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Showing 1–5 of 5 results for author: Hätinen, J

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  1. Efficient electronic cooling above 2 K by niobium-based superconducting tunnel junctions

    Authors: J. Hätinen, A. Ronzani, R. P. Loreto, E. Mykkänen, A. Kemppinen, K. Viisanen, T. Rantanen, J. Geisor, J. Lehtinen, M. Ribeiro, J-P. Kaikkonen, O. Prakash, V. Vesterinen, W. Förbom, E. T. Mannila, M. Kervinen, J. Govenius, M. Prunnila

    Abstract: Replacing the bulky cryoliquid-based cooling stages of cryoenabled instruments by chip-scale refrigeration is envisioned to disruptively reduce the system size similar to microprocessors did for computers. Electronic refrigerators based on superconducting tunnel junctions have been anticipated to provide a solution, but reaching the necessary above the 1-K operation temperature range has remained… ▽ More

    Submitted 13 December, 2024; v1 submitted 13 March, 2024; originally announced March 2024.

    Journal ref: Phys. Rev. Applied 22, 064048 (2024)

  2. arXiv:2303.01228  [pdf, ps, other

    physics.app-ph cond-mat.mes-hall cond-mat.supr-con

    Thermal resistance in superconducting flip-chip assemblies

    Authors: Joel Hätinen, Emma Mykkänen, Klaara Viisanen, Alberto Ronzani, Antti Kemppinen, Lassi Lehtisyrjä, Janne S. Lehtinen, Mika Prunnila

    Abstract: Cryogenic microsystems that utilize different 3D integration techniques are being actively developed, e.g., for the needs of quantum technologies. 3D integration can introduce opportunities and challenges to the thermal management of low temperature devices. In this work, we investigate sub-1 K inter-chip thermal resistance of a flip-chip bonded assembly, where two silicon chips are interconnected… ▽ More

    Submitted 10 October, 2023; v1 submitted 2 March, 2023; originally announced March 2023.

    Comments: 6 pages, 4 figures, 1 table

    Journal ref: Thermal resistance in superconducting flip-chip assemblies. Appl. Phys. Lett. 1 October 2023; 123 (15): 152202

  3. arXiv:2208.12131  [pdf

    cond-mat.mes-hall

    Scalable on-chip multiplexing of silicon single and double quantum dots

    Authors: Heorhii Bohuslavskyi, Alberto Ronzani, Joel Hätinen, Arto Rantala, Andrey Shchepetov, Panu Koppinen, Janne S. Lehtinen, Mika Prunnila

    Abstract: Owing to the maturity of complementary metal oxide semiconductor (CMOS) microelectronics, qubits realized with spins in silicon quantum dots (QDs) are considered among the most promising technologies for building scalable quantum computers. For this goal, ultra-low-power on-chip cryogenic CMOS (cryo-CMOS) electronics for control, read-out, and interfacing of the qubits is an important milestone. W… ▽ More

    Submitted 10 October, 2024; v1 submitted 25 August, 2022; originally announced August 2022.

    Comments: accepted manuscript; 5 figures, 18 supplementary figures, and 1 table in supplementary materials

    Journal ref: Communications Physics 7, 323 (2024)

  4. arXiv:2201.10425  [pdf, other

    quant-ph cond-mat.supr-con

    Qubit-compatible substrates with superconducting through-silicon vias

    Authors: K. Grigoras, N. Yurttagül, J. -P. Kaikkonen, E. T. Mannila, P. Eskelinen, D. P. Lozano, H. -X. Li, M. Rommel, D. Shiri, N. Tiencken, S. Simbierowicz, A. Ronzani, J. Hätinen, D. Datta, V. Vesterinen, L. Grönberg, J. Biznárová, A. Fadavi Roudsari, S. Kosen, A. Osman, M. Prunnila, J. Hassel, J. Bylander, J. Govenius

    Abstract: We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors. We measure internal quality factors of a million for test resonators excited at single-photon levels, on chips with superconducting vias used to stitch ground planes on the front and back sides of the chips. This resonator performance is on par with the state of the ar… ▽ More

    Submitted 8 November, 2022; v1 submitted 25 January, 2022; originally announced January 2022.

    Comments: Accepted version. 11 pages, 7 figures, 2 tables with appendices included

    Journal ref: IEEE Transactions on Quantum Engineering, vol. 3, pp. 1-10, 2022, Art no. 5100310

  5. arXiv:2009.14166  [pdf, other

    cond-mat.supr-con

    Cascaded superconducting junction refrigerators: optimization and performance limits

    Authors: A. Kemppinen, A. Ronzani, E. Mykkänen, J. Hätinen, J. S. Lehtinen, M. Prunnila

    Abstract: We demonstrate highly transparent silicon-vanadium and silicon-aluminum tunnel junctions with relatively low sub-gap leakage current and discuss how a trade-off typically encountered between transparency and leakage affects their refrigeration performance. We theoretically investigate cascaded superconducting tunnel junction refrigerators with two or more refrigeration stages. In particular, we de… ▽ More

    Submitted 5 August, 2021; v1 submitted 29 September, 2020; originally announced September 2020.

    Comments: 5 pages, 4 figures

    Journal ref: Appl. Phys. Lett. 119, 052603 (2021)