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US Microelectronics Packaging Ecosystem: Challenges and Opportunities
Authors:
Rouhan Noor,
Himanandhan Reddy Kottur,
Patrick J Craig,
Liton Kumar Biswas,
M Shafkat M Khan,
Nitin Varshney,
Hamed Dalir,
Elif Akçalı,
Bahareh Ghane Motlagh,
Charles Woychik,
Yong-Kyu Yoon,
Navid Asadizanjani
Abstract:
The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more features into the silicon footprint. One promising approach is Heterogeneous Integration (HI), which involves advanced packaging techniques to integrate indepe…
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The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more features into the silicon footprint. One promising approach is Heterogeneous Integration (HI), which involves advanced packaging techniques to integrate independently designed and manufactured components using the most suitable process technology. However, adopting HI introduces design and security challenges. To enable HI, research and development of advanced packaging is crucial. The existing research raises the possible security threats in the advanced packaging supply chain, as most of the Outsourced Semiconductor Assembly and Test (OSAT) facilities/vendors are offshore. To deal with the increasing demand for semiconductors and to ensure a secure semiconductor supply chain, there are sizable efforts from the United States (US) government to bring semiconductor fabrication facilities onshore. However, the US-based advanced packaging capabilities must also be ramped up to fully realize the vision of establishing a secure, efficient, resilient semiconductor supply chain. Our effort was motivated to identify the possible bottlenecks and weak links in the advanced packaging supply chain based in the US.
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Submitted 30 October, 2023; v1 submitted 17 October, 2023;
originally announced October 2023.
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From Talent Shortage to Workforce Excellence in the CHIPS Act Era: Harnessing Industry 4.0 Paradigms for a Sustainable Future in Domestic Chip Production
Authors:
Aida Damanpak Rizi,
Antika Roy,
Rouhan Noor,
Hyo Kang,
Nitin Varshney,
Katja Jacob,
Sindia Rivera-Jimenez,
Nathan Edwards,
Volker J. Sorger,
Hamed Dalir,
Navid Asadizanjani
Abstract:
The CHIPS Act is driving the U.S. towards a self-sustainable future in domestic chip production. Decades of outsourced manufacturing, assembly, testing, and packaging has diminished the workforce ecosystem, imposing major limitations on semiconductor companies racing to build new fabrication sites as part of the CHIPS Act. In response, a systemic alliance between academic institutions, the industr…
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The CHIPS Act is driving the U.S. towards a self-sustainable future in domestic chip production. Decades of outsourced manufacturing, assembly, testing, and packaging has diminished the workforce ecosystem, imposing major limitations on semiconductor companies racing to build new fabrication sites as part of the CHIPS Act. In response, a systemic alliance between academic institutions, the industry, government, various consortiums, and organizations has emerged to establish a pipeline to educate and onboard the next generation of talent. Establishing a stable and continuous flow of talent requires significant time investments and comes with no guarantees, particularly factoring in the low workplace desirability in current fabrication houses for U.S workforce. This paper will explore the feasibility of two paradigms of Industry 4.0, automation and Augmented Reality(AR)/Virtual Reality(VR), to complement ongoing workforce development efforts and optimize workplace desirability by catalyzing core manufacturing processes and effectively enhancing the education, onboarding, and professional realms-all with promising capabilities amid the ongoing talent shortage and trajectory towards advanced packaging.
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Submitted 31 July, 2023;
originally announced August 2023.
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Integrated Photonic FFT for Optical Convolutions towards Efficient and High-Speed Neural Networks
Authors:
Moustafa Ahmed,
Yas Al-Hadeethi,
Ahmed Bakry,
Hamed Dalir,
Volker J. Sorger
Abstract:
The technologically-relevant task of feature extraction from data performed in deep-learning systems is routinely accomplished as repeated fast Fourier transforms (FFT) electronically in prevalent domain-specific architectures such as in graphics processing units (GPUs). However, electronics systems are limited with respect to power dissipation and delay, both, due to wire-charging challenges rela…
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The technologically-relevant task of feature extraction from data performed in deep-learning systems is routinely accomplished as repeated fast Fourier transforms (FFT) electronically in prevalent domain-specific architectures such as in graphics processing units (GPUs). However, electronics systems are limited with respect to power dissipation and delay, both, due to wire-charging challenges related to interconnect capacitance. Here we present a silicon photonics-based architecture for convolutional neural networks that harnesses the phase property of light to perform FFTs efficiently by executing the convolution as a multiplication in the Fourier-domain. The algorithmic executing time is determined by the time-of-flight of the signal through this photonic reconfigurable passive FFT filter circuit and is on the order of 10s of picosecond. A sensitivity analysis shows that this optical processor must be thermally phase stabilized corresponding to a few degrees. Furthermore, we find that for a small sample number, the obtainable number of convolutions per {time-power-chip area) outperforms GPUs by about 2 orders of magnitude. Lastly, we show that, conceptually, the optical FFT and convolution-processing performance is indeed directly linked to optoelectronic device-level, and improvements in plasmonics, metamaterials or nanophotonics are fueling next generation densely interconnected intelligent photonic circuits with relevance for edge-computing 5G networks.
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Submitted 23 March, 2020; v1 submitted 1 February, 2020;
originally announced February 2020.
