Showing 1–1 of 1 results for author: Rimskog, M

High Density Through Silicon Via (TSV)

Authors: Magnus Rimskog, Tomas Bauer

Abstract: The Through Silicon Via (TSV) process developed by Silex provides down to 30 micrometers pitch for through wafer connections in up to 600 micrometers thick substrates. Integrated with MEMS designs it enables significantly reduced die size and true "Wafer Level Packaging" - features that are particularly important in consumer market applications. The TSV technology also enables integration of adv… ▽ More The Through Silicon Via (TSV) process developed by Silex provides down to 30 micrometers pitch for through wafer connections in up to 600 micrometers thick substrates. Integrated with MEMS designs it enables significantly reduced die size and true "Wafer Level Packaging" - features that are particularly important in consumer market applications. The TSV technology also enables integration of advanced interconnect functions in optical MEMS, sensors and microfluidic devices. In addition the Via technology opens for very interesting possibilities considering integration with CMOS processing. With several companies using the process already today, qualified volume manufacturing in place and a line-up of potential users, the process is becoming a standard in the MEMS industry. We provide a introduction to the via formation process and also present some on the novel solutions made available by the technology. △ Less

Submitted 7 May, 2008; originally announced May 2008.

Comments: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)

Journal ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)