Hybrid 2D/3D photonic integration for non-planar circuit topologies
Authors:
Aleksandar Nesic,
Matthias Blaicher,
Tobias Hoose,
Andreas Hofmann,
Matthias Lauermann,
Yasar Kutuvantavida,
Martin Nöllenburg,
Sebastian Randel,
Wolfgang Freude,
Christian Koos
Abstract:
Complex photonic integrated circuits (PIC) may have strongly non-planar topologies that require waveguide crossings (WGX) when realized in single-layer integration platforms. The number of WGX increases rapidly with the complexity of the circuit, in particular when it comes to highly interconnected optical switch topologies. Here, we present a concept for WGX-free PIC that rely on 3D-printed freef…
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Complex photonic integrated circuits (PIC) may have strongly non-planar topologies that require waveguide crossings (WGX) when realized in single-layer integration platforms. The number of WGX increases rapidly with the complexity of the circuit, in particular when it comes to highly interconnected optical switch topologies. Here, we present a concept for WGX-free PIC that rely on 3D-printed freeform waveguide overpasses (WOP). We experimentally demonstrate the viability of our approach using the example of a $4 \times 4$ switch-and-select (SAS) circuit realized on the silicon photonic platform. We further present a comprehensive graph-theoretical analysis of different $n \times n$ SAS circuit topologies. We find that for increasing port counts $n$ of the SAS circuit, the number of WGX increases with $n^4$, whereas the number of WOP increases only in proportion to $n^2$.
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Submitted 24 January, 2019;
originally announced January 2019.
