Unveiling the effect of adding B4C at the W-on-Si interface
Authors:
Adele Valpreda,
Hendrik W. Lokhorst,
Jacobus M. Sturm,
Andrey E. Yakshin,
Marcelo Ackermann
Abstract:
In this study, we investigate the W-on-Si interface and the effect of adding a B4C interlayer at such interface, using low-energy ion scattering (LEIS) spectroscopy, X-ray reflectivity, X-ray diffraction, and transmission electron microscopy with energy dispersive X-ray spectroscopy. We extract the effective width of the interface in three different structures having: no-B4C, 0.24 nm, and 1.2 nm o…
▽ More
In this study, we investigate the W-on-Si interface and the effect of adding a B4C interlayer at such interface, using low-energy ion scattering (LEIS) spectroscopy, X-ray reflectivity, X-ray diffraction, and transmission electron microscopy with energy dispersive X-ray spectroscopy. We extract the effective width of the interface in three different structures having: no-B4C, 0.24 nm, and 1.2 nm of B4C deposited in between the W and the Si films. The analysis reveals that the W distribution does not get significantly sharper when B4C atoms are deposited at the W-on-Si interface, showing that B4C does not act as a physical barrier against the diffusion of atoms during the deposition of these structures. W/Si thin-film structures are used in various applications, including X-ray optics. While many studies reported that adding a sub-nm thick B4C film at the W/Si interfaces is beneficial for the overall reflectivity of the structures, the physical mechanisms involved were not yet fully understood. In this context, being able to characterize the width of the interfaces with sub-nm resolution is key. In this study, we show how the analysis of the sub-surface signal of the LEIS spectra enables the characterization of the interface W-on-(B4C-)Si, highlighting the importance of systematically extracting the values of the effective interface width for the analysis and understanding of thin-film growth.
△ Less
Submitted 6 March, 2025;
originally announced March 2025.
