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Integration of topological insulator Josephson junctions in superconducting qubit circuits
Authors:
Tobias W. Schmitt,
Malcolm R. Connolly,
Michael Schleenvoigt,
Chenlu Liu,
Oscar Kennedy,
José M. Chávez-Garcia,
Abdur R. Jalil,
Benjamin Bennemann,
Stefan Trellenkamp,
Florian Lentz,
Elmar Neumann,
Tobias Lindström,
Sebastian E. de Graaf,
Erwin Berenschot,
Niels Tas,
Gregor Mussler,
Karl D. Petersson,
Detlev Grützmacher,
Peter Schüffelgen
Abstract:
The integration of semiconductor Josephson junctions (JJs) in superconducting quantum circuits provides a versatile platform for hybrid qubits and offers a powerful way to probe exotic quasiparticle excitations. Recent proposals for using circuit quantum electrodynamics (cQED) to detect topological superconductivity motivate the integration of novel topological materials in such circuits. Here, we…
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The integration of semiconductor Josephson junctions (JJs) in superconducting quantum circuits provides a versatile platform for hybrid qubits and offers a powerful way to probe exotic quasiparticle excitations. Recent proposals for using circuit quantum electrodynamics (cQED) to detect topological superconductivity motivate the integration of novel topological materials in such circuits. Here, we report on the realization of superconducting transmon qubits implemented with $(Bi_{0.06}Sb_{0.94})_{2}Te_{3}$ topological insulator (TI) JJs using ultra-high vacuum fabrication techniques. Microwave losses on our substrates with monolithically integrated hardmask, used for selective area growth of TI nanostructures, imply microsecond limits to relaxation times and thus their compatibility with strong-coupling cQED. We use the cavity-qubit interaction to show that the Josephson energy of TI-based transmons scales with their JJ dimensions and demonstrate qubit control as well as temporal quantum coherence. Our results pave the way for advanced investigations of topological materials in both novel Josephson and topological qubits.
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Submitted 18 September, 2021; v1 submitted 8 July, 2020;
originally announced July 2020.
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Capillary origami of micro-machined micro-objects: Bi-layer conductive hinges
Authors:
A. Legrain,
J. W. Berenschot,
N. R. Tas,
L. Abelmann
Abstract:
Recently, we demonstrated controllable 3D self-folding by means of capillary forces of silicon-nitride micro-objects made of rigid plates connected to each other by flexible hinges [1]. In this paper, we introduce platinum electrodes running from the substrate to the plates over these bendable hinges. The fabrication yield is as high as (77 +/- 2) % for hinges with a length less than 75 μm. The yi…
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Recently, we demonstrated controllable 3D self-folding by means of capillary forces of silicon-nitride micro-objects made of rigid plates connected to each other by flexible hinges [1]. In this paper, we introduce platinum electrodes running from the substrate to the plates over these bendable hinges. The fabrication yield is as high as (77 +/- 2) % for hinges with a length less than 75 μm. The yield reduces to (18 +/- 2) % when the length increases above 100 μm. Most of the failures in conductivity are due to degradation of the platinum/chromium layer stack during the final plasma cleaning step. The bi-layer hinges survive the capillary folding process, even for extremely small bending radii of 5 μm, nor does the bending have any impact on the conductivity. Stress in the different layers deforms the hinges, which does not affect the conductivity. Once assembled, the conductive hinges can withstand a current density of (1.6 +/- 0.4) $10^6$ A/cm$^2$ . This introduction of conductive electrodes to elastocapillary self-folded silicon-based micro-objects extends the range of their possible applications by allowing an electronic functionality of the folded parts.
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Submitted 7 November, 2014; v1 submitted 7 October, 2014;
originally announced October 2014.
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Elastocapillary folding using stop-programmable hinges fabricated by 3D micro-machining
Authors:
A. Legrain,
J. W. Berenschot,
N. R. Tas,
L. Abelmann
Abstract:
We show elasto-capillary folding of silicon nitride objects with accurate folding angles between flaps of 70.6$\pm$0.1° and demonstrate the feasibility of such accurate micro-assembly with a final folding angle of 90°. The folding angle is defined by stop-programmable hinges that are fabricated starting from silicon molds employing accurate three-dimensional corner lithography. This nano-patternin…
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We show elasto-capillary folding of silicon nitride objects with accurate folding angles between flaps of 70.6$\pm$0.1° and demonstrate the feasibility of such accurate micro-assembly with a final folding angle of 90°. The folding angle is defined by stop-programmable hinges that are fabricated starting from silicon molds employing accurate three-dimensional corner lithography. This nano-patterning method exploits the conformal deposition and the subsequent timed isotropic etching of a thin film in a 3D shaped silicon template. The technique leaves a residue of the thin film in sharp concave corners which can be used as an inversion mask in subsequent steps. Hinges designed to stop the folding at 70.6° were fabricated batchwise by machining the V-grooves obtained by KOH etching in (110) silicon wafers; 90° stop-programmable hinges were obtained starting from silicon molds obtained by dry etching on (100) wafers. The presented technique is applicable to any folding angle and opens a new route towards creating structures with increased complexity, which will ultimately lead to a novel method for device fabrication.
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Submitted 7 November, 2014; v1 submitted 7 October, 2014;
originally announced October 2014.
