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Showing 1–3 of 3 results for author: Sinclair, K

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  1. arXiv:2411.17703  [pdf, other

    physics.space-ph cs.LG

    Probabilistic Forecasting of Radiation Exposure for Spaceflight

    Authors: Rutuja Gurav, Elena Massara, Xiaomei Song, Kimberly Sinclair, Edward Brown, Matt Kusner, Bala Poduval, Atilim Gunes Baydin

    Abstract: Extended human presence beyond low-Earth orbit (BLEO) during missions to the Moon and Mars will pose significant challenges in the near future. A primary health risk associated with these missions is radiation exposure, primarily from galatic cosmic rays (GCRs) and solar proton events (SPEs). While GCRs present a more consistent, albeit modulated threat, SPEs are harder to predict and can deliver… ▽ More

    Submitted 11 November, 2024; originally announced November 2024.

  2. arXiv:2311.07887  [pdf

    cs.CR cs.HC

    Challenges of Securing Massively Multiplayer Online Games

    Authors: Kolten Sinclair, Steven Womack, Jacob Elliott, Benjamin Stafford, Sundar Krishnan

    Abstract: When it comes to security in the modern world, things have improved a lot since the early 2000s. Hypertext Transfer Protocol Secure (HTTPS) and Transport Layer Security (TLS) have made the transfer of our data across the internet much safer than years prior, and the advent of VPNs and private browsing have only compounded that. However, the gaming industry has been notoriously behind the curve whe… ▽ More

    Submitted 13 November, 2023; originally announced November 2023.

  3. arXiv:0805.0943  [pdf

    cs.OH

    Open Ended Microwave Oven for Packaging

    Authors: K. I. Sinclair, T. Tilford, M. Y. P. Desmulliez, G. Goussetis, C. Bailey, K. Parrott, A. J. Sangster

    Abstract: A novel open waveguide cavity resonator is presented for the combined variable frequency microwave curing of bumps, underfills and encapsulants, as well as the alignment of devices for fast flip-chip assembly, direct chip attach (DCA) or wafer-scale level packaging (WSLP). This technology achieves radio frequency (RF) curing of adhesives used in microelectronics, optoelectronics and medical devi… ▽ More

    Submitted 7 May, 2008; originally announced May 2008.

    Comments: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)

    Journal ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)