Showing 1–2 of 2 results for author: Xu, Y L

Pressure induced Structure Change and Anomalies in Thermodynamic Quantities and Transport Properties in Liquid Lithium Hydride

Authors: X. Z. Yan, Y. M. Chen, Hua Y. Geng, Y. F. Wang, Y. Sun, L. L. Zhang, H. Wang, Y. L. Xu

Abstract: Understand the nature of liquid structure and its evolution under different conditions is a major challenge in condensed physics and materials science. Here, we report a pressure-induced structure change spanning a wide pressure range in liquid-state lithium hydride (LiH) by first-principles molecular dynamic simulations. This behavior can be described as a continuous crossover from low pressure l… ▽ More Understand the nature of liquid structure and its evolution under different conditions is a major challenge in condensed physics and materials science. Here, we report a pressure-induced structure change spanning a wide pressure range in liquid-state lithium hydride (LiH) by first-principles molecular dynamic simulations. This behavior can be described as a continuous crossover from low pressure liquid with Li$^+$-H$^-$ duality symmetry to high pressure one with broken of duality symmetry. The thermodynamic quantities such as heat capacity and ionic transport properties such as diffusivity are also saliently impacted. It is important to stress that such behavior is firstly predicted for this category of materials, which is ubiquitous in universe as well as in industry applications. Lastly, a comprehensive high-pressure high-temperature phase diagram of LiH is constructed, which embodies rich physics in this previously-thought-simple ionic compound. △ Less

Submitted 26 January, 2025; originally announced January 2025.

Comments: 23 pages, 4 figures, with Supplementary Information

Journal ref: Phys. Rev. B 111, 024102 (2025)

The role of microstructure in the thermal fatigue of solder joints

Authors: J. W. Xian, Y. L. Xu, S. Stoyanov, R. J. Coyle, F. P. E. Dunne, C. M. Gourlay

Abstract: Thermal fatigue is a common failure mode in electronic solder joints, yet the role of microstructure is incompletely understood. Here, we quantify the evolution of microstructure and damage in Sn-3Ag-0.5Cu joints throughout a ball grid array (BGA) package using EBSD mapping of localised subgrains, recrystallisation and heavily coarsened Ag3Sn. We then interpret the results with a multi-scale model… ▽ More Thermal fatigue is a common failure mode in electronic solder joints, yet the role of microstructure is incompletely understood. Here, we quantify the evolution of microstructure and damage in Sn-3Ag-0.5Cu joints throughout a ball grid array (BGA) package using EBSD mapping of localised subgrains, recrystallisation and heavily coarsened Ag3Sn. We then interpret the results with a multi-scale modelling approach that links from a continuum model at the package/board scale through to a crystal plasticity finite element model at the microstructure scale. We measure and explain the dependence of damage evolution on (i) the beta-Sn crystal orientation(s) in single and multigrain joints, and (ii) the coefficient of thermal expansion (CTE) mismatch between tin grains in cyclic twinned multigrain joints. We further explore the relative importance of the solder microstructure versus the joint location in the array. The results provide a basis for designing optimum solder joint microstructures for thermal fatigue resistance. △ Less

Submitted 29 May, 2024; v1 submitted 7 November, 2023; originally announced November 2023.