NSF Integrated Circuit Research, Education and Workforce Development Workshop Final Report
Authors:
M. Guthaus,
C. Batten,
E. Brunvand,
P. E. Gaillardon,
D. harris,
R. Manohar,
P. Mazumder,
L. Pileggi,
J. Stine
Abstract:
As the pace of progress that has followed Moore's law continues to diminish, it is critical that the US support Integrated Circuit (IC or chip) education and research to maintain technological innovation. Furthermore, US economic independence, security, and future international standing rely on having on-shore IC design capabilities. New devices with disparate technologies, improved design softwar…
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As the pace of progress that has followed Moore's law continues to diminish, it is critical that the US support Integrated Circuit (IC or chip) education and research to maintain technological innovation. Furthermore, US economic independence, security, and future international standing rely on having on-shore IC design capabilities. New devices with disparate technologies, improved design software toolchains and methodologies, and technologies to integrate heterogeneous systems will be needed to advance IC design capabilities. This will require rethinking both how we teach design to address the new complexity and how we inspire student interest in a hardware systems career path. The main recommendation of this workshop is that accessibility is the key issue. To this end, a National Chip Design Center (NCDC) should be established to further research and education by partnering academics and industry to train our future workforce. This should not be limited to R1 universities, but should also include R2, community college, minority serving institutions (MSI), and K-12 institutions to have the broadest effect. The NCDC should support the access, development, and maintenance of open design tools, tool flows, design kits, design components, and educational materials. Open-source options should be emphasized wherever possible to maximize accessibility. The NCDC should also provide access and support for chip fabrication, packaging and testing for both research and educational purposes.
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Submitted 3 November, 2023;
originally announced November 2023.
