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Liquid Metal Oxide-assisted Integration of High-k Dielectrics and Metal Contacts for Two-Dimensional Electronics
Authors:
Dasari Venkatakrishnarao,
Abhishek Mishra,
Yaoju Tarn,
Michel Bosman,
Rainer Lee,
Sarthak Das,
Subhrajit Mukherjee,
Teymour Talha-Dean,
Yiyu Zhang,
Siew Lang Teo,
Jian Wei Chai,
Fabio Bussolotti,
Kuan Eng Johnson Goh,
Chit Siong Lau
Abstract:
Two-dimensional van der Waals semiconductors are promising for future nanoelectronics. However, integrating high-k gate dielectrics for device applications is challenging as the inert van der Waals material surfaces hinder uniform dielectric growth. Here, we report a liquid metal oxide-assisted approach to integrate ultrathin, high-k HfO2 dielectric on 2D semiconductors with atomically smooth inte…
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Two-dimensional van der Waals semiconductors are promising for future nanoelectronics. However, integrating high-k gate dielectrics for device applications is challenging as the inert van der Waals material surfaces hinder uniform dielectric growth. Here, we report a liquid metal oxide-assisted approach to integrate ultrathin, high-k HfO2 dielectric on 2D semiconductors with atomically smooth interfaces. Using this approach, we fabricated 2D WS2 top-gated transistors with subthreshold swings down to 74.5 mV/dec, gate leakage current density below 10-6 A/cm2, and negligible hysteresis. We further demonstrate a one-step van der Waals integration of contacts and dielectrics on graphene. This can offer a scalable approach toward integrating entire prefabricated device stack arrays with 2D materials. Our work provides a scalable solution to address the crucial dielectric engineering challenge for 2D semiconductors, paving the way for high-performance 2D electronics.
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Submitted 19 September, 2024;
originally announced September 2024.
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Toward Phonon-Limited Transport in Two-Dimensional Electronics by Oxygen-Free Fabrication
Authors:
Subhrajit Mukherjee,
Shuhua Wang,
Dasari Venkatakrishnarao,
Yaoju Tarn,
Teymour Talha-Dean,
Rainer Lee,
Ivan A. Verzhbitskiy,
Ding Huang,
Abhishek Mishra,
John Wellington John,
Sarthak Das,
Fabio Bussoloti,
Thathsara D. Maddumapatabandi,
Yee Wen Teh,
Yee Sin Ang,
Kuan Eng Johnson Goh,
Chit Siong Lau
Abstract:
Future electronics require aggressive scaling of channel material thickness while maintaining device performance. Two-dimensional (2D) semiconductors are promising candidates, but despite over two decades of research, experimental performance still lags theoretical expectations. Here, we develop an oxygen-free approach to push the electrical transport of 2D field-effect transistors toward the theo…
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Future electronics require aggressive scaling of channel material thickness while maintaining device performance. Two-dimensional (2D) semiconductors are promising candidates, but despite over two decades of research, experimental performance still lags theoretical expectations. Here, we develop an oxygen-free approach to push the electrical transport of 2D field-effect transistors toward the theoretical phonon-limited intrinsic mobility. We achieve record carrier mobilities of 91 (132) cm2V-1s-1 for mono- (bi-) layer MoS2 transistors on SiO2 substrate. Statistics from over 60 devices confirm that oxygen-free fabrication enhances key figures of merit by more than an order of magnitude. While previous studies suggest that 2D transition metal dichalcogenides such as MoS2 and WS2 are stable in air, we show that short-term ambient exposure can degrade their device performance through irreversible oxygen chemisorption. This study emphasizes the criticality of avoiding oxygen exposure, offering guidance for device manufacturing for fundamental research and practical applications of 2D materials.
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Submitted 12 September, 2024;
originally announced September 2024.
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Dielectrics for Two-Dimensional Transition Metal Dichalcogenide Applications
Authors:
Chit Siong Lau,
Sarthak Das,
Ivan A. Verzhbitskiy,
Ding Huang,
Yiyu Zhang,
Teymour Talha-Dean,
Yiyu Zhang,
Wei Fu,
Dasari Venkatakrishnarao,
Kuan Eng Johnson Goh
Abstract:
Despite over a decade of intense research efforts, the full potential of two-dimensional transition metal dichalcogenides continues to be limited by major challenges. The lack of compatible and scalable dielectric materials and integration techniques restrict device performances and their commercial applications Conventional dielectric integration techniques for bulk semiconductors are difficult t…
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Despite over a decade of intense research efforts, the full potential of two-dimensional transition metal dichalcogenides continues to be limited by major challenges. The lack of compatible and scalable dielectric materials and integration techniques restrict device performances and their commercial applications Conventional dielectric integration techniques for bulk semiconductors are difficult to adapt for atomically thin two-dimensional materials. This review provides a brief introduction into various common and emerging dielectric synthesis and integration techniques and discusses their applicability for 2D transition metal dichalcogenides. Dielectric integration for various applications is reviewed in subsequent sections including nanoelectronics, optoelectronics, flexible electronics, valleytronics, biosensing, quantum information processing, and quantum sensing. For each application, we introduce basic device working principles, discuss the specific dielectric requirements, review current progress, present key challenges, and offer insights into future prospects and opportunities.
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Submitted 4 February, 2024;
originally announced February 2024.
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Nano-ironing van der Waals Heterostructures Towards Electrically Controlled Quantum Dots
Authors:
Teymour Talha-Dean,
Yaoju Tarn,
Subhrajit Mukherjee,
John Wellington John,
Ding Huang,
Ivan A. Verzhbitskiy,
Dasari Venkatakrishnarao,
Sarthak Das,
Rainer Lee,
Abhishek Mishra,
Shuhua Wang,
Yee Sin Ang,
Kuan Eng Johnson Goh,
Chit Siong Lau
Abstract:
Assembling two-dimensional van der Waals layered materials into heterostructures is an exciting development that sparked the discovery of rich correlated electronic phenomena and offers possibilities for designer device applications. However, resist residue from fabrication processes is a major limitation. Resulting disordered interfaces degrade device performance and mask underlying transport phy…
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Assembling two-dimensional van der Waals layered materials into heterostructures is an exciting development that sparked the discovery of rich correlated electronic phenomena and offers possibilities for designer device applications. However, resist residue from fabrication processes is a major limitation. Resulting disordered interfaces degrade device performance and mask underlying transport physics. Conventional cleaning processes are inefficient and can cause material and device damage. Here, we show that thermal scanning probe based cleaning can effectively eliminate resist residue to recover pristine material surfaces. Our technique is compatible at both the material- and device-level, and we demonstrate the significant improvement in the electrical performance of 2D WS2 transistors. We also demonstrate the cleaning of van der Waals heterostructures to achieve interfaces with low disorder. This enables the electrical formation and control of quantum dots that can be tuned from macroscopic current flow to the single-electron tunnelling regime. Such material processing advances are crucial for constructing high-quality vdW heterostructures that are important platforms for fundamental studies and building blocks for quantum and nano-electronics applications.
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Submitted 2 February, 2024;
originally announced February 2024.
