalization. In this paper, we propose a novel TemporalAugmenter approach based on ensemble modeling for augmenting the temporal information capturing for long-term and short-term dependencies in data integration of two variations of recurrent neural networks in two learning streams t…
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Ensemble modeling has been widely used to solve complex problems as it helps to improve overall performance and generalization. In this paper, we propose a novel TemporalAugmenter approach based on ensemble modeling for augmenting the temporal information capturing for long-term and short-term dependencies in data integration of two variations of recurrent neural networks in two learning streams to obtain the maximum possible temporal extraction. Thus, the proposed model augments the extraction of temporal dependencies. In addition, the proposed approach reduces the preprocessing and prior stages of feature extraction, which reduces the required energy to process the models built upon the proposed TemporalAugmenter approach, contributing towards green AI. Moreover, the proposed model can be simply integrated into various domains including industrial, medical, and human-computer interaction applications. Our proposed approach empirically evaluated the speech emotion recognition, electrocardiogram signal, and signal quality examination tasks as three different signals with varying complexity and different temporal dependency features.
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Submitted 12 January, 2024;
originally announced January 2024.
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US Microelectronics Packaging Ecosystem: Challenges and Opportunities
Authors:
Rouhan Noor,
Himanandhan Reddy Kottur,
Patrick J Craig,
Liton Kumar Biswas,
M Shafkat M Khan,
Nitin Varshney,
Hamed Dalir,
Elif Akçalı,
Bahareh Ghane Motlagh,
Charles Woychik,
Yong-Kyu Yoon,
Navid Asadizanjani
Abstract:
The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more features into the silicon footprint. One promising approach is Heterogeneous Integration (HI), which involves advanced packaging techniques to integrate indepe…
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The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more features into the silicon footprint. One promising approach is Heterogeneous Integration (HI), which involves advanced packaging techniques to integrate independently designed and manufactured components using the most suitable process technology. However, adopting HI introduces design and security challenges. To enable HI, research and development of advanced packaging is crucial. The existing research raises the possible security threats in the advanced packaging supply chain, as most of the Outsourced Semiconductor Assembly and Test (OSAT) facilities/vendors are offshore. To deal with the increasing demand for semiconductors and to ensure a secure semiconductor supply chain, there are sizable efforts from the United States (US) government to bring semiconductor fabrication facilities onshore. However, the US-based advanced packaging capabilities must also be ramped up to fully realize the vision of establishing a secure, efficient, resilient semiconductor supply chain. Our effort was motivated to identify the possible bottlenecks and weak links in the advanced packaging supply chain based in the US.
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Submitted 30 October, 2023; v1 submitted 17 October, 2023;
originally announced October 2023.
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In-Situ Thickness Measurement of Die Silicon Using Voltage Imaging for Hardware Assurance
Authors:
Olivia P. Dizon-Paradis,
Nitin Varshney,
M Tanjidur Rahman,
Michael Strizich,
Haoting Shen,
Navid Asadizanjani
Abstract:
Hardware assurance of electronics is a challenging task and is of great interest to the government and the electronics industry. Physical inspection-based methods such as reverse engineering (RE) and Trojan scanning (TS) play an important role in hardware assurance. Therefore, there is a growing demand for automation in RE and TS. Many state-of-the-art physical inspection methods incorporate an it…
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Hardware assurance of electronics is a challenging task and is of great interest to the government and the electronics industry. Physical inspection-based methods such as reverse engineering (RE) and Trojan scanning (TS) play an important role in hardware assurance. Therefore, there is a growing demand for automation in RE and TS. Many state-of-the-art physical inspection methods incorporate an iterative imaging and delayering workflow. In practice, uniform delayering can be challenging if the thickness of the initial layer of material is non-uniform. Moreover, this non-uniformity can reoccur at any stage during delayering and must be corrected. Therefore, it is critical to evaluate the thickness of the layers to be removed in a real-time fashion. Our proposed method uses electron beam voltage imaging, image processing, and Monte Carlo simulation to measure the thickness of remaining silicon to guide a uniform delayering process
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Submitted 24 July, 2023;
originally announced July 2023.
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Framework for Automatic PCB Marking Detection and Recognition for Hardware Assurance
Authors:
Olivia P. Dizon-Paradis,
Daniel E. Capecci,
Nathan T. Jessurun,
Damon L. Woodard,
Mark M. Tehranipoor,
Navid Asadizanjani
Abstract:
A Bill of Materials (BoM) is a list of all components on a printed circuit board (PCB). Since BoMs are useful for hardware assurance, automatic BoM extraction (AutoBoM) is of great interest to the government and electronics industry. To achieve a high-accuracy AutoBoM process, domain knowledge of PCB text and logos must be utilized. In this study, we discuss the challenges associated with automati…
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A Bill of Materials (BoM) is a list of all components on a printed circuit board (PCB). Since BoMs are useful for hardware assurance, automatic BoM extraction (AutoBoM) is of great interest to the government and electronics industry. To achieve a high-accuracy AutoBoM process, domain knowledge of PCB text and logos must be utilized. In this study, we discuss the challenges associated with automatic PCB marking extraction and propose 1) a plan for collecting salient PCB marking data, and 2) a framework for incorporating this data for automatic PCB assurance. Given the proposed dataset plan and framework, subsequent future work, implications, and open research possibilities are detailed.
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Submitted 24 July, 2023;
originally announced July 2023.
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Speech Emotion Recognition using Supervised Deep Recurrent System for Mental Health Monitoring
Authors:
Nelly Elsayed,
Zag ElSayed,
Navid Asadizanjani,
Murat Ozer,
Ahmed Abdelgawad,
Magdy Bayoumi
Abstract:
Understanding human behavior and monitoring mental health are essential to maintaining the community and society's safety. As there has been an increase in mental health problems during the COVID-19 pandemic due to uncontrolled mental health, early detection of mental issues is crucial. Nowadays, the usage of Intelligent Virtual Personal Assistants (IVA) has increased worldwide. Individuals use th…
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Understanding human behavior and monitoring mental health are essential to maintaining the community and society's safety. As there has been an increase in mental health problems during the COVID-19 pandemic due to uncontrolled mental health, early detection of mental issues is crucial. Nowadays, the usage of Intelligent Virtual Personal Assistants (IVA) has increased worldwide. Individuals use their voices to control these devices to fulfill requests and acquire different services. This paper proposes a novel deep learning model based on the gated recurrent neural network and convolution neural network to understand human emotion from speech to improve their IVA services and monitor their mental health.
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Submitted 26 October, 2022; v1 submitted 25 August, 2022;
originally announced August 2022.
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EVHA: Explainable Vision System for Hardware Testing and Assurance -- An Overview
Authors:
Md Mahfuz Al Hasan,
Mohammad Tahsin Mostafiz,
Thomas An Le,
Jake Julia,
Nidish Vashistha,
Shayan Taheri,
Navid Asadizanjani
Abstract:
Due to the ever-growing demands for electronic chips in different sectors the semiconductor companies have been mandated to offshore their manufacturing processes. This unwanted matter has made security and trustworthiness of their fabricated chips concerning and caused creation of hardware attacks. In this condition, different entities in the semiconductor supply chain can act maliciously and exe…
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Due to the ever-growing demands for electronic chips in different sectors the semiconductor companies have been mandated to offshore their manufacturing processes. This unwanted matter has made security and trustworthiness of their fabricated chips concerning and caused creation of hardware attacks. In this condition, different entities in the semiconductor supply chain can act maliciously and execute an attack on the design computing layers, from devices to systems. Our attack is a hardware Trojan that is inserted during mask generation/fabrication in an untrusted foundry. The Trojan leaves a footprint in the fabricated through addition, deletion, or change of design cells. In order to tackle this problem, we propose Explainable Vision System for Hardware Testing and Assurance (EVHA) in this work that can detect the smallest possible change to a design in a low-cost, accurate, and fast manner. The inputs to this system are Scanning Electron Microscopy (SEM) images acquired from the Integrated Circuits (ICs) under examination. The system output is determination of IC status in terms of having any defect and/or hardware Trojan through addition, deletion, or change in the design cells at the cell-level. This article provides an overview on the design, development, implementation, and analysis of our defense system.
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Submitted 19 July, 2022;
originally announced July 2022.
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FPIC: A Novel Semantic Dataset for Optical PCB Assurance
Authors:
Nathan Jessurun,
Olivia P. Dizon-Paradis,
Jacob Harrison,
Shajib Ghosh,
Mark M. Tehranipoor,
Damon L. Woodard,
Navid Asadizanjani
Abstract:
Outsourced printed circuit board (PCB) fabrication necessitates increased hardware assurance capabilities. Several assurance techniques based on automated optical inspection (AOI) have been proposed that leverage PCB images acquired using digital cameras. We review state-of-the-art AOI techniques and observe a strong, rapid trend toward machine learning (ML) solutions. These require significant am…
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Outsourced printed circuit board (PCB) fabrication necessitates increased hardware assurance capabilities. Several assurance techniques based on automated optical inspection (AOI) have been proposed that leverage PCB images acquired using digital cameras. We review state-of-the-art AOI techniques and observe a strong, rapid trend toward machine learning (ML) solutions. These require significant amounts of labeled ground truth data, which is lacking in the publicly available PCB data space. We contribute the FICS PCB Image Collection (FPIC) dataset to address this need. Additionally, we outline new hardware security methodologies enabled by our data set.
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Submitted 14 March, 2023; v1 submitted 16 February, 2022;
originally announced February 2022.
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Histogram-based Auto Segmentation: A Novel Approach to Segmenting Integrated Circuit Structures from SEM Images
Authors:
Ronald Wilson,
Navid Asadizanjani,
Domenic Forte,
Damon L. Woodard
Abstract:
In the Reverse Engineering and Hardware Assurance domain, a majority of the data acquisition is done through electron microscopy techniques such as Scanning Electron Microscopy (SEM). However, unlike its counterparts in optical imaging, only a limited number of techniques are available to enhance and extract information from the raw SEM images. In this paper, we introduce an algorithm to segment o…
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In the Reverse Engineering and Hardware Assurance domain, a majority of the data acquisition is done through electron microscopy techniques such as Scanning Electron Microscopy (SEM). However, unlike its counterparts in optical imaging, only a limited number of techniques are available to enhance and extract information from the raw SEM images. In this paper, we introduce an algorithm to segment out Integrated Circuit (IC) structures from the SEM image. Unlike existing algorithms discussed in this paper, this algorithm is unsupervised, parameter-free and does not require prior information on the noise model or features in the target image making it effective in low quality image acquisition scenarios as well. Furthermore, the results from the application of the algorithm on various structures and layers in the IC are reported and discussed.
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Submitted 28 April, 2020;
originally announced April 2020.
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Hardware Trust and Assurance through Reverse Engineering: A Survey and Outlook from Image Analysis and Machine Learning Perspectives
Authors:
Ulbert J. Botero,
Ronald Wilson,
Hangwei Lu,
Mir Tanjidur Rahman,
Mukhil A. Mallaiyan,
Fatemeh Ganji,
Navid Asadizanjani,
Mark M. Tehranipoor,
Damon L. Woodard,
Domenic Forte
Abstract:
In the context of hardware trust and assurance, reverse engineering has been often considered as an illegal action. Generally speaking, reverse engineering aims to retrieve information from a product, i.e., integrated circuits (ICs) and printed circuit boards (PCBs) in hardware security-related scenarios, in the hope of understanding the functionality of the device and determining its constituent…
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In the context of hardware trust and assurance, reverse engineering has been often considered as an illegal action. Generally speaking, reverse engineering aims to retrieve information from a product, i.e., integrated circuits (ICs) and printed circuit boards (PCBs) in hardware security-related scenarios, in the hope of understanding the functionality of the device and determining its constituent components. Hence, it can raise serious issues concerning Intellectual Property (IP) infringement, the (in)effectiveness of security-related measures, and even new opportunities for injecting hardware Trojans. Ironically, reverse engineering can enable IP owners to verify and validate the design. Nevertheless, this cannot be achieved without overcoming numerous obstacles that limit successful outcomes of the reverse engineering process. This paper surveys these challenges from two complementary perspectives: image processing and machine learning. These two fields of study form a firm basis for the enhancement of efficiency and accuracy of reverse engineering processes for both PCBs and ICs. In summary, therefore, this paper presents a roadmap indicating clearly the actions to be taken to fulfill hardware trust and assurance objectives.
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Submitted 7 April, 2021; v1 submitted 11 February, 2020;
originally announced February 2020.
