Nano-size fragmentation of Tantalum in Copper composite using additive manufacturing
Authors:
Rakesh Das,
Pawan Kumar Dubey,
Raphael Benjamim de Oliveira,
Douglas S. Galvao,
Indranil Manna,
Sameehan S. Joshi,
Peter Samora Owuor,
Leonardo D. Machado,
Nirmal Kumar Katiyar,
Suman Chakraborty,
Chandra Sekhar Tiwary
Abstract:
The biggest challenge in manufacturing an immiscible system is phase segregation and non-uniformity inside the composite matrix. Additive manufacturing has the potential to overcome these difficulties due to the high cooling rate achieved during the process. Here we have developed immiscible Copper-based composites reinforced with Tantalum, which were fabricated using the powder bed fusion melting…
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The biggest challenge in manufacturing an immiscible system is phase segregation and non-uniformity inside the composite matrix. Additive manufacturing has the potential to overcome these difficulties due to the high cooling rate achieved during the process. Here we have developed immiscible Copper-based composites reinforced with Tantalum, which were fabricated using the powder bed fusion melting (PBF-M) technique. The distinct advantage of utilizing Tantalum in this process resides in its high melting point, allowing it to remain in particle form within the composite and contribute to its mechanical and surface/wear properties. The PBF-M results in the in situ fragmentation of micron-size Tantalum particles into nanoparticle form through a surface roughening process during laser interaction, enhancing its mechanical and wear properties. The microstructural evolution of Cu-Ta composites is explained through multiscale numerical modeling. The enhanced yield strength and the dynamics of the Ta particles were corroborated by molecular dynamics simulations. The maximum yield strength is exhibited by Cu-5wt%Ta of 80 MPa. Addition of Ta also have significant improvement in wear properties of composites. The current results can be exploited to develop complex shape, high energy efficient copper-based composites.
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Submitted 5 February, 2025;
originally announced February 2025.
High Entropy Alloy Nanoparticles Decorated, p-type 2D-Molybdenum Disulphide (MoS2) and Gold Schottky Junction Enhanced Hydrogen Sensing
Authors:
Kusuma Urs MB,
Nirmal Kumar Katiyar,
Ritesh Kumar,
Krishanu Biswas,
Abhishek K. Singh,
C S Tiwary,
Vinayak Kamble
Abstract:
Molybdenum Disulphide (MoS2) is an interesting material which exists in atomically thin multilayers and can be exfoliated into monolayer or a few layers for multiple applications. It has emerged as a promising material for development of such efficient sensors. Here, we have exfoliated and decorated MoS2 flakes with novel, single phase High Entropy Alloy (HEA) nanoparticles using facile and scalab…
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Molybdenum Disulphide (MoS2) is an interesting material which exists in atomically thin multilayers and can be exfoliated into monolayer or a few layers for multiple applications. It has emerged as a promising material for development of such efficient sensors. Here, we have exfoliated and decorated MoS2 flakes with novel, single phase High Entropy Alloy (HEA) nanoparticles using facile and scalable cryomilling technique, followed by sonochemical method. It is found that the decoration of HEA nanoparticles impart surface enhanced Raman scattering effect and reduction in the work function of the material from 4.9 to 4.75 eV as measured by UV photoelectron spectroscopy. This change in the work function results in a schottky barrier between the gold contact and HEA decorated MoS2 flakes as a result of drastic changes in the surface chemical non-stoichiometry. The response to hydrogen gas is studied at temperatures 30 to 100 oC and it shows unusual p-type nature due to surface adsorbed oxygen species. The nanoscale junction formed between HEA and MoS2 shows 10 times increase in the response towards hydrogen gas at 80 oC. The experimental observations are further explained with DFT simulation showing more favourable hydrogen adsorption on HEA decorated MoS2 resulting for enhanced response.
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Submitted 6 February, 2020;
originally announced February 2020.
