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Towards an understanding of particle-scale flaws and microstructure evolution in cold-spray via accumulation of single particle impacts
Authors:
Alain Reiser,
Christopher Allan Schuh
Abstract:
Cold spray coatings are the sum of countless individual bonding events between single particles impacting on top of one another at high velocities. Thus, the collective behavior of microparticles must be considered to elucidate the origins of coating flaws at the scale of the particles and larger, or the dynamic evolution of the overall coating microstructure. Laser-induced particle impact testing…
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Cold spray coatings are the sum of countless individual bonding events between single particles impacting on top of one another at high velocities. Thus, the collective behavior of microparticles must be considered to elucidate the origins of coating flaws at the scale of the particles and larger, or the dynamic evolution of the overall coating microstructure. Laser-induced particle impact testing (LIPIT) has been extensively used to study single-particle impacts, and in this work is adapted to study the accumulation of numerous particles with knowledge of each individual particle's impact parameters (particle size, velocity). The method reproducibly deposits stacks of gold particles (>20 particles) with different characteristic spectra of impact velocity. The observation of impact-induced erosion lets us define a critical velocity for material-build-up that is higher than that for single-particle bonding. The quantitative single-particle data are analyzed in a correlative manner to the structure and flaws in the resulting stacks, providing some first statistical connections between, e.g., strain and recrystallization, or aberrant particle characteristics and defects. The results highlight opportunities for the study of many-particle phenomena in microparticle impact -- from interaction of particles in cold spray to multi-step erosion processes -- with a quantitative view of the behavior of single particles.
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Submitted 24 July, 2024; v1 submitted 8 April, 2024;
originally announced April 2024.
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Direct in- and out-of-plane writing of metals on insulators by electron-beam-enabled, confined electrodeposition with submicrometer feature size
Authors:
Mirco Nydegger,
Zhu-Jun Wang,
Marc Willinger,
Ralph Spolenak,
Alain Reiser
Abstract:
Additive microfabrication processes based on localized electroplating enable the one-step deposition of micro-scale metal structures with outstanding performance, e.g. high electrical conductivity and mechanical strength. They are therefore evaluated as an exciting and enabling addition to the existing repertoire of microfabrication technologies. Yet, electrochemical processes are generally restri…
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Additive microfabrication processes based on localized electroplating enable the one-step deposition of micro-scale metal structures with outstanding performance, e.g. high electrical conductivity and mechanical strength. They are therefore evaluated as an exciting and enabling addition to the existing repertoire of microfabrication technologies. Yet, electrochemical processes are generally restricted to conductive or semiconductive substrates, precluding their application in the manufacturing of functional electric devices where direct deposition onto insulators is often required. Here, we demonstrate the direct, localized electrodeposition of copper on a variety of insulating substrates, namely Al2O3, glass and flexible polyethylene, enabled by electron-beam-induced reduction in a highly confined liquid electrolyte reservoir. The nanometer-size of the electrolyte reservoir, fed by electrohydrodynamic ejection, enables a minimal feature size on the order of 200 nm. The fact that the transient reservoir is established and stabilized by electrohydrodynamic ejection rather than specialized liquid cells could offer greater flexibility towards deposition on arbitrary substrate geometries and materials. Installed in a low-vacuum scanning electron microscope, the setup further allows for operando, nanoscale observation and analysis of the manufacturing process.
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Submitted 22 September, 2023;
originally announced September 2023.
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Anisotropic ionic conductivity of LiMn$_{1-x}$Fe$_x$PO$_4$ ($0\leq x \leq 1$) single crystals
Authors:
Christoph Neef,
Elisa Thauer,
Andreas Reiser,
Rüdiger Klingeler
Abstract:
We report AC-impedance studies on a series of high-quality LiMn$_{1-x}$Fe$_x$PO$_4$ single crystals with $0\leq x \leq 1$. Our results confirm quasi-one-dimensional transport in LiFePO$_4$ with fast Li-diffusion along the $b$-axis. The conductivities along the crystallographic $b$-, $c$- and $a$-axis differ by a factor of about 10, respectively. Whereas, the activation energy $E_{\rm A}$ of the ef…
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We report AC-impedance studies on a series of high-quality LiMn$_{1-x}$Fe$_x$PO$_4$ single crystals with $0\leq x \leq 1$. Our results confirm quasi-one-dimensional transport in LiFePO$_4$ with fast Li-diffusion along the $b$-axis. The conductivities along the crystallographic $b$-, $c$- and $a$-axis differ by a factor of about 10, respectively. Whereas, the activation energy $E_{\rm A}$ of the effective diffusion process is particularly large for the $b$-axis and smallest for the $a$-axis. Remarkably, the $b$-axis ionic bulk conductivity of LiMn$_{0.5}$Fe$_{0.5}$PO$_4$ is of the same order of magnitude as in undoped LiFePO$_4$, which implies similarly fast Li-transport even upon 50~\% Mn-doping which, owing to the higher redox potential of the Mn$^{3+}$/Mn$^{2+}$-couple, yields enhanced energy density in lithium-ion batteries. The overall results of our impedance studies draw a far more complex picture than it would be expected from a simple one-dimensional ionic conductor. Our results suggest a strong contribution of crystal defects in real materials.
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Submitted 29 December, 2019;
originally announced December 2019.
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Metals by micro-scale additive manufacturing: comparison of microstructure and mechanical properties
Authors:
Alain Reiser,
Lukas Koch,
Kathleen A. Dunn,
Toshiki Matsuura,
Futoshi Iwata,
Ofer Fogel,
Zvi Kotler,
Nanjia Zhou,
Kristin Charipar,
Alberto Piqué,
Patrik Rohner,
Dimos Poulikakos,
Sanghyeon Lee,
Seung K. Seol,
Ivo Utke,
Cathelijn van Nisselroy,
Tomaso Zambelli,
Jeffrey M. Wheeler,
Ralph Spolenak
Abstract:
Many emerging applications in microscale engineering rely on the fabrication of three-dimensional architectures in inorganic materials. Small-scale additive manufacturing (AM) aspires to provide flexible and facile access to these geometries. Yet, the synthesis of device-grade inorganic materials is still a key challenge towards the implementation of AM in microfabrication. Here, we present a comp…
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Many emerging applications in microscale engineering rely on the fabrication of three-dimensional architectures in inorganic materials. Small-scale additive manufacturing (AM) aspires to provide flexible and facile access to these geometries. Yet, the synthesis of device-grade inorganic materials is still a key challenge towards the implementation of AM in microfabrication. Here, we present a comprehensive overview of the microstructural and mechanical properties of metals fabricated by most state-of-the-art AM methods that offer a spatial resolution $\leq$10$μ$m. Standardized sets of samples were studied by cross-sectional electron microscopy, nanoindentation and microcompression. We show that current microscale AM techniques synthesize metals with a wide range of microstructures and elastic and plastic properties, including materials of dense and crystalline microstructure with excellent mechanical properties that compare well to those of thin-film nanocrystalline materials. The large variation in materials performance can be related to the individual microstructure, which in turn is coupled to the various physico-chemical principles exploited by the different printing methods. The study provides practical guidelines for users of small-scale additive methods and establishes a baseline for the future optimization of the properties of printed metallic objects $-$ a significant step towards the potential establishment of AM techniques in microfabrication.
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Submitted 7 December, 2019;
originally announced December 2019.
