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SiTe CiM: Signed Ternary Computing-in-Memory for Ultra-Low Precision Deep Neural Networks
Authors:
Niharika Thakuria,
Akul Malhotra,
Sandeep K. Thirumala,
Reena Elangovan,
Anand Raghunathan,
Sumeet K. Gupta
Abstract:
Ternary Deep Neural Networks (DNN) have shown a large potential for highly energy-constrained systems by virtue of their low power operation (due to ultra-low precision) with only a mild degradation in accuracy. To enable an energy-efficient hardware substrate for such systems, we propose a compute-enabled memory design, referred to as SiTe-CiM, which features computing-in-memory (CiM) of dot prod…
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Ternary Deep Neural Networks (DNN) have shown a large potential for highly energy-constrained systems by virtue of their low power operation (due to ultra-low precision) with only a mild degradation in accuracy. To enable an energy-efficient hardware substrate for such systems, we propose a compute-enabled memory design, referred to as SiTe-CiM, which features computing-in-memory (CiM) of dot products between signed ternary (SiTe) inputs and weights. SiTe CiM is based on cross-coupling of two bit cells to enable CiM of dot products in the signed ternary regime. We explore SiTe CiM with 8T-SRAM, 3T-embedded DRAM (3T-eDRAM) and 3T-ferroelectric metal FET (FEMFET) memories. We propose two flavors of this technique, namely SiTe CiM I/II. In SiTe CiM I, we employ two additional transistors per cell for cross-coupling, achieving fast CiM operations, albeit incurring an area overhead ranging from 18% to 34% (compared to standard ternary memories). In SiTe CiM II, four extra transistors are utilized for every 16 cells in a column, thereby incurring only 6% area cost (but leading to slower CiM than SiTe CiM I). Based on the array analysis, our designs achieve up to 88% lower CiM latency and 78% CiM energy savings across various technologies considered, as compared to their respective near-memory computing counterparts. Further, we perform system level analysis by incorporating SiTe CiM I/II arrays in a ternary DNN accelerator and show up to 7X throughput boost and up to 2.5X energy reduction compared to the near-memory ternary DNN accelerators.
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Submitted 24 August, 2024;
originally announced August 2024.
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STeP-CiM: Strain-enabled Ternary Precision Computation-in-Memory based on Non-Volatile 2D Piezoelectric Transistors
Authors:
Niharika Thakuria,
Reena Elangovan,
Sandeep K Thirumala,
Anand Raghunathan,
Sumeet K. Gupta
Abstract:
We propose 2D Piezoelectric FET (PeFET) based compute-enabled non-volatile memory for ternary deep neural networks (DNNs). PeFETs consist of a material with ferroelectric and piezoelectric properties coupled with Transition Metal Dichalcogenide channel. We utilize (a) ferroelectricity to store binary bits (0/1) in the form of polarization (-P/+P) and (b) polarization dependent piezoelectricity to…
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We propose 2D Piezoelectric FET (PeFET) based compute-enabled non-volatile memory for ternary deep neural networks (DNNs). PeFETs consist of a material with ferroelectric and piezoelectric properties coupled with Transition Metal Dichalcogenide channel. We utilize (a) ferroelectricity to store binary bits (0/1) in the form of polarization (-P/+P) and (b) polarization dependent piezoelectricity to read the stored state by means of strain-induced bandgap change in Transition Metal Dichalcogenide channel. The unique read mechanism of PeFETs enables us to expand the traditional association of +P (-P) with low (high) resistance states to their dual high (low) resistance depending on read voltage. Specifically, we demonstrate that +P (-P) stored in PeFETs can be dynamically configured in (a) a low (high) resistance state for positive read voltages and (b) their dual high (low) resistance states for negative read voltages, without afflicting a read disturb. Such a feature, which we name as Polarization Preserved Piezoelectric Effect Reversal with Dual Voltage Polarity (PiER), is unique to PeFETs and has not been shown in hitherto explored memories. We leverage PiER to propose a Strain-enabled Ternary Precision Computation-in-Memory (STeP-CiM) cell with capabilities of computing the scalar product of the stored weight and input, both of which are represented with signed ternary precision. Further, using multi word-line assertion of STeP-CiM cells, we achieve massively parallel computation of dot products of signed ternary inputs and weights. Our array level analysis shows 91% lower delay and improvements of 15% and 91% in energy for in-memory multiply-and-accumulate operations compared to near-memory design approaches based on SRAM and PeFET respectively. STeP-CiM exhibits upto 8.91x improvement in performance and 6.07x average improvement in energy over SRAM/PeFET based near-memory design.
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Submitted 30 March, 2022;
originally announced March 2022.
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Piezoelectric Strain FET (PeFET) based Non-Volatile Memories
Authors:
Niharika Thakuria,
Reena Elangovan,
Anand Raghunathan,
Sumeet K. Gupta
Abstract:
We propose non-volatile memory (NVM) designs based on Piezoelectric Strain FET (PeFET) utilizing a piezoelectric/ferroelectric (PE/FE such as PZT) coupled with 2D Transition Metal Dichalcogenide (2D-TMD such as MoS2) transistor. The proposed NVMs store bit information in the form of polarization (P) of the FE/PE, use electric-field driven P-switching for write and employ piezoelectricity induced d…
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We propose non-volatile memory (NVM) designs based on Piezoelectric Strain FET (PeFET) utilizing a piezoelectric/ferroelectric (PE/FE such as PZT) coupled with 2D Transition Metal Dichalcogenide (2D-TMD such as MoS2) transistor. The proposed NVMs store bit information in the form of polarization (P) of the FE/PE, use electric-field driven P-switching for write and employ piezoelectricity induced dynamic bandgap modulation of 2D-TMD channel for bit sensing. We analyze PeFET with COMSOL based 3D modeling showing that the circuit-driven optimization of PeFET geometry is essential to achieve effective hammer-and-nail effect and adequate bandgap modulation for NVM read. Our results show that distinguishability of binary states to up to 11X is achieved in PeFETs.We propose various flavors of PeFET NVMs, namely (a) high density (HD) NVM featuring a compact access-transistor-less bit-cell, (b) 1T-1PeFET NVM with segmented architecture, targeted for optimized write energy and latency and (c) cross-coupled (CC) NVM offering a trade-off between area and latency.PeFET NVMs offer up to 7X smaller cell area, 66% lower write energy, 87% lower read energy and 44% faster read compared to 2D-FET SRAM. This comes at the cost of high write latency in PeFET NVMs, which can be minimized by virtue of optimized PE geometry.
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Submitted 5 April, 2022; v1 submitted 28 February, 2022;
originally announced March 2022.
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Valley-Coupled-Spintronic Non-Volatile Memories with Compute-In-Memory Support
Authors:
Sandeep Thirumala,
Yi-Tse Hung,
Shubham Jain,
Arnab Raha,
Niharika Thakuria,
Vijay Raghunathan,
Anand Raghunathan,
Zhihong Chen,
Sumeet Gupta
Abstract:
In this work, we propose valley-coupled spin-hall memories (VSH-MRAMs) based on monolayer WSe2. The key features of the proposed memories are (a) the ability to switch magnets with perpendicular magnetic anisotropy (PMA) via VSH effect and (b) an integrated gate that can modulate the charge/spin current (IC/IS) flow. The former attribute results in high energy efficiency (compared to the Giant-Spi…
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In this work, we propose valley-coupled spin-hall memories (VSH-MRAMs) based on monolayer WSe2. The key features of the proposed memories are (a) the ability to switch magnets with perpendicular magnetic anisotropy (PMA) via VSH effect and (b) an integrated gate that can modulate the charge/spin current (IC/IS) flow. The former attribute results in high energy efficiency (compared to the Giant-Spin Hall (GSH) effect-based devices with in-plane magnetic anisotropy (IMA) magnets). The latter feature leads to a compact access transistor-less memory array design. We experimentally measure the gate controllability of the current as well as the nonlocal resistance associated with VSH effect. Based on the measured data, we develop a simulation framework (using physical equations) to propose and analyze single-ended and differential VSH effect based magnetic memories (VSH-MRAM and DVSH-MRAM, respectively). At the array level, the proposed VSH/DVSH-MRAMs achieve 50%/ 11% lower write time, 59%/ 67% lower write energy and 35%/ 41% lower read energy at iso-sense margin, compared to single ended/differential (GSH/DGSH)-MRAMs. System level evaluation in the context of general purpose processor and intermittently-powered system shows up to 3.14X and 1.98X better energy efficiency for the proposed (D)VSH-MRAMs over (D)GSH-MRAMs respectively. Further, the differential sensing of the proposed DVSH-MRAM leads to natural and simultaneous in-memory computation of bit-wise AND and NOR logic functions. Using this feature, we design a computation-in-memory (CiM) architecture that performs Boolean logic and addition (ADD) with a single array access. System analysis performed by integrating our DVSH-MRAM: CiM in the Nios II processor across various application benchmarks shows up to 2.66X total energy savings, compared to DGSH-MRAM: CiM.
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Submitted 17 December, 2019;
originally announced December 2019.
