Nano-size fragmentation of Tantalum in Copper composite using additive manufacturing
Authors:
Rakesh Das,
Pawan Kumar Dubey,
Raphael Benjamim de Oliveira,
Douglas S. Galvao,
Indranil Manna,
Sameehan S. Joshi,
Peter Samora Owuor,
Leonardo D. Machado,
Nirmal Kumar Katiyar,
Suman Chakraborty,
Chandra Sekhar Tiwary
Abstract:
The biggest challenge in manufacturing an immiscible system is phase segregation and non-uniformity inside the composite matrix. Additive manufacturing has the potential to overcome these difficulties due to the high cooling rate achieved during the process. Here we have developed immiscible Copper-based composites reinforced with Tantalum, which were fabricated using the powder bed fusion melting…
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The biggest challenge in manufacturing an immiscible system is phase segregation and non-uniformity inside the composite matrix. Additive manufacturing has the potential to overcome these difficulties due to the high cooling rate achieved during the process. Here we have developed immiscible Copper-based composites reinforced with Tantalum, which were fabricated using the powder bed fusion melting (PBF-M) technique. The distinct advantage of utilizing Tantalum in this process resides in its high melting point, allowing it to remain in particle form within the composite and contribute to its mechanical and surface/wear properties. The PBF-M results in the in situ fragmentation of micron-size Tantalum particles into nanoparticle form through a surface roughening process during laser interaction, enhancing its mechanical and wear properties. The microstructural evolution of Cu-Ta composites is explained through multiscale numerical modeling. The enhanced yield strength and the dynamics of the Ta particles were corroborated by molecular dynamics simulations. The maximum yield strength is exhibited by Cu-5wt%Ta of 80 MPa. Addition of Ta also have significant improvement in wear properties of composites. The current results can be exploited to develop complex shape, high energy efficient copper-based composites.
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Submitted 5 February, 2025;
originally announced February 2025.
Face-centered-cubic titanium in Ti/Al multilayer thin films synthesized by magnetron sputtering technique
Authors:
Ramaseshan Rajagopalan,
Arup Dasgupta,
Ramachandran Divakar,
Sitaram Dash,
Nithya Ravindran,
Saroja Saibaba,
Ashok Kumar Tyagi,
Supriya Bera,
Indranil Manna
Abstract:
Ti/Al multilayer thin films with precise thickness have been deposited using a combination of dc and rf magnetron sputtering techniques. Cross-sectional transmission electron microscopy (TEM) revealed unmixed fifteen parallel and alternate layers of Ti and Al with sharp interfaces, each measuring 27 nm and 15 nm in thickness, respectively. The Ti layer was composed of hcp and fcc phases while th…
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Ti/Al multilayer thin films with precise thickness have been deposited using a combination of dc and rf magnetron sputtering techniques. Cross-sectional transmission electron microscopy (TEM) revealed unmixed fifteen parallel and alternate layers of Ti and Al with sharp interfaces, each measuring 27 nm and 15 nm in thickness, respectively. The Ti layer was composed of hcp and fcc phases while the Al layer was fcc. Both x-ray diffraction (XRD) and selected area electron diffraction (SAED) analysis confirmed the identity of these phases. Detection of fcc-Ti in as-deposited the Ti/Al multilayer thin film by XRD established that the fcc-Ti phase is not an artifact of TEM sample preparation, as have been envisaged by some of the previous researchers. The fcc-Ti phase appeared when dual rf guns were used for Ti deposition and the diffraction peak intensity corresponding to fcc phase increased when the gun power was raised. A modified equation of state based thermodynamic analysis confirmed that the formation of hcp phase as opposed to the thermodynamically stable fcc phase of pure Ti is due to crystallite size reduction and not impurity driven.
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Submitted 28 November, 2009;
originally announced November 2009.
