12-spin-qubit arrays fabricated on a 300 mm semiconductor manufacturing line
Authors:
Hubert C. George,
Mateusz T. Mądzik,
Eric M. Henry,
Andrew J. Wagner,
Mohammad M. Islam,
Felix Borjans,
Elliot J. Connors,
J. Corrigan,
Matthew Curry,
Michael K. Harper,
Daniel Keith,
Lester Lampert,
Florian Luthi,
Fahd A. Mohiyaddin,
Sandra Murcia,
Rohit Nair,
Rambert Nahm,
Aditi Nethwewala,
Samuel Neyens,
Bishnu Patra,
Roy D. Raharjo,
Carly Rogan,
Rostyslav Savytskyy,
Thomas F. Watson,
Josh Ziegler
, et al. (7 additional authors not shown)
Abstract:
Intels efforts to build a practical quantum computer are focused on developing a scalable spin-qubit platform leveraging industrial high-volume semiconductor manufacturing expertise and 300 mm fabrication infrastructure. Here, we provide an overview of the design, fabrication, and demonstration of a new customized quantum test chip, which contains 12-quantum-dot spin-qubit linear arrays, code name…
▽ More
Intels efforts to build a practical quantum computer are focused on developing a scalable spin-qubit platform leveraging industrial high-volume semiconductor manufacturing expertise and 300 mm fabrication infrastructure. Here, we provide an overview of the design, fabrication, and demonstration of a new customized quantum test chip, which contains 12-quantum-dot spin-qubit linear arrays, code named Tunnel Falls. These devices are fabricated using immersion and extreme ultraviolet lithography (EUV), along with other standard high-volume manufacturing (HVM) processes, as well as production-level process control. We present key device features and fabrication details, as well as qubit characterization results confirming device functionality. These results corroborate our fabrication methods and are a crucial step towards scaling of extensible 2D qubit array schemes.
△ Less
Submitted 20 December, 2024; v1 submitted 21 October, 2024;
originally announced October 2024.
