The Bystander Affect Detection (BAD) Dataset for Failure Detection in HRI
Authors:
Alexandra Bremers,
Maria Teresa Parreira,
Xuanyu Fang,
Natalie Friedman,
Adolfo Ramirez-Aristizabal,
Alexandria Pabst,
Mirjana Spasojevic,
Michael Kuniavsky,
Wendy Ju
Abstract:
For a robot to repair its own error, it must first know it has made a mistake. One way that people detect errors is from the implicit reactions from bystanders -- their confusion, smirks, or giggles clue us in that something unexpected occurred. To enable robots to detect and act on bystander responses to task failures, we developed a novel method to elicit bystander responses to human and robot e…
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For a robot to repair its own error, it must first know it has made a mistake. One way that people detect errors is from the implicit reactions from bystanders -- their confusion, smirks, or giggles clue us in that something unexpected occurred. To enable robots to detect and act on bystander responses to task failures, we developed a novel method to elicit bystander responses to human and robot errors. Using 46 different stimulus videos featuring a variety of human and machine task failures, we collected a total of 2452 webcam videos of human reactions from 54 participants. To test the viability of the collected data, we used the bystander reaction dataset as input to a deep-learning model, BADNet, to predict failure occurrence. We tested different data labeling methods and learned how they affect model performance, achieving precisions above 90%. We discuss strategies to model bystander reactions and predict failure and how this approach can be used in real-world robotic deployments to detect errors and improve robot performance. As part of this work, we also contribute with the "Bystander Affect Detection" (BAD) dataset of bystander reactions, supporting the development of better prediction models.
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Submitted 8 March, 2023;
originally announced March 2023.
Hierarchical Automatic Power Plane Generation with Genetic Optimization and Multilayer Perceptron
Authors:
Haiguang Liao,
Vinay Patil,
Xuliang Dong,
Devika Shanbhag,
Elias Fallon,
Taylor Hogan,
Mirko Spasojevic,
Levent Burak Kara
Abstract:
We present an automatic multilayer power plane generation method to accelerate the design of printed circuit boards (PCB). In PCB design, while automatic solvers have been developed to predict important indicators such as the IR-drop, power integrity, and signal integrity, the generation of the power plane itself still largely relies on laborious manual methods. Our automatic power plane generatio…
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We present an automatic multilayer power plane generation method to accelerate the design of printed circuit boards (PCB). In PCB design, while automatic solvers have been developed to predict important indicators such as the IR-drop, power integrity, and signal integrity, the generation of the power plane itself still largely relies on laborious manual methods. Our automatic power plane generation approach is based on genetic optimization combined with a multilayer perceptron and is able to automatically generate power planes across a diverse set of problems with varying levels of difficulty. Our method GOMLP consists of an outer loop genetic optimizer (GO) and an inner loop multi-layer perceptron (MLP) that generate power planes automatically. The critical elements of our approach include contour detection, feature expansion, and a distance measure to enable island-minimizing complex power plane generation. We compare our approach to a baseline solution based on A*. The A* method consisting of a sequential island generation and merging process which can produce less than ideal solutions. Our experimental results show that on single layer power plane problems, our method outperforms A* in 71% of the problems with varying levels of board layout difficulty. We further describe H-GOMLP, which extends GOMLP to multilayer power plane problems using hierarchical clustering and net similarities based on the Hausdorff distance.
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Submitted 2 November, 2022; v1 submitted 27 October, 2022;
originally announced October 2022.