-
Adaptive Linear Embedding for Nonstationary High-Dimensional Optimization
Authors:
Yuejiang Wen,
Paul D. Franzon
Abstract:
Bayesian Optimization (BO) in high-dimensional spaces remains fundamentally limited by the curse of dimensionality and the rigidity of global low-dimensional assumptions. While Random EMbedding Bayesian Optimization (REMBO) mitigates this via linear projections into low-dimensional subspaces, it typically assumes a single global embedding and a stationary objective. In this work, we introduce Self…
▽ More
Bayesian Optimization (BO) in high-dimensional spaces remains fundamentally limited by the curse of dimensionality and the rigidity of global low-dimensional assumptions. While Random EMbedding Bayesian Optimization (REMBO) mitigates this via linear projections into low-dimensional subspaces, it typically assumes a single global embedding and a stationary objective. In this work, we introduce Self-Adaptive embedding REMBO (SA-REMBO), a novel framework that generalizes REMBO to support multiple random Gaussian embeddings, each capturing a different local subspace structure of the high-dimensional objective. An index variable governs the embedding choice and is jointly modeled with the latent optimization variable via a product kernel in a Gaussian Process surrogate. This enables the optimizer to adaptively select embeddings conditioned on location, effectively capturing locally varying effective dimensionality, nonstationarity, and heteroscedasticity in the objective landscape. We theoretically analyze the expressiveness and stability of the index-conditioned product kernel and empirically demonstrate the advantage of our method across synthetic and real-world high-dimensional benchmarks, where traditional REMBO and other low-rank BO methods fail. Our results establish SA-REMBO as a powerful and flexible extension for scalable BO in complex, structured design spaces.
△ Less
Submitted 16 May, 2025;
originally announced May 2025.
-
Towards 3D AI Hardware: Fine-Grain Hardware Characterization of 3D Stacks for Heterogeneous System Integration & AI Systems
Authors:
Eren Kurshan,
Paul Franzon
Abstract:
3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication constraints, reduces on-chip latency and total power dissipation. Moreover, AIs demand for increased computational power, larger GPU cache capacity, energy effici…
▽ More
3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication constraints, reduces on-chip latency and total power dissipation. Moreover, AIs demand for increased computational power, larger GPU cache capacity, energy efficiency and low power custom AI hardware integration all serve as drivers for 3D integration. Although 3D advantages such as enhanced interconnectivity and increased performance have been demonstrated through numerous technology sites, heterogeneous 3D system design raises numerous unanswered questions. Among the primary challenges are the temperature and lifetime reliability issues caused by the complex interaction patterns among system components. Such interactions are harder to model with current modeling tools and require detailed hardware characterization. This study presents the latest drivers for 3D integration and the resulting need for hardware emulation frameworks. It then presents a design to profile power, temperature, noise, inter-layer bandwidth and lifetime reliability characterization that can emulate a wide range of stacking alternatives. This framework allows for controlling activity levels at the macro-level, along with customized sensor infrastructure to characterize heat propagation, inter-layer noise, power delivery, reliability and inter-connectivity as well as the interactions among critical design objectives.
△ Less
Submitted 31 August, 2024;
originally announced September 2024.
-
Analyzing Quantum Circuit Depth Reduction with Ancilla Qubits in MCX Gates
Authors:
Ahmad Bennakhi,
Paul Franzon,
Gregory T. Byrd
Abstract:
This paper aims to give readers a high-level overview of the different MCX depth reduction techniques that utilize ancilla qubits. We also exhibit a brief analysis of how they would perform under different quantum topological settings. The techniques examined are recursion and v-chain, as they are the most commonly used techniques in the most popular quantum computing libraries, Qiskit. The target…
▽ More
This paper aims to give readers a high-level overview of the different MCX depth reduction techniques that utilize ancilla qubits. We also exhibit a brief analysis of how they would perform under different quantum topological settings. The techniques examined are recursion and v-chain, as they are the most commonly used techniques in the most popular quantum computing libraries, Qiskit. The target audience of this paper is people who do not have intricate mathematical or physics knowledge related to quantum computing.
△ Less
Submitted 2 August, 2024;
originally announced August 2024.
-
Can Low-Rank Knowledge Distillation in LLMs be Useful for Microelectronic Reasoning?
Authors:
Nirjhor Rouf,
Fin Amin,
Paul D. Franzon
Abstract:
In this work, we present empirical results regarding the feasibility of using offline large language models (LLMs) in the context of electronic design automation (EDA). The goal is to investigate and evaluate a contemporary language model's (Llama-2-7B) ability to function as a microelectronic Q & A expert as well as its reasoning, and generation capabilities in solving microelectronic-related pro…
▽ More
In this work, we present empirical results regarding the feasibility of using offline large language models (LLMs) in the context of electronic design automation (EDA). The goal is to investigate and evaluate a contemporary language model's (Llama-2-7B) ability to function as a microelectronic Q & A expert as well as its reasoning, and generation capabilities in solving microelectronic-related problems. Llama-2-7B was tested across a variety of adaptation methods, including introducing a novel low-rank knowledge distillation (LoRA-KD) scheme. Our experiments produce both qualitative and quantitative results.
△ Less
Submitted 27 June, 2024; v1 submitted 19 June, 2024;
originally announced June 2024.
-
Large Reasoning Models for 3D Floorplanning in EDA: Learning from Imperfections
Authors:
Fin Amin,
Nirjhor Rouf,
Tse-Han Pan,
Md Kamal Ibn Shafi,
Paul D. Franzon
Abstract:
In this paper, we introduce Dreamweaver, which belongs to a new class of auto-regressive decision-making models known as large reasoning models (LRMs). Dreamweaver is designed to improve 3D floorplanning in electronic design automation (EDA) via an architecture that melds advancements in sequence-to-sequence reinforcement learning algorithms. A significant advantage of our approach is its ability…
▽ More
In this paper, we introduce Dreamweaver, which belongs to a new class of auto-regressive decision-making models known as large reasoning models (LRMs). Dreamweaver is designed to improve 3D floorplanning in electronic design automation (EDA) via an architecture that melds advancements in sequence-to-sequence reinforcement learning algorithms. A significant advantage of our approach is its ability to effectively reason over large discrete action spaces, which is essential for handling the numerous potential positions for various functional blocks in floorplanning. Additionally, Dreamweaver demonstrates strong performance even when trained on entirely random trajectories, showcasing its capacity to leverage sub-optimal or non-expert trajectories to enhance its results. This innovative approach contributes to streamlining the integrated circuit (IC) design flow and reducing the high computational costs typically associated with floorplanning. We evaluate its performance against a current state-of-the-art method, highlighting notable improvements.
△ Less
Submitted 21 June, 2024; v1 submitted 15 June, 2024;
originally announced June 2024.
-
Design Rule Checking with a CNN Based Feature Extractor
Authors:
Luis Francisco,
Tanmay Lagare,
Arpit Jain,
Somal Chaudhary,
Madhura Kulkarni,
Divya Sardana,
W. Rhett Davis,
Paul Franzon
Abstract:
Design rule checking (DRC) is getting increasingly complex in advanced nodes technologies. It would be highly desirable to have a fast interactive DRC engine that could be used during layout. In this work, we establish the proof of feasibility for such an engine. The proposed model consists of a convolutional neural network (CNN) trained to detect DRC violations. The model was trained with artific…
▽ More
Design rule checking (DRC) is getting increasingly complex in advanced nodes technologies. It would be highly desirable to have a fast interactive DRC engine that could be used during layout. In this work, we establish the proof of feasibility for such an engine. The proposed model consists of a convolutional neural network (CNN) trained to detect DRC violations. The model was trained with artificial data that was derived from a set of $50$ SRAM designs. The focus in this demonstration was metal 1 rules. Using this solution, we can detect multiple DRC violations 32x faster than Boolean checkers with an accuracy of up to 92. The proposed solution can be easily expanded to a complete rule set.
△ Less
Submitted 21 December, 2020;
originally announced December 2020.
