Enabling and Optimizing Pilot Jobs using Xen based Virtual Machines for the HPC Grid Applications
Authors:
Omer Khalid,
Richard Anthony,
Paul Nillson,
Kate Keahey,
Markus Schulz,
Miltos Petridis,
Kevin Parrott
Abstract:
The primary motivation for uptake of virtualization have been resource isolation, capacity management and resource customization: isolation and capacity management allow providers to isolate users from the site and control their resources usage while customization allows end-users to easily project the required environment onto a variety of sites. Various approaches have been taken to integrate…
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The primary motivation for uptake of virtualization have been resource isolation, capacity management and resource customization: isolation and capacity management allow providers to isolate users from the site and control their resources usage while customization allows end-users to easily project the required environment onto a variety of sites. Various approaches have been taken to integrate virtualization with Grid technologies. In this paper, we propose an approach that combines virtualization on the existing software infrastructure such as Pilot Jobs with minimum change on the part of resource providers.
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Submitted 5 June, 2009;
originally announced June 2009.
Open Ended Microwave Oven for Packaging
Authors:
K. I. Sinclair,
T. Tilford,
M. Y. P. Desmulliez,
G. Goussetis,
C. Bailey,
K. Parrott,
A. J. Sangster
Abstract:
A novel open waveguide cavity resonator is presented for the combined variable frequency microwave curing of bumps, underfills and encapsulants, as well as the alignment of devices for fast flip-chip assembly, direct chip attach (DCA) or wafer-scale level packaging (WSLP). This technology achieves radio frequency (RF) curing of adhesives used in microelectronics, optoelectronics and medical devi…
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A novel open waveguide cavity resonator is presented for the combined variable frequency microwave curing of bumps, underfills and encapsulants, as well as the alignment of devices for fast flip-chip assembly, direct chip attach (DCA) or wafer-scale level packaging (WSLP). This technology achieves radio frequency (RF) curing of adhesives used in microelectronics, optoelectronics and medical devices with potential simultaneous micron-scale alignment accuracy and bonding of devices. In principle, the open oven cavity can be fitted directly onto a flip-chip or wafer scale bonder and, as such, will allow for the bonding of devices through localised heating thus reducing the risk to thermally sensitive devices. Variable frequency microwave (VFM) heating and curing of an idealised polymer load is numerically simulated using a multi-physics approach. Electro-magnetic fields within a novel open ended microwave oven developed for use in micro-electronics manufacturing applications are solved using a de icated Yee scheme finite-difference time-domain (FDTD) solver. Temperature distribution, degree of cure and thermal stresses are analysed using an Unstructured Finite Volume method (UFVM) multi-physics package. The polymer load was meshed for thermophysical analysis, whilst the microwave cavity - encompassing the polymer load - was meshed for microwave irradiation. The two solution domains are linked using a cross-mapping routine. The principle of heating using the evanescent fringing fields within the open-end of the cavity is demonstrated. A closed loop feedback routine is established allowing the temperature within a lossy sample to be controlled. A distribution of the temperature within the lossy sample is obtained by using a thermal imaging camera.
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Submitted 7 May, 2008;
originally announced May 2008.
