Modeling and Simulating Emerging Memory Technologies: A Tutorial
Authors:
Yun-Chih Chen,
Tristan Seidl,
Nils Hölscher,
Christian Hakert,
Minh Duy Truong,
Jian-Jia Chen,
João Paulo C. de Lima,
Asif Ali Khan,
Jeronimo Castrillon,
Ali Nezhadi,
Lokesh Siddhu,
Hassan Nassar,
Mahta Mayahinia,
Mehdi Baradaran Tahoori,
Jörg Henkel,
Nils Wilbert,
Stefan Wildermann,
Jürgen Teich
Abstract:
Non-volatile Memory (NVM) technologies present a promising alternative to traditional volatile memories such as SRAM and DRAM. Due to the limited availability of real NVM devices, simulators play a crucial role in architectural exploration and hardware-software co-design. This tutorial presents a simulation toolchain through four detailed case studies, showcasing its applicability to various domai…
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Non-volatile Memory (NVM) technologies present a promising alternative to traditional volatile memories such as SRAM and DRAM. Due to the limited availability of real NVM devices, simulators play a crucial role in architectural exploration and hardware-software co-design. This tutorial presents a simulation toolchain through four detailed case studies, showcasing its applicability to various domains of system design, including hybrid main-memory and cache, compute-in-memory, and wear-leveling design. These case studies provide the reader with practical insights on customizing the toolchain for their specific research needs. The source code is open-sourced.
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Submitted 10 March, 2025; v1 submitted 14 February, 2025;
originally announced February 2025.
CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems
Authors:
Lokesh Siddhu,
Rajesh Kedia,
Shailja Pandey,
Martin Rapp,
Anuj Pathania,
Jörg Henkel,
Preeti Ranjan Panda
Abstract:
Processing cores and the accompanying main memory working in tandem enable the modern processors. Dissipating heat produced from computation, memory access remains a significant problem for processors. Therefore, processor thermal management continues to be an active research topic. Most thermal management research takes place using simulations, given the challenges of measuring temperature in rea…
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Processing cores and the accompanying main memory working in tandem enable the modern processors. Dissipating heat produced from computation, memory access remains a significant problem for processors. Therefore, processor thermal management continues to be an active research topic. Most thermal management research takes place using simulations, given the challenges of measuring temperature in real processors. Since core and memory are fabricated on separate packages in most existing processors, with the memory having lower power densities, thermal management research in processors has primarily focused on the cores.
Memory bandwidth limitations associated with 2D processors lead to high-density 2.5D and 3D packaging technology. 2.5D packaging places cores and memory on the same package. 3D packaging technology takes it further by stacking layers of memory on the top of cores themselves. Such packagings significantly increase the power density, making processors prone to heating. Therefore, mitigating thermal issues in high-density processors (packaged with stacked memory) becomes an even more pressing problem. However, given the lack of thermal modeling for memories in existing interval thermal simulation toolchains, they are unsuitable for studying thermal management for high-density processors.
To address this issue, we present CoMeT, the first integrated Core and Memory interval Thermal simulation toolchain. CoMeT comprehensively supports thermal simulation of high- and low-density processors corresponding to four different core-memory configurations - off-chip DDR memory, off-chip 3D memory, 2.5D, and 3D. CoMeT supports several novel features that facilitate overlying system research. Compared to an equivalent state-of-the-art core-only toolchain, CoMeT adds only a ~5% simulation-time overhead. The source code of CoMeT has been made open for public use under the MIT license.
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Submitted 16 March, 2022; v1 submitted 25 September, 2021;
originally announced September 2021.
