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Strain-Enhanced Mobility of Monolayer MoS2
Authors:
Isha M. Datye,
Alwin Daus,
Ryan W. Grady,
Kevin Brenner,
Sam Vaziri,
Eric Pop
Abstract:
Strain engineering is an important method for tuning the properties of semiconductors and has been used to improve the mobility of silicon transistors for several decades. Recently, theoretical studies have predicted that strain can also improve the mobility of two-dimensional (2D) semiconductors, e.g. by reducing intervalley scattering or lowering effective masses. Here, we experimentally show st…
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Strain engineering is an important method for tuning the properties of semiconductors and has been used to improve the mobility of silicon transistors for several decades. Recently, theoretical studies have predicted that strain can also improve the mobility of two-dimensional (2D) semiconductors, e.g. by reducing intervalley scattering or lowering effective masses. Here, we experimentally show strain-enhanced electron mobility in monolayer MoS2 transistors with uniaxial tensile strain, on flexible substrates. The on-state current and mobility are nearly doubled with tensile strain up to 0.7%, and devices return to their initial state after release of strain. We also show a gate-voltage-dependent gauge factor up to 200 for monolayer MoS2, which is higher than previous values reported for sub-1 nm thin piezoresistive films. These results demonstrate the importance of strain engineering 2D semiconductors for performance enhancements in integrated circuits, or for applications such as flexible strain sensors.
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Submitted 5 October, 2022; v1 submitted 8 May, 2022;
originally announced May 2022.
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Vibrational Properties of a Naturally Occurring Semiconducting van der Waals heterostructure
Authors:
V. Z. Costa,
Liangbo Liang,
Sam Vaziri,
Addison Miller,
Eric Pop,
A. K. M. Newaz
Abstract:
We present vibrational properties of Franckeite, which is a naturally occurring van der Waals heterostructure consisting of two different semiconducting layers. Franckeite is a complex layered crystal composed of alternating SnS$_2$ like pseudohexagonal and PbS-like pseudotetragonal layers stacked on top of each other, providing a unique platform to study vibrational properties and thermal transpo…
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We present vibrational properties of Franckeite, which is a naturally occurring van der Waals heterostructure consisting of two different semiconducting layers. Franckeite is a complex layered crystal composed of alternating SnS$_2$ like pseudohexagonal and PbS-like pseudotetragonal layers stacked on top of each other, providing a unique platform to study vibrational properties and thermal transport across layers with mass density and phonon mismatches. By using micro-Raman spectroscopy and first-principles Raman simulations, we found that the PbS-like pseudotetragonal structure is mostly composed of Pb$_3$SbS$_4$. We also discovered several low-frequency Raman modes that originate from the intralayer vibrations of the pseudotetragonal layer. Using density functional theory, we determined all vibrational patterns of Franckeite, whose signatures are observed in the Raman spectrum. By studying temperature dependent Raman spectroscopy (300 K - 500 K), we have found different temperature coefficients for both pseudotetragonal and pseudohexagonal layers. We believe that our study will help understand the vibration modes of its complex heterostructure and the thermal properties at the nanoscale.
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Submitted 15 July, 2021;
originally announced July 2021.
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High-Specific-Power Flexible Transition Metal Dichalcogenide Solar Cells
Authors:
Koosha Nassiri Nazif,
Alwin Daus,
Jiho Hong,
Nayeun Lee,
Sam Vaziri,
Aravindh Kumar,
Frederick Nitta,
Michelle Chen,
Siavash Kananian,
Raisul Islam,
Kwan-Ho Kim,
Jin-Hong Park,
Ada Poon,
Mark L. Brongersma,
Eric Pop,
Krishna C. Saraswat
Abstract:
Semiconducting transition metal dichalcogenides (TMDs) are promising for flexible high-specific-power photovoltaics due to their ultrahigh optical absorption coefficients, desirable band gaps and self-passivated surfaces. However, challenges such as Fermi-level pinning at the metal contact-TMD interface and the inapplicability of traditional doping schemes have prevented most TMD solar cells from…
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Semiconducting transition metal dichalcogenides (TMDs) are promising for flexible high-specific-power photovoltaics due to their ultrahigh optical absorption coefficients, desirable band gaps and self-passivated surfaces. However, challenges such as Fermi-level pinning at the metal contact-TMD interface and the inapplicability of traditional doping schemes have prevented most TMD solar cells from exceeding 2% power conversion efficiency (PCE). In addition, fabrication on flexible substrates tends to contaminate or damage TMD interfaces, further reducing performance. Here, we address these fundamental issues by employing: 1) transparent graphene contacts to mitigate Fermi-level pinning, 2) $\rm{MoO}_\it{x}$ capping for doping, passivation and anti-reflection, and 3) a clean, non-damaging direct transfer method to realize devices on lightweight flexible polyimide substrates. These lead to record PCE of 5.1% and record specific power of $\rm{4.4\ W\,g^{-1}}$ for flexible TMD ($\rm{WSe_2}$) solar cells, the latter on par with prevailing thin-film solar technologies cadmium telluride, copper indium gallium selenide, amorphous silicon and III-Vs. We further project that TMD solar cells could achieve specific power up to $\rm{46\ W\,g^{-1}}$, creating unprecedented opportunities in a broad range of industries from aerospace to wearable and implantable electronics.
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Submitted 24 June, 2021; v1 submitted 19 June, 2021;
originally announced June 2021.
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Chemical vapor deposited graphene: From synthesis to applications
Authors:
Satender Kataria,
Stefan Wagner,
Jasper Ruhkopf,
Aamit Gahoi,
Himadri Pandey,
Rainer Bornemann,
Sam Vaziri,
Anderson D. Smith,
Mikael Östling,
Max C. Lemme
Abstract:
Graphene is a material with enormous potential for numerous applications. Therefore, significant efforts are dedicated to large-scale graphene production using a chemical vapor deposition (CVD) technique. In addition, research is directed at developing methods to incorporate graphene in established production technologies and process flows. In this paper, we present a brief review of available CVD…
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Graphene is a material with enormous potential for numerous applications. Therefore, significant efforts are dedicated to large-scale graphene production using a chemical vapor deposition (CVD) technique. In addition, research is directed at developing methods to incorporate graphene in established production technologies and process flows. In this paper, we present a brief review of available CVD methods for graphene synthesis. We also discuss scalable methods to transfer graphene onto desired substrates. Finally, we discuss potential applications that would benefit from a fully scaled, semiconductor technology compatible production process.
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Submitted 27 March, 2021;
originally announced March 2021.
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High-Performance Flexible Nanoscale Field-Effect Transistors Based on Transition Metal Dichalcogenides
Authors:
Alwin Daus,
Sam Vaziri,
Victoria Chen,
Cagil Koroglu,
Ryan W. Grady,
Connor S. Bailey,
Hye Ryoung Lee,
Kevin Brenner,
Kirstin Schauble,
Eric Pop
Abstract:
Two-dimensional (2D) semiconducting transition metal dichalcogenides (TMDs) are good candidates for high-performance flexible electronics. However, most demonstrations of such flexible field-effect transistors (FETs) to date have been on the micron scale, not benefitting from the short-channel advantages of 2D-TMDs. Here, we demonstrate flexible monolayer MoS2 FETs with the shortest channels repor…
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Two-dimensional (2D) semiconducting transition metal dichalcogenides (TMDs) are good candidates for high-performance flexible electronics. However, most demonstrations of such flexible field-effect transistors (FETs) to date have been on the micron scale, not benefitting from the short-channel advantages of 2D-TMDs. Here, we demonstrate flexible monolayer MoS2 FETs with the shortest channels reported to date (down to 50 nm) and remarkably high on-current (up to 470 uA/um at 1 V drain-to-source voltage) which is comparable to flexible graphene or crystalline silicon FETs. This is achieved using a new transfer method wherein contacts are initially patterned on the rigid TMD growth substrate with nanoscale lithography, then coated with a polyimide (PI) film which becomes the flexible substrate after release, with the contacts and TMD. We also apply this transfer process to other TMDs, reporting the first flexible FETs with MoSe2 and record on-current for flexible WSe2 FETs. These achievements push 2D semiconductors closer to a technology for low-power and high-performance flexible electronics.
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Submitted 5 February, 2021; v1 submitted 8 September, 2020;
originally announced September 2020.
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Ultrahigh Doping of Graphene Using Flame-Deposited MoO3
Authors:
Sam Vaziri,
Victoria Chen,
Lili Cai,
Yue Jiang,
Michelle Chen,
Ryan Grady,
Xiaolin Zheng,
Eric Pop
Abstract:
The expected high performance of graphene-based electronics is often hindered by lack of adequate doping, which causes low carrier density and large sheet resistance. Many reported graphene doping schemes also suffer from instability or incompatibility with existing semiconductor processing. Here we report ultrahigh and stable p-type doping up to ~7x10^13 1/cm^2 (~2x10^21 1/cm^3}) of monolayer gra…
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The expected high performance of graphene-based electronics is often hindered by lack of adequate doping, which causes low carrier density and large sheet resistance. Many reported graphene doping schemes also suffer from instability or incompatibility with existing semiconductor processing. Here we report ultrahigh and stable p-type doping up to ~7x10^13 1/cm^2 (~2x10^21 1/cm^3}) of monolayer graphene grown by chemical vapor deposition. This is achieved by direct polycrystalline MoO3 growth on graphene using a rapid flame synthesis technique. With this approach, the metal-graphene contact resistance for holes is reduced to ~200 Ohm-um. We also demonstrate that flame-deposited MoO3 provides over 5x higher doping of graphene, as well as superior thermal and long-term stability, compared to electron-beam deposited MoO3.
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Submitted 15 August, 2020;
originally announced August 2020.
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Uncovering the Effects of Metal Contacts on Monolayer MoS2
Authors:
Kirstin Schauble,
Dante Zakhidov,
Eilam Yalon,
Sanchit Deshmukh,
Ryan W. Grady,
Kayla A. Cooley,
Connor J. McClellan,
Sam Vaziri,
Donata Passarello,
Suzanne E. Mohney,
Michael F. Toney,
A. K. Sood,
Alberto Salleo,
Eric Pop
Abstract:
Metal contacts are a key limiter to the electronic performance of two-dimensional (2D) semiconductor devices. Here we present a comprehensive study of contact interfaces between seven metals (Y, Sc, Ag, Al, Ti, Au, Ni, with work functions from 3.1 to 5.2 eV) and monolayer MoS2 grown by chemical vapor deposition. We evaporate thin metal films onto MoS2 and study the interfaces by Raman spectroscopy…
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Metal contacts are a key limiter to the electronic performance of two-dimensional (2D) semiconductor devices. Here we present a comprehensive study of contact interfaces between seven metals (Y, Sc, Ag, Al, Ti, Au, Ni, with work functions from 3.1 to 5.2 eV) and monolayer MoS2 grown by chemical vapor deposition. We evaporate thin metal films onto MoS2 and study the interfaces by Raman spectroscopy, X-ray photoelectron spectroscopy, X-ray diffraction, transmission electron microscopy, and electrical characterization. We uncover that, 1) ultrathin oxidized Al dopes MoS2 n-type (> 2x10^12 1/cm^2) without degrading its mobility, 2) Ag, Au, and Ni deposition causes varying levels of damage to MoS2 (broadening Raman E' peak from <3 1/cm to >6 1/cm), and 3) Ti, Sc, and Y react with MoS2. Reactive metals must be avoided in contacts to monolayer MoS2, but control studies reveal the reaction is mostly limited to the top layer of multilayer films. Finally, we find that 4) thin metals do not significantly strain MoS2, as confirmed by X-ray diffraction. These are important findings for metal contacts to MoS2, and broadly applicable to many other 2D semiconductors.
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Submitted 28 July, 2020;
originally announced July 2020.
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Electron Transport across Vertical Silicon / MoS${_2}$ / Graphene Heterostructures: Towards Efficient Emitter Diodes for Graphene-Base Hot Electron Transistors
Authors:
Melkamu Belete,
Olof Engström,
Sam Vaziri,
Gunther Lippert,
Mindaugas Lukosius,
Satender Kataria,
Max C. Lemme
Abstract:
Heterostructures comprising of silicon (Si), molybdenum disulfide (MoS${_2}$) and graphene are investigated with respect to the vertical current conduction mechanism. The measured current-voltage (I-V) characteristics exhibit temperature dependent asymmetric current, indicating thermally activated charge carrier transport. The data is compared and fitted to a current transport model that confirms…
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Heterostructures comprising of silicon (Si), molybdenum disulfide (MoS${_2}$) and graphene are investigated with respect to the vertical current conduction mechanism. The measured current-voltage (I-V) characteristics exhibit temperature dependent asymmetric current, indicating thermally activated charge carrier transport. The data is compared and fitted to a current transport model that confirms thermionic emission as the responsible transport mechanism across the devices. Theoretical calculations in combination with the experimental data suggest that the heterojunction barrier from Si to MoS${_2}$ is linearly temperature dependent for T = 200 to 300 K with a positive temperature coefficient. The temperature dependence may be attributed to a change in band gap difference between Si and MoS${_2}$, strain at the Si/MoS${_2}$ interface or different electron effective masses in Si and MoS${_2}$, leading to a possible entropy change stemming from variation in density of states as electrons move from Si to MoS${_2}$. The low barrier formed between Si and MoS${_2}$ and the resultant thermionic emission demonstrated here makes the present devices potential candidates as the emitter diode of graphene-base hot electron transistors for future high-speed electronics.
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Submitted 23 December, 2019;
originally announced December 2019.
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Thermal Transport Across Graphene Step Junctions
Authors:
Miguel Munoz Rojo,
Zuanyi Li,
Charles Sievers,
Alex C. Bornstein,
Eilam Yalon,
Sanchit Deshmukh,
Sam Vaziri,
Myung-Ho Bae,
Feng Xiong,
Davide Donadio,
Eric Pop
Abstract:
Step junctions are often present in layered materials, i.e. where single-layer regions meet multi-layer regions, yet their effect on thermal transport is not understood to date. Here, we measure heat flow across graphene junctions (GJs) from monolayer to bilayer graphene, as well as bilayer to four-layer graphene for the first time, in both heat flow directions. The thermal conductance of the mono…
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Step junctions are often present in layered materials, i.e. where single-layer regions meet multi-layer regions, yet their effect on thermal transport is not understood to date. Here, we measure heat flow across graphene junctions (GJs) from monolayer to bilayer graphene, as well as bilayer to four-layer graphene for the first time, in both heat flow directions. The thermal conductance of the monolayer-bilayer GJ device ranges from ~0.5 to 9.1x10^8 Wm-2K-1 between 50 K to 300 K. Atomistic simulations of such GJ device reveal that graphene layers are relatively decoupled, and the low thermal conductance of the device is determined by the resistance between the two dis-tinct graphene layers. In these conditions the junction plays a negligible effect. To prove that the decoupling between layers controls thermal transport in the junction, the heat flow in both directions was measured, showing no evidence of thermal asymmetry or rectification (within experimental error bars). For large-area graphene applications, this signifies that small bilayer (or multilayer) islands have little or no contribution to overall thermal transport.
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Submitted 30 November, 2018;
originally announced November 2018.
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Piezoresistive Properties of Suspended Graphene Membranes under Uniaxial and Biaxial Strain in Nanoelectromechanical Pressure Sensors
Authors:
Anderson D. Smith,
Frank Niklaus,
Alan Paussa,
Stephan Schröder,
Andreas C. Fischer,
Mikael Sterner,
Stefan Wagner,
Sam Vaziri,
Fredrik Forsberg,
David Esseni,
Mikael Östling,
Max C. Lemme
Abstract:
Graphene membranes act as highly sensitive transducers in nanoelectromechanical devices due to their ultimate thinness. Previously, the piezoresistive effect has been experimentally verified in graphene using uniaxial strain in graphene. Here we report experimental and theoretical data on the uni- and biaxial piezoresistive properties of suspended graphene membranes applied to piezoresistive press…
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Graphene membranes act as highly sensitive transducers in nanoelectromechanical devices due to their ultimate thinness. Previously, the piezoresistive effect has been experimentally verified in graphene using uniaxial strain in graphene. Here we report experimental and theoretical data on the uni- and biaxial piezoresistive properties of suspended graphene membranes applied to piezoresistive pressure sensors. A detailed model that utilizes a linearized Boltzman transport equation describes accurately the charge carrier density and mobility in strained graphene, and hence the gauge factor. The gauge factor is found to be practically independent of the doping concentration and crystallographic orientation of the graphene films. These investigations provide deeper insight into the piezoresistive behavior of graphene membranes.
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Submitted 13 August, 2017;
originally announced August 2017.
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Resistive Graphene Humidity Sensors with Rapid and Direct Electrical Readout
Authors:
Anderson David Smith,
Karim Elgammal,
Frank Niklaus,
Anna Delin,
Andreas Fischer,
Sam Vaziri,
Fredrik Forsberg,
Mikael Råsander,
Håkan W. Hugosson,
Lars Bergqvist,
Stephan Schröder,
Satender Kataria,
Mikael Östling,
Max C. Lemme
Abstract:
We demonstrate humidity sensing using a change of electrical resistance of a single- layer chemical vapor deposited (CVD) graphene that is placed on top of a SiO2 layer on a Si wafer. To investigate the selectivity of the sensor towards the most common constituents in air, its signal response was characterized individually for water vapor (H2O), nitrogen (N2), oxygen (O2), and argon (Ar). In order…
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We demonstrate humidity sensing using a change of electrical resistance of a single- layer chemical vapor deposited (CVD) graphene that is placed on top of a SiO2 layer on a Si wafer. To investigate the selectivity of the sensor towards the most common constituents in air, its signal response was characterized individually for water vapor (H2O), nitrogen (N2), oxygen (O2), and argon (Ar). In order to assess the humidity sensing effect for a range from 1% relative humidity (RH) to 96% RH, devices were characterized both in a vacuum chamber and in a humidity chamber at atmospheric pressure. The measured response and recovery times of the graphene humidity sensors are on the order of several hundred milliseconds. Density functional theory simulations are employed to further investigate the sensitivity of the graphene devices towards water vapor. Results from the interaction between the electrostatic dipole moment of the water and the impurity bands in the SiO2 substrate, which in turn leads to electrostatic doping of the graphene layer. The proposed graphene sensor provides rapid response direct electrical read out and is compatible with back end of the line (BEOL) integration on top of CMOS-based integrated circuits.
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Submitted 25 October, 2015;
originally announced October 2015.
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Going Ballistic: Graphene Hot Electron Transistors
Authors:
Sam Vaziri,
Anderson D. Smith,
Mikael Östling,
Grzegorz Lupina,
Jarek Dabrowski,
Gunther Lippert,
Francesco Driussi,
Stefano Venica,
Valerio Di Lecce,
Antonio Gnudi,
Matthias König,
Günther Ruhl,
Melkamu Belete,
Max C. Lemme
Abstract:
This paper reviews the experimental and theoretical state of the art in ballistic hot electron transistors that utilize two-dimensional base contacts made from graphene, i.e. graphene base transistors (GBTs). Early performance predictions that indicated potential for THz operation still hold true today, even with improved models that take non-idealities into account. Experimental results clearly d…
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This paper reviews the experimental and theoretical state of the art in ballistic hot electron transistors that utilize two-dimensional base contacts made from graphene, i.e. graphene base transistors (GBTs). Early performance predictions that indicated potential for THz operation still hold true today, even with improved models that take non-idealities into account. Experimental results clearly demonstrate the basic functionality, with on/off current switching over several orders of magnitude, but further developments are required to exploit the full potential of the GBT device family. In particular, interfaces between graphene and semiconductors or dielectrics are far from perfect and thus limit experimental device integrity, reliability and performance.
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Submitted 3 September, 2015;
originally announced September 2015.
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Bilayer Insulator Tunnel Barriers for Graphene-Based Vertical Hot-electron Transistors
Authors:
Sam Vaziri,
Melkamu Belete,
Eugenio Dentoni Litta,
Anderson Smith,
Grzegorz Lupina,
Max C. Lemme,
Mikael Östling
Abstract:
Vertical graphene-based device concepts that rely on quantum mechanical tunneling are intensely being discussed in literature for applications in electronics and optoelectronics. In this work, the carrier transport mechanisms in semiconductor-insulator-graphene (SIG) capacitors are investigated with respect to their suitability as the electron emitter in vertical graphene base transistors (GBTs).…
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Vertical graphene-based device concepts that rely on quantum mechanical tunneling are intensely being discussed in literature for applications in electronics and optoelectronics. In this work, the carrier transport mechanisms in semiconductor-insulator-graphene (SIG) capacitors are investigated with respect to their suitability as the electron emitter in vertical graphene base transistors (GBTs). Several dielectric materials as tunnel barriers are compared, including dielectric double layers. Using bilayer dielectrics, we experimentally demonstrate significant improvements in the electron injection current by promoting Fowler-Nordheim tunneling (FNT) and step tunneling (ST) while suppressing defect mediated carrier transports. High injected tunneling current densities approaching 10$^3$ A/cm$^2$ (limited by series resistance), and excellent current-voltage nonlinearity and asymmetry are achieved using a 1 nm-thick high quality dielectric, thulium silicate (TmSiO), as the first insulator layer, and titanium dioxide (TiO$_2$) as a high electron affinity second layer insulator. We also confirm the feasibility and effectiveness of our approach in a full GBT structure which shows dramatic improvement in the collector on-state current density with respect to the previously reported GBTs. The device design and the fabrication scheme have been selected with future CMOS process compatibility in mind. This work proposes a bilayer tunnel barrier approach as a promising candidate to be used in high performance vertical graphene-based tunneling devices.
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Submitted 23 July, 2015; v1 submitted 29 June, 2015;
originally announced June 2015.
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Residual Metallic Contamination of Transferred Chemical Vapor Deposited Graphene
Authors:
Grzegorz Lupina,
Julia Kitzmann,
Ioan Costina,
Mindaugas Lukosius,
Christian Wenger,
Andre Wolff,
Sam Vaziri,
Mikael Ostling,
Iwona Pasternak,
Aleksandra Krajewska,
Wlodek Strupinski,
Satender Kataria,
Amit Gahoi,
Max C. Lemme,
Guenther Ruhl,
Guenther Zoth,
Oliver Luxenhofer,
Wolfgang Mehr
Abstract:
Integration of graphene with Si microelectronics is very appealing by offering potentially a broad range of new functionalities. New materials to be integrated with Si platform must conform to stringent purity standards. Here, we investigate graphene layers grown on copper foils by chemical vapor deposition and transferred to silicon wafers by wet etch and electrochemical delamination methods with…
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Integration of graphene with Si microelectronics is very appealing by offering potentially a broad range of new functionalities. New materials to be integrated with Si platform must conform to stringent purity standards. Here, we investigate graphene layers grown on copper foils by chemical vapor deposition and transferred to silicon wafers by wet etch and electrochemical delamination methods with respect to residual sub-monolayer metallic contaminations. Regardless of the transfer method and associated cleaning scheme, time-of-flight secondary ion mass spectrometry and total reflection x-ray fluorescence measurements indicate that the graphene sheets are contaminated with residual metals (copper, iron) with a concentration exceeding 10$^{13}$ atoms/cm$^{2}$. These metal impurities appear to be partly mobile upon thermal treatment as shown by depth profiling and reduction of the minority charge carrier diffusion length in the silicon substrate. As residual metallic impurities can significantly alter electronic and electrochemical properties of graphene and can severely impede the process of integration with silicon microelectronics these results reveal that further progress in synthesis, handling, and cleaning of graphene is required on the way to its advanced electronic and optoelectronic applications.
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Submitted 5 May, 2015;
originally announced May 2015.
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Static Non-linearity in Graphene Field Effect Transistors
Authors:
Saul Rodriguez,
Anderson Smith,
Sam Vaziri,
Mikael Ostling,
Max C. Lemme,
Ana Rusu
Abstract:
The static linearity performance metrics of the GFET transconductor are studied and modeled. Closed expressions are proposed for second and third order harmonic distortion (HD2, HD3), second and third order intermodulation distortion (ΔIM2), ΔIM3), and second and third order intercept points (AIIP2, AIIP3). The expressions are validated through large-signal simulations using a GFET VerilogA analyt…
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The static linearity performance metrics of the GFET transconductor are studied and modeled. Closed expressions are proposed for second and third order harmonic distortion (HD2, HD3), second and third order intermodulation distortion (ΔIM2), ΔIM3), and second and third order intercept points (AIIP2, AIIP3). The expressions are validated through large-signal simulations using a GFET VerilogA analytical model and a commercial circuit simulator. The proposed expressions can be used during circuit design in order to predict the GFET biasing conditions at which linearity requirements are met.
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Submitted 9 May, 2014;
originally announced May 2014.
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A Comprehensive Graphene FET Model for Circuit Design
Authors:
Saul Rodriguez,
Sam Vaziri,
Anderson Smith,
Sebastien Fregonese,
Mikael Ostling,
Max C. Lemme,
Ana Rusu
Abstract:
During the last years, Graphene based Field Effect Transistors (GFET) have shown outstanding RF performance; therefore, they have attracted considerable attention from the electronic devices and circuits communities. At the same time, analytical models that predict the electrical characteristics of GFETs have evolved rapidly. These models, however, have a complexity level that can only be handled…
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During the last years, Graphene based Field Effect Transistors (GFET) have shown outstanding RF performance; therefore, they have attracted considerable attention from the electronic devices and circuits communities. At the same time, analytical models that predict the electrical characteristics of GFETs have evolved rapidly. These models, however, have a complexity level that can only be handled with the help of a circuit simulator. On the other hand, analog circuit designers require simple models that enable them to carry out fast hand calculations, i.e., to create circuits using small-signal hybrid-π models, calculate figures of merit, estimate gains, pole-zero positions, etc. This paper presents a comprehensive GFET model that is simple enough for being used in hand-calculations during circuit design and at the same time it is accurate enough to capture the electrical characteristics of the devices in the operating regions of interest. Closed analytical expressions are provided for the drain current ID, small-signal transconductance gain gm, output resistance ro, and parasitic Vgs and Cgd. In addition, figures of merit such as intrinsic voltage gain AV, transconductance efficiency gm/ID, and transit frequency fT are presented. The proposed model has been compared to a complete analytical model and also to measured data available in current literature. The results show that the proposed model follows closely to both the complete analytical model and the measured data; therefore, it can be successfully applied in the design of GFET analog circuits.
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Submitted 8 May, 2014; v1 submitted 7 October, 2013;
originally announced October 2013.
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Electromechanical Piezoresistive Sensing in Suspended Graphene Membranes
Authors:
A. D. Smith,
F. Niklaus,
A. Paussa,
S. Vaziri,
A. C. Fischer,
M. Sterner,
F. Forsberg,
A. Delin,
D. Esseni,
P. Palestri,
M. Östling,
M. C. Lemme
Abstract:
Monolayer graphene exhibits exceptional electronic and mechanical properties, making it a very promising material for nanoelectromechanical (NEMS) devices. Here, we conclusively demonstrate the piezoresistive effect in graphene in a nano-electromechanical membrane configuration that provides direct electrical readout of pressure to strain transduction. This makes it highly relevant for an importan…
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Monolayer graphene exhibits exceptional electronic and mechanical properties, making it a very promising material for nanoelectromechanical (NEMS) devices. Here, we conclusively demonstrate the piezoresistive effect in graphene in a nano-electromechanical membrane configuration that provides direct electrical readout of pressure to strain transduction. This makes it highly relevant for an important class of nano-electromechanical system (NEMS) transducers. This demonstration is consistent with our simulations and previously reported gauge factors and simulation values. The membrane in our experiment acts as a strain gauge independent of crystallographic orientation and allows for aggressive size scalability. When compared with conventional pressure sensors, the sensors have orders of magnitude higher sensitivity per unit area.
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Submitted 25 June, 2013;
originally announced June 2013.
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A Graphene-based Hot Electron Transistor
Authors:
Sam Vaziri,
Grzegorz Lupina,
Christoph Henkel,
Anderson D. Smith,
Mikael Östling,
Jarek Dabrowski,
Gunther Lippert,
Wolfgang Mehr,
Max C. Lemme
Abstract:
We experimentally demonstrate DC functionality of graphene-based hot electron transistors, which we call Graphene Base Transistors (GBT). The fabrication scheme is potentially compatible with silicon technology and can be carried out at the wafer scale with standard silicon technology. The state of the GBTs can be switched by a potential applied to the transistor base, which is made of graphene. T…
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We experimentally demonstrate DC functionality of graphene-based hot electron transistors, which we call Graphene Base Transistors (GBT). The fabrication scheme is potentially compatible with silicon technology and can be carried out at the wafer scale with standard silicon technology. The state of the GBTs can be switched by a potential applied to the transistor base, which is made of graphene. Transfer characteristics of the GBTs show ON/OFF current ratios exceeding 50.000.
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Submitted 2 June, 2013; v1 submitted 13 November, 2012;
originally announced November 2012.
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A Simple Route towards High-Concentration Surfactant-Free Graphene Dispersions
Authors:
Jiantong Li,
Fei Ye,
Sam Vaziri,
Mamoun Muhammed,
Max C. Lemme,
Mikael Östling
Abstract:
A simple solvent exchange method is introduced to prepare high-concentration and surfactant-free graphene liquid dispersion. Natural graphite flakes are first exfoliated into graphene in dimethylformamide (DMF). DMF is then exchanged by terpineol through distillation, relying on their large difference in boiling points. Graphene can then be concentrated thanks to the volume difference between DMF…
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A simple solvent exchange method is introduced to prepare high-concentration and surfactant-free graphene liquid dispersion. Natural graphite flakes are first exfoliated into graphene in dimethylformamide (DMF). DMF is then exchanged by terpineol through distillation, relying on their large difference in boiling points. Graphene can then be concentrated thanks to the volume difference between DMF and terpineol. The concentrated graphene dispersions are used to fabricate transparent conductive thin films, which possess comparable properties to those prepared by more complex methods.
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Submitted 8 March, 2012;
originally announced March 2012.
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RF Performance Projections of Graphene FETs vs. Silicon MOSFETs
Authors:
Saul Rodriguez,
Sam Vaziri,
Mikael Ostling,
Ana Rusu,
Eduard Alarcon,
Max C. Lemme
Abstract:
A graphene field-effect-transistor (GFET) model calibrated with extracted device parameters and a commercial 65 nm silicon MOSFET model are compared with respect to their radio frequency behavior. GFETs slightly lag behind CMOS in terms of speed despite their higher mobility. This is counterintuitive, but can be explained by the effect of a strongly nonlinear voltage-dependent gate capacitance. GF…
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A graphene field-effect-transistor (GFET) model calibrated with extracted device parameters and a commercial 65 nm silicon MOSFET model are compared with respect to their radio frequency behavior. GFETs slightly lag behind CMOS in terms of speed despite their higher mobility. This is counterintuitive, but can be explained by the effect of a strongly nonlinear voltage-dependent gate capacitance. GFETs achieve their maximum performance only for narrow ranges of VDS and IDS, which must be carefully considered for circuit design. For our parameter set, GFETs require at least μ = 3000 cm2 V-1 s-1 to achieve the same performance as 65 nm silicon MOSFETs.
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Submitted 4 September, 2012; v1 submitted 5 October, 2011;
originally announced October 2011.
