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Interplay of carrier density and mobility in Al-Rich (Al,Ga)N-Channel HEMTs: Impact on high-power device performance potential
Authors:
Badal Mondal,
Pietro Pampili,
Jayjit Mukherjee,
David Moran,
Peter James Parbrook,
Stefan Schulz
Abstract:
Despite considerable advancements, high electron mobility transistors (HEMTs) based on gallium nitride (GaN) channels remain largely limited to power applications below 650 V. For higher power demands, the ultra-wide bandgap semiconductor alloy aluminium gallium nitride, (Al,Ga)N, has emerged as a key contender for next-generation HEMTs. In this theoretical study, we show that Al-rich Al$_x$Ga…
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Despite considerable advancements, high electron mobility transistors (HEMTs) based on gallium nitride (GaN) channels remain largely limited to power applications below 650 V. For higher power demands, the ultra-wide bandgap semiconductor alloy aluminium gallium nitride, (Al,Ga)N, has emerged as a key contender for next-generation HEMTs. In this theoretical study, we show that Al-rich Al$_x$Ga$_{1-x}$N-channel HEMTs (with $x \geq 0.5$) outperform the GaN-channel counterparts at and above room temperature, across all Al compositions, $x$. This contrasts with recent theory reports which suggest that only Al$_x$Ga$_{1-x}$N HEMTs with high Al content ($x \geq 0.85$) offer comparable performance to GaN-channel devices. Unlike previous assumptions of a constant two-dimensional electron gas (2DEG) density across the entire composition range $x$, we show that the 2DEG density is highly sensitive to both the Al content and thickness of the individual layers in a HEMT structure. We demonstrate that the superior performance of Al-rich (Al,Ga)N-channel HEMTs is driven by a competing effect between 2DEG density and electron mobility. This work challenges the assumptions of prior studies, which can result in a significant under or overestimation of the potential of high Al content HEMTs. The insights gained from our work provide a comprehensive understanding of the trade-offs between device and material parameters, thus help to guide the design of future Al-rich ($x = 0.5-1.0$) Al$_x$Ga$_{1-x}$N-channel HEMTs for high-power applications.
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Submitted 19 February, 2025;
originally announced February 2025.
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Geometrically-Controlled Microscale Patterning and Epitaxial Lateral Overgrowth of Nitrogen-Polar GaN
Authors:
Pietro Pampili,
Vitaly Z. Zubialevich,
Peter J. Parbrook
Abstract:
In this study we report on a novel two-step epitaxial growth technique that enables a significant improvement of the crystal quality of nitrogen-polar GaN. The starting material is grown on 4° vicinal sapphire substrates by metal organic vapour phase epitaxy, with an initial high-temperature sapphire nitridation to control polarity. The material is then converted into a regular array of hexagonal…
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In this study we report on a novel two-step epitaxial growth technique that enables a significant improvement of the crystal quality of nitrogen-polar GaN. The starting material is grown on 4° vicinal sapphire substrates by metal organic vapour phase epitaxy, with an initial high-temperature sapphire nitridation to control polarity. The material is then converted into a regular array of hexagonal pyramids by wet-etch in a KOH solution, and subsequently regrown to coalesce the pyramids back into a smooth layer of improved crystal quality. The key points that enable this technique are the control of the array geometry, obtained by exploiting the anisotropic behaviour of the wet-etch step, and the use of regrowth conditions that preserve the orientation of the pyramids' sidewalls. In contrast, growth conditions that cause an excessive expansion of the residual (000-1) facets on the pyramids' tops cause the onset of a very rough surface morphology upon full coalescence. An X-ray diffraction study confirms the reduction of the threading dislocation density as the regrowth step develops. The analysis of the relative position of the 000-2 GaN peak with respect to the 0006 sapphire peak reveals a macroscopic tilt of the pyramids, probably induced by the large off-axis substrate orientation. This tilt correlates very well with an anomalous broadening of the 000-2 diffraction peaks at the beginning of the regrowth step.
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Submitted 14 February, 2024;
originally announced February 2024.
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Nitrogen-polar growth of AlN on vicinal (0001) sapphire by MOVPE
Authors:
Pietro Pampili,
Markus Pristovsek
Abstract:
We report about metalorganic vapour phase epitaxy of smooth nitrogen-polar AlN templates on vicinal (0001) sapphire substrates. The influence of V/III ratio, growth temperature, growth rate, as well as sapphire-nitridation time and temperature were studied. With 4° offcut sapphire, step-flow growth was possible only with V/III ratios below 2. However, optimal V/III ratio required precise adjustmen…
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We report about metalorganic vapour phase epitaxy of smooth nitrogen-polar AlN templates on vicinal (0001) sapphire substrates. The influence of V/III ratio, growth temperature, growth rate, as well as sapphire-nitridation time and temperature were studied. With 4° offcut sapphire, step-flow growth was possible only with V/III ratios below 2. However, optimal V/III ratio required precise adjustment, possibly dependent on reactor history and geometry. A rather narrow temperature window of less than 40°C existed for smooth surface morphology. Reducing the temperature affected adatom mobility, eventually disrupting step-flow growth; increasing the temperature favoured the formation of high-aspect-ratio defects on the epilayer. A low thermal-budget nitridation step with a short nitridation time of 15 s proved to be effective in controlling polarity without inducing excessive surface damage on the sapphire substrate. Growth rate also influenced surface morphology, with an increase in RMS roughness and step-bouncing for faster growths; however, at growth rates of 1.4 $μ$m/h or higher step-flow growth could no longer form. Finally, we developed a V/III ratio fine-tuning procedure, whereby the reactor-specific value that induces optimal growth is inferred by growth-rate variations. With this method, N polar AlN templates with sub-nanometre RMS roughness were demonstrated for both 4° and 2° offcut sapphire substrates.
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Submitted 5 February, 2024;
originally announced February 2024.
