Cracking in polymer substrates for flexible devices and its mitigation
Authors:
Anush Ranka,
Madhuja Layek,
Sayaka Kochiyama,
Cristina Lopez-Pernia,
Alicia M. Chandler,
Conrad A. Kocoj,
Erica Magliano,
Aldo Di Carlo,
Francesca Brunetti,
Peijun Guo,
Subra Suresh,
David C. Paine,
Haneesh Kesari,
Nitin P. Padture
Abstract:
Mechanical reliability plays an outsized role in determining the durability of flexible electronic devices because of the significant mechanical stresses they can experience during manufacturing and operation. These devices are typically built on sheets comprising stiff thin-film electrodes on compliant polymer substrates, and it is generally assumed that the high-toughness substrates do not crack…
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Mechanical reliability plays an outsized role in determining the durability of flexible electronic devices because of the significant mechanical stresses they can experience during manufacturing and operation. These devices are typically built on sheets comprising stiff thin-film electrodes on compliant polymer substrates, and it is generally assumed that the high-toughness substrates do not crack easily. Contrary to this widespread assumption, here we reveal severe, pervasive, and extensive cracking in the polymer substrates during bending of electrode/substrate sheets, which compromises the overall mechanical integrity of the entire device. The substrate-cracking phenomenon appears to be general, and it is driven by the amplified stress intensity factor caused by the elastic mismatch at the film/substrate interface. To mitigate this substrate cracking, an interlayer-engineering approach is designed and experimentally demonstrated. This approach is generic, and it is potentially applicable to myriad flexible electronic devices that utilize stiff films on compliant substrates, for improving their durability and reliability.
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Submitted 14 April, 2025;
originally announced April 2025.
Elastic Modulus of Polycrystalline Halide Perovskite Thin Films on Substrates
Authors:
Madhuja Layek,
In Seok Yang,
Zhenghong Dai,
Anush Ranka,
Truong Cai,
Brian W. Sheldon,
Eric Chason,
Nitin P. Padture
Abstract:
Using an innovative combination of multi-beam-optical stress-sensor (MOSS) curvature and X-ray diffraction (XRD) techniques, the Young's modulus (E) of polycrystalline MAPbI3 metal-halide perovskite (MHP) thin films attached to Si substrates is estimated to be 10.2 +/- 3.4 GPa. This is comparable to the E of corresponding MAPbI3 single-crystals. This generic method could be applied to other system…
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Using an innovative combination of multi-beam-optical stress-sensor (MOSS) curvature and X-ray diffraction (XRD) techniques, the Young's modulus (E) of polycrystalline MAPbI3 metal-halide perovskite (MHP) thin films attached to Si substrates is estimated to be 10.2 +/- 3.4 GPa. This is comparable to the E of corresponding MAPbI3 single-crystals. This generic method could be applied to other systems to estimate hard-to-measure E of thin films.
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Submitted 23 October, 2023; v1 submitted 13 July, 2023;
originally announced July 2023.
