Fast spin precession and strong perpendicular magnetic anisotropy in ferrimagnetic Mn4N thin films improved by Pd buffer layer
Authors:
Yao Zhang,
Yun Kim,
Peter P. Murmu,
Dingbin Huang,
Deyuan Lyu,
Jian-Ping Wang,
Xiaojia Wang,
Simon Granville
Abstract:
Ferrimagnets take the advantages of both ferromagnets and antiferromagnets making them promise for spintronic applications. Here we prepared ferrimagnetic Mn4N thin films with high Curie temperature and investigated the crystalline structure and magnetic properties affected by the Pd buffer layer. We demonstrated that both crystalline quality and perpendicular magnetic anisotropy (PMA) of Mn4N thi…
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Ferrimagnets take the advantages of both ferromagnets and antiferromagnets making them promise for spintronic applications. Here we prepared ferrimagnetic Mn4N thin films with high Curie temperature and investigated the crystalline structure and magnetic properties affected by the Pd buffer layer. We demonstrated that both crystalline quality and perpendicular magnetic anisotropy (PMA) of Mn4N thin films are enhanced significantly due to the relaxation of tensile stress induced by the Pd buffer layer. We also demonstrated a fast spin precession at room temperature, almost 100 GHz, in Mn4N thin films. With the characteristics of high thermal stability, enhanced PMA by buffer layer and fast spin precession, Mn4N thin film is a promising material for spintronic applications.
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Submitted 19 February, 2025;
originally announced February 2025.
Defect engineering-induced Seebeck coefficient and carrier concentration decoupling in CuI by noble gas ion implantation
Authors:
Martin Markwitz,
Peter P. Murmu,
Takao Mori,
John V. Kennedy,
Ben J. Ruck
Abstract:
Copper(I) iodide, CuI, is the leading $p$-type non-toxic and earth-abundant semiconducting material for transparent electronics and thermoelectric generators. Defects play a crucial role in determining the carrier concentration, scattering process, and therefore thermoelectric performance of a material. A result of defect engineering, the power factor of thin film CuI was increased from…
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Copper(I) iodide, CuI, is the leading $p$-type non-toxic and earth-abundant semiconducting material for transparent electronics and thermoelectric generators. Defects play a crucial role in determining the carrier concentration, scattering process, and therefore thermoelectric performance of a material. A result of defect engineering, the power factor of thin film CuI was increased from $332\pm32$ μWm$^{-1}$K$^{-2}$ to $578\pm58$ μWm$^{-1}$K$^{-2}$ after implantation with noble gas ions (Ne, Ar, Xe). The increased power factor is due to a decoupling of the Seebeck coefficient and electrical conductivity identified through a changing scattering mechanism. Ion implantation causes the abundant production of Frenkel pairs, which were found to suppress compensating donors in CuI, and which scenario was also supported by density functional theory calculations. The compensating donor suppression led to a significantly improved Hall carrier concentration, increasing from $6.5\times10^{19}\pm0.1\times10^{19}$ cm$^{-3}$ to $11.5\times10^{19}\pm0.4\times10^{19}$ cm$^{-3}$. This work provides an important step forward in the development of CuI as a transparent conducting material for electronics and thermoelectric generators by introducing beneficial point defects with ion implantation.
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Submitted 1 November, 2024;
originally announced November 2024.
