Skip to main content

Showing 1–8 of 8 results for author: Liu, Y C

Searching in archive cs. Search in all archives.
.
  1. arXiv:2406.09608  [pdf, other

    cs.HC cs.RO

    Human-Machine Interface Evaluation Using EEG in Driving Simulator

    Authors: Y. C. Liu, N. Figalova, M. Baumann, K Bengler

    Abstract: Automated vehicles are pictured as the future of transportation, and facilitating safer driving is only one of the many benefits. However, due to the constantly changing role of the human driver, users are easily confused and have little knowledge about their responsibilities. Being the bridge between automation and human, the human-machine interface (HMI) is of great importance to driving safety.… ▽ More

    Submitted 13 June, 2024; originally announced June 2024.

    Journal ref: 2023 IEEE Intelligent Vehicles Symposium (IV), Anchorage, AK, USA, 2023, pp. 1-6

  2. arXiv:2306.15584  [pdf, ps, other

    cs.PL

    DrNLA: Extending Verification to Non-linear Programs through Dual Re-writing

    Authors: Yuandong Cyrus Liu, Ton-Chanh Le, Timos Antonopoulos, Eric Koskinen, ThanhVu Nguyen

    Abstract: For many decades, advances in static verification have focused on linear integer arithmetic (LIA) programs. Many real-world programs are, however, written with non-linear integer arithmetic (NLA) expressions, such as programs that model physical events, control systems, or nonlinear activation functions in neural networks. While there are some approaches to reasoning about such NLA programs, still… ▽ More

    Submitted 27 June, 2023; originally announced June 2023.

  3. arXiv:2305.13931  [pdf, other

    cs.IR

    Position Bias Estimation with Item Embedding for Sparse Dataset

    Authors: Shion Ishikawa, Yun Ching Liu, Young-Joo Chung, Yu Hirate

    Abstract: Estimating position bias is a well-known challenge in Learning to Rank (L2R). Click data in e-commerce applications, such as targeted advertisements and search engines, provides implicit but abundant feedback to improve personalized rankings. However, click data inherently includes various biases like position bias. Based on the position-based click model, Result Randomization and Regression Expec… ▽ More

    Submitted 11 March, 2024; v1 submitted 9 May, 2023; originally announced May 2023.

  4. arXiv:2111.02938  [pdf, ps, other

    cs.PL

    Source-Level Bitwise Branching for Temporal Verification

    Authors: Yuandong Cyrus Liu, Ton-Chanh Le, Eric Koskinen

    Abstract: There is increasing interest in applying verification tools to programs that have bitvector operations. SMT solvers, which serve as a foundation for these tools, have thus increased support for bitvector reasoning through bit-blasting and linear arithmetic approximations. Still, verification tools are limited on termination and LTL verification of bitvector programs. In this work, we show that sim… ▽ More

    Submitted 4 November, 2021; originally announced November 2021.

    Comments: 2 pages, 1 figure, 1 table, accepted to FMCAD2021 Student Forum. arXiv admin note: substantial text overlap with arXiv:2105.05159

  5. End-to-end Neural Diarization: From Transformer to Conformer

    Authors: Yi Chieh Liu, Eunjung Han, Chul Lee, Andreas Stolcke

    Abstract: We propose a new end-to-end neural diarization (EEND) system that is based on Conformer, a recently proposed neural architecture that combines convolutional mappings and Transformer to model both local and global dependencies in speech. We first show that data augmentation and convolutional subsampling layers enhance the original self-attentive EEND in the Transformer-based EEND, and then Conforme… ▽ More

    Submitted 14 June, 2021; originally announced June 2021.

    Comments: To appear in Interspeech 2021

    Journal ref: Proc. Interspeech, Sept. 2021, pp. 3081-3085

  6. arXiv:2105.05159  [pdf, ps, other

    cs.PL cs.FL cs.SE eess.SY

    Proving LTL Properties of Bitvector Programs and Decompiled Binaries (Extended)

    Authors: Yuandong Cyrus Liu, Chengbin Pang, Daniel Dietsch, Eric Koskinen, Ton-Chanh Le, Georgios Portokalidis, Jun Xu

    Abstract: There is increasing interest in applying verification tools to programs that have bitvector operations (eg., binaries). SMT solvers, which serve as a foundation for these tools, have thus increased support for bitvector reasoning through bit-blasting and linear arithmetic approximations. In this paper we show that similar linear arithmetic approximation of bitvector operations can be done at the s… ▽ More

    Submitted 28 August, 2021; v1 submitted 11 May, 2021; originally announced May 2021.

    Comments: 39 pages(including Appendix), 10 tables, 4 Postscript figures, accepted to APLAS 2021

  7. arXiv:0805.0872  [pdf

    cs.OH

    Study of mechanical response in embossing of ceramic green substrate by micro-indentation

    Authors: Y. C. Liu, X. -C. Shan

    Abstract: Micro-indentation test with a micro flat-end cone indenter was employed to simulate micro embossing process and investigate the thermo-mechanical response of ceramic green substrates. The laminated low temperature co-fired ceramic green tapes were used as the testing material ; the correlations of indentation depth versus applied force and applied stress at the temperatures of 25 degrees C and 7… ▽ More

    Submitted 7 May, 2008; originally announced May 2008.

    Comments: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)

    Journal ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)

  8. arXiv:0802.3106  [pdf

    cs.OH

    Studies of Polymer Deformation and Recovery in Hot Embossing

    Authors: X. C. Shan, Y. C. Liu, H. J. Lu, Z. F. Wang, Y. C. Lam

    Abstract: In large area micro hot embossing, the process temperature plays a critical role to both the local fidelity of microstructure formation and global uniformity. The significance of low temperature hot embossing is to improve global flatness of embossed devices. This paper reports on experimental studies of polymer deformation and relaxation in micro embossing when the process temperatures are belo… ▽ More

    Submitted 21 February, 2008; originally announced February 2008.

    Comments: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing)

    Journal ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)