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Showing 1–2 of 2 results for author: Woytasik, M

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  1. arXiv:0802.3052  [pdf

    cs.OH

    Copper Planar Microcoils Applied to Magnetic Actuation

    Authors: J. Moulin, M. Woytasik, E. Martincic, E. Dufour-Gergam

    Abstract: Recent advances in microtechnology allow realization of planar microcoils. These components are integrated in MEMS as magnetic sensor or actuator. In the latter case, it is necessary to maximize the effective magnetic field which is proportional to the current passing through the copper track and depends on the distance to the generation microcoil. The aim of this work was to determine the optim… ▽ More

    Submitted 21 February, 2008; originally announced February 2008.

    Comments: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing)

    Journal ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)

  2. arXiv:0711.3326  [pdf

    cs.OH

    Characterization of Flexible RF Microcoil Dedicated to Surface Mri

    Authors: M. Woytasik, J. -C. Ginefri, J. -S. Raynaud, M. Poirier-Quinot, E. Dufour-Gergam, J. -P. Grandchamp, L. Darrasse, P. Robert, J. -P. Gilles, E. Martincic, O. Girard

    Abstract: In Magnetic Resonance Imaging (MRI), to achieve sufficient Signal to Noise Ratio (SNR), the electrical performance of the RF coil is critical. We developed a device (microcoil) based on the original concept of monolithic resonator. This paper presents the used fabrication process based on micromoulding. The dielectric substrates are flexible thin films of polymer, which allow the microcoil to be… ▽ More

    Submitted 21 November, 2007; originally announced November 2007.

    Comments: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

    Journal ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)